JPH03127521A - Radio receiver - Google Patents
Radio receiverInfo
- Publication number
- JPH03127521A JPH03127521A JP1266502A JP26650289A JPH03127521A JP H03127521 A JPH03127521 A JP H03127521A JP 1266502 A JP1266502 A JP 1266502A JP 26650289 A JP26650289 A JP 26650289A JP H03127521 A JPH03127521 A JP H03127521A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- components
- circuit board
- wireless
- ground plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
- Mobile Radio Communication Systems (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、選択呼出受信装置等に利用する無線受信機に
関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a radio receiver used in a selective call receiving device or the like.
従来の技術
一般に、９００ＭＨｚ帯の選択呼出受信装置では、小型
、高利得であるという理由により、第３図に示すような
マイクロストリップアンテナが使用されている。2. Description of the Related Art In general, a 900 MHz band selective calling receiver uses a microstrip antenna as shown in FIG. 3 because it is small and has high gain.
第３図において、このアンテナは、受信信号の波長に比
べて十分薄い厚さｔの誘電体板１の両面にそれぞれ導電
性の放射パッチ２とグランド板３が設けられ、内部がは
んだ付は等される多数のスルーホールの列を放射パッチ
２の一端に形成することにより、放射パッチ２とグラン
ド板３を電気的に接続する短絡辺４が形成されている。In FIG. 3, this antenna has a conductive radiation patch 2 and a ground plate 3 provided on both sides of a dielectric plate 1 having a thickness t which is sufficiently thin compared to the wavelength of the received signal, and the inside is soldered evenly. A short-circuit side 4 that electrically connects the radiation patch 2 and the ground plate 3 is formed by forming a row of many through holes at one end of the radiation patch 2.
ここで、短絡辺４からの放射パッチ２の長さＬは、誘電
体板１上の受信信号の波長のほぼ４分のｌになるように
設定され、グランド板３は、幅Ｗが放射パッチ２の幅と
同一となるように設定され、長さが放射パッチ２の長さ
Ｌより長くなるように設定される。Here, the length L of the radiation patch 2 from the short-circuit side 4 is set to be approximately 1/4 of the wavelength of the received signal on the dielectric plate 1, and the width W of the ground plate 3 is set to the radiation patch 2, and its length is set to be longer than the length L of the radiation patch 2.
５は、放射パッチ２の給電点高周波端子、６は、グラン
ド板３の給電点アース端子であり、給電点高周波端子５
、給電点アース端子６は、第３図（ｄ）に示すように、
無線回路を構成する部品Ｐが実装されたプリント基板８
とアンテナが多層になるように、コネクタ７を介してプ
リント基板８の導電パターン（図示省略）に接続される
。5 is a feed point high frequency terminal of the radiation patch 2; 6 is a feed point earth terminal of the ground plate 3;
, the feed point ground terminal 6 is as shown in FIG. 3(d),
Printed circuit board 8 on which components P constituting a wireless circuit are mounted
The antenna is connected to a conductive pattern (not shown) on a printed circuit board 8 via a connector 7 so that the antenna is multilayered.
プリント基板８の導電パターンはまた、無線回路を同様
に構成する他の部品Ｐが実装されたプリント基板９と多
層になるように、不図示のコネクタを介してプリント基
板９の導電パターンに接続され、したがって、無線受信
機の外形がほぼ直方体となる。The conductive pattern of the printed circuit board 8 is also connected to the conductive pattern of the printed circuit board 9 via a connector (not shown) so that the conductive pattern of the printed circuit board 8 is multilayered with the printed circuit board 9 on which other components P similarly constituting the wireless circuit are mounted. , Therefore, the external shape of the wireless receiver becomes approximately a rectangular parallelepiped.
ここで、プリント基板８．９に実装される部品１〕は、
無線受信機の厚さができるだけ薄くなるように配置され
、したがって、無線受信機の厚さは主に、各部品Ｐの高
さと配置位置に依存する。Here, the component 1] mounted on the printed circuit board 8.9 is
The thickness of the radio receiver is arranged to be as thin as possible, and therefore the thickness of the radio receiver mainly depends on the height and placement position of each component P.
