JPH0289878U - - Google Patents
Info
- Publication number
- JPH0289878U JPH0289878U JP16953888U JP16953888U JPH0289878U JP H0289878 U JPH0289878 U JP H0289878U JP 16953888 U JP16953888 U JP 16953888U JP 16953888 U JP16953888 U JP 16953888U JP H0289878 U JPH0289878 U JP H0289878U
- Authority
- JP
- Japan
- Prior art keywords
- pads
- pad
- substrate
- wiring pattern
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 239000011810 insulating material Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａ，ｂはそれぞれ本考案の一実施例を示
す平面図及び拡大断面図、第２図ａ，ｂはそれぞ
れ従来の印刷配線板の一例を示す平面図及び拡大
断面図、第３図は従来の印刷配線板の部品実装方
法を説明するための流れ図である。
１……基板、２……パツド、３……配線パター
ン、４，４Ａ……ソルダレージスト、４１，４１
Ａ……窓、Ｓ１〜Ｓ３……ステツプ。
1A and 1B are a plan view and an enlarged sectional view showing an embodiment of the present invention, FIGS. 2A and 2B are a plan view and an enlarged sectional view showing an example of a conventional printed wiring board, and FIG. 3 1 is a flowchart for explaining a conventional method for mounting components on a printed wiring board. 1... Board, 2... Pad, 3... Wiring pattern, 4, 4A... Solder resist, 41, 41
A...window, S1 to S3 ...step.
Claims (1)
面実装部品の端子と接続するための複数のパツド
と、これら各パツドと接続する配線パターンと、
前記各パツド上に、これら各パツド表面上の周辺
縁部を覆うと共にこれら各パツドの中央付近が露
出するように形成された窓を備え、かつ前記配線
パターンを含む前記基板上を覆うソルダレジスト
とを有することを特徴とする印刷配線板。 A substrate made of an insulating material, a plurality of pads formed on this substrate for connecting to terminals of surface mount components, and a wiring pattern connecting to each of these pads,
a window formed on each of the pads so as to cover the peripheral edge on the surface of each pad and to expose the vicinity of the center of each pad, and a solder resist that covers the substrate including the wiring pattern; A printed wiring board characterized by having.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16953888U JPH0289878U (en) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16953888U JPH0289878U (en) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289878U true JPH0289878U (en) | 1990-07-17 |
Family
ID=31459692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16953888U Pending JPH0289878U (en) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289878U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008004809A (en) * | 2006-06-23 | 2008-01-10 | Mitsubishi Electric Corp | Mounting board |
-
1988
- 1988-12-28 JP JP16953888U patent/JPH0289878U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008004809A (en) * | 2006-06-23 | 2008-01-10 | Mitsubishi Electric Corp | Mounting board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS62184775U (en) | ||
| JPH0289878U (en) | ||
| JPH0170383U (en) | ||
| JPS6112201U (en) | wiring circuit board | |
| JPS6338368U (en) | ||
| JPS58125373U (en) | printed wiring board | |
| JPH0213771U (en) | ||
| JPS62140775U (en) | ||
| JPS60124065U (en) | Resin paste printing mask | |
| JPS6249266U (en) | ||
| JPS63132475U (en) | ||
| JPH03117873U (en) | ||
| JPH0247086U (en) | ||
| JPH0262772U (en) | ||
| JPS60190070U (en) | Printed board | |
| JPS59123358U (en) | Printed wiring board base material | |
| JPH01104765U (en) | ||
| JPS60187560U (en) | Assembly structure of electronic circuit package | |
| JPS59138264U (en) | Wiring board equipment | |
| JPS6452274U (en) | ||
| JPH0262769U (en) | ||
| JPH0179868U (en) | ||
| JPS6448068U (en) | ||
| JPS5837177U (en) | Mounting structure of chip parts | |
| JPH01140880U (en) |