JPH0295248U - - Google Patents

Info

Publication number
JPH0295248U
JPH0295248U JP1989002181U JP218189U JPH0295248U JP H0295248 U JPH0295248 U JP H0295248U JP 1989002181 U JP1989002181 U JP 1989002181U JP 218189 U JP218189 U JP 218189U JP H0295248 U JPH0295248 U JP H0295248U
Authority
JP
Japan
Prior art keywords
integrated circuit
coolant
liquid
circuit device
bellows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989002181U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989002181U priority Critical patent/JPH0295248U/ja
Publication of JPH0295248U publication Critical patent/JPH0295248U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る液冷構造の一実施例を示
す断面図、第２図は本考案に係る液冷構造の他の
実施例を示す断面図。 １０…冷却液流路、１４…ベローズ、１８…集
積回路素子、２０…シート部材、２２…伝熱板、
２４…接合材、２６…ベローズ底面。 FIG. 1 is a sectional view showing one embodiment of the liquid cooling structure according to the present invention, and FIG. 2 is a sectional view showing another embodiment of the liquid cooling structure according to the present invention. DESCRIPTION OF SYMBOLS 10... Coolant flow path, 14... Bellows, 18... Integrated circuit element, 20... Sheet member, 22... Heat exchanger plate,
24... Bonding material, 26... Bellows bottom surface.

Claims (1)

【実用新案登録請求の範囲】 プリント基板１６上に実装された集積回路素子
１８の上面に冷却液１１を導いて前記集積回路素
子を液冷する集積回路素子の液冷構造であつて、 複数の集積回路素子の上部に冷却液を導く冷却
液流路１０と、 該冷却液流路の途中から前記集積回路素子の上
面へ冷却液を導くベローズ１４と、 該ベローズの底面２６に設けられ、良熱伝導性
材料から成る伝熱板２２と、 該伝熱板２２と前記ベローズの周辺部領域との
間隙を充填して接合する良熱伝導性材料から成る
接合材２４と、 を具備したことを特徴とする集積回路素子の液冷
構造。[Claims for Utility Model Registration] A liquid cooling structure for an integrated circuit device that liquid-cools the integrated circuit device by guiding a cooling liquid 11 to the upper surface of an integrated circuit device 18 mounted on a printed circuit board 16, comprising: A coolant flow path 10 that guides the coolant to the upper surface of the integrated circuit element; a bellows 14 that guides the coolant from the middle of the coolant flow path to the upper surface of the integrated circuit element; A heat exchanger plate 22 made of a thermally conductive material; and a bonding material 24 made of a highly thermally conductive material that fills a gap between the heat exchanger plate 22 and the peripheral region of the bellows to join them. Features a liquid cooling structure for integrated circuit elements.
JP1989002181U 1989-01-13 1989-01-13 Pending JPH0295248U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989002181U JPH0295248U (en) 1989-01-13 1989-01-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989002181U JPH0295248U (en) 1989-01-13 1989-01-13

Publications (1)

Publication Number Publication Date
JPH0295248U true JPH0295248U (en) 1990-07-30

Family

ID=31202731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989002181U Pending JPH0295248U (en) 1989-01-13 1989-01-13

Country Status (1)

Country Link
JP (1) JPH0295248U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016119451A (en) * 2014-10-14 2016-06-30 インテル・コーポレーション Automatic height compensating and co-planar leveling of heat removal assembly for multi-chip packages

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016119451A (en) * 2014-10-14 2016-06-30 インテル・コーポレーション Automatic height compensating and co-planar leveling of heat removal assembly for multi-chip packages
US9743558B2 (en) 2014-10-14 2017-08-22 Intel Corporation Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages

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