発明が解決しようとする課題
しかしながら、従来の無線受信機では、利得向上のため
にマイクロストリップアンテナの厚さ（をある程度厚く
する必要があり、したがって、無線受信機を薄型化する
ことができないという問題点がある。Problems to be Solved by the Invention However, in conventional radio receivers, the thickness of the microstrip antenna needs to be increased to some extent in order to improve gain, and therefore, the problem is that the radio receiver cannot be made thinner. There is a point.
本発明は上記従来の問題点を解決するものであり、外形
を薄型化することができる無線受信機を提供することを
目的とする。The present invention is intended to solve the above-mentioned conventional problems, and aims to provide a wireless receiver that can be made thinner in appearance.
課題を解決するための手段
本発明は上記目的を達成するために、無線回路を構成す
る部品をマイクロストリップアンテナの一方の面に実装
したものである。Means for Solving the Problems In order to achieve the above object, the present invention includes components constituting a radio circuit mounted on one surface of a microstrip antenna.
本発明はまた、上記目的を達成するために、マイクロス
トリップアンテナの放射パンチを誘電体の一方の面に形
成し、グランド板を誘７Ｍ体の他方の面に形成するとと
もに、無線回路を構成する部品が一方の面に実装された
プリント基板の反対ｆｌｌ１１の面がクランド板に対向
するように、マイクロストリップアンテナとプリント基
板を積層したものである。In order to achieve the above object, the present invention also forms a radiation punch of a microstrip antenna on one surface of a dielectric material, forms a ground plate on the other surface of a dielectric material, and configures a radio circuit. A microstrip antenna and a printed circuit board are stacked such that the opposite surface of the printed circuit board with components mounted on one surface faces the ground plate.
作用
本発明は上記構成により、無線回路を構成する他の部品
が実装されるプリント基板の部品配置の自由度を向上し
たり、他のプリント基板の数を減少することができ、し
たがって、無線受信機の外形を薄型化することができる
。According to the above configuration, the present invention can improve the degree of freedom in arranging components on a printed circuit board on which other components constituting a wireless circuit are mounted, and reduce the number of other printed circuit boards. The external shape of the machine can be made thinner.
実施例
以下、図面を参照して本発明の詳細な説明する。第１図
（ａ）は、本発明に係る無線受信機の一実施例の要部を
示す平面図、第１図（ｂ）は、同側面断面図、第１図（
Ｃ）は、同背面図、第１図（ｄ）は、本発明に係る無線
受信機の一実施例の全体を示す側面図であり、第３図に
示す構成部材と同一の部材には同一の参照符号を附す。EXAMPLES Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1(a) is a plan view showing essential parts of an embodiment of a radio receiver according to the present invention, FIG. 1(b) is a side sectional view of the same, and FIG.
C) is a rear view of the same, and FIG. 1(d) is a side view showing the whole of one embodiment of the wireless receiver according to the present invention, and the same components as those shown in FIG. Attach the reference sign.
第１図において、従来例と同様に、受信信号の波長に比
べて十分薄い厚さｔの誘電体板１の両面にそれぞれ導電
性の放射パッチ２ａとグランド板３ａが設けられ、内部
がはんだ付は等される多数のスルーホールの列を放射パ
ッチ２ａの一端に形成することにより、放射パッチ２と
グランド板３ａを電気的に接続する短絡辺４が形成され
ている。In FIG. 1, as in the conventional example, a conductive radiation patch 2a and a ground plate 3a are provided on both sides of a dielectric plate 1 having a thickness t which is sufficiently thin compared to the wavelength of the received signal, and the inside is soldered. A short-circuit side 4 that electrically connects the radiation patch 2 and the ground plate 3a is formed by forming a row of a large number of through holes with equal pitches at one end of the radiation patch 2a.
グランド板３ａの略中央部は、第１図（ｂ）、（Ｃ）に
示すように、くり抜かれたかのように形成されておらず
、このグランド板３ａが形成されていない誘電体板１の
背面上には、無線回路を構成する部品Ｐが実装され、ま
た、無線回路の電源ライン１０や高周波信号ライン１１
が形成されている。As shown in FIGS. 1(b) and 1(C), the approximately central portion of the ground plate 3a is not hollowed out, and the rear surface of the dielectric plate 1 where the ground plate 3a is not formed. Components P constituting a wireless circuit are mounted on the top, and a power supply line 10 and a high frequency signal line 11 of the wireless circuit are mounted on the top.
is formed.
この部品Ｐにより構成される無線回路としては、受信ア
ンテナの後段となる例えばアンテナとのマツチング回路
や、高周波（ＲＦ）増幅回路を選択することができる。As the radio circuit constituted by this component P, for example, a matching circuit with an antenna or a radio frequency (RF) amplification circuit which is a stage subsequent to the receiving antenna can be selected.
尚、従来例と同様に、短絡辺４からの放射パッチ２ａの
長さＬは、誘電体板１上の受信信号の波長のほぼ４分の
１になるように設定され、グランド板３ａは、幅Ｗが放
射パッチ２ａの福と同一となるように設定され、長さが
放射パッチ２ａの長さＩ、より長くなるように設定され
るが、グランド板３ａが形成されない中央部の大きさは
、アンテナの特性を劣化させない程度に形成される。Note that, similarly to the conventional example, the length L of the radiation patch 2a from the short-circuit side 4 is set to be approximately one-fourth of the wavelength of the received signal on the dielectric plate 1, and the ground plate 3a is The width W is set to be the same as the width of the radiation patch 2a, and the length is set to be longer than the length I of the radiation patch 2a, but the size of the central part where the ground plate 3a is not formed is , is formed to the extent that it does not deteriorate the characteristics of the antenna.
５は、放射パッチ２の給電点高周波端子、６は、グラン
ド板３の給電点アース端子であり、給電点高周波端子５
は第１図（ｂ）に示すように、誘電体板１の背面上に形
成された無線回路の高周波信号ライン１１に接続され、
給電点アース端子６は、第１図（ｄ）に示すように、他
の無線回路を構成する部品Ｐが実装されたプリント基板
８ａとアンテナが多層になるように、コネクタ７ａを介
してプリント基板８の導電パターン（図示省略）に接続
される。誘電体板１の背面上に形成された無線回路の電
源ライン１０と高周波信号ライン１１は、コネクタ７ｂ
を介してプリント基板８ａの導電パターンに接続される
。5 is a feed point high frequency terminal of the radiation patch 2; 6 is a feed point earth terminal of the ground plate 3;
is connected to the high frequency signal line 11 of the wireless circuit formed on the back surface of the dielectric plate 1, as shown in FIG. 1(b),
As shown in FIG. 1(d), the feed point ground terminal 6 is connected to a printed circuit board via a connector 7a so that the antenna and the printed circuit board 8a on which components P constituting other wireless circuits are mounted are multilayered. 8 conductive pattern (not shown). The power line 10 and high frequency signal line 11 of the wireless circuit formed on the back surface of the dielectric plate 1 are connected to the connector 7b.
It is connected to the conductive pattern of the printed circuit board 8a via.
プリント基板８ａはまた、無線回路を同様に構成する他
の部品Ｐが実装されたプリント基板９ａと多層になるよ
うに、不図示のコネクタを介してプリント基板９ａの導
電パターンに接続される。The printed circuit board 8a is also connected to a conductive pattern of the printed circuit board 9a via a connector (not shown) so as to form a multilayer structure with a printed circuit board 9a on which other components P similarly constituting the wireless circuit are mounted.
したがって、上記実施例によれば、無線回路を構成する
部品Ｐを誘電体板１の背面上に実装するので、他のプリ
ント基板８ａ、９ａに実装される部品配置の自由度を向
上することができ、無線受信機を薄型化することができ
る。また、部品配置の自由度を向上することができるの
で、プリント基板８ａ、９ａの数を減少することも可能
となる。Therefore, according to the above embodiment, since the components P constituting the wireless circuit are mounted on the back surface of the dielectric board 1, the degree of freedom in arranging the components mounted on the other printed circuit boards 8a and 9a can be improved. This allows the wireless receiver to be made thinner. Furthermore, since the degree of freedom in arranging components can be improved, it is also possible to reduce the number of printed circuit boards 8a and 9a.
尚、上記実施例では、無線回路を構成する部品Ｐを誘電
体板１の背面上に実装したが、誘電体板１の表面上に実
装してもよい。In the above embodiment, the components P constituting the wireless circuit are mounted on the back surface of the dielectric board 1, but they may be mounted on the front surface of the dielectric board 1.
第２図は、本発明に係る無線受信機の第２の実施例を示
し、この実施例は、多層基板Ｂを用いてマイクロストリ
ップアンテナを構成するとともに、無線回路を構成する
部品Ｐを多層基板Ｂに実装したものである。FIG. 2 shows a second embodiment of the radio receiver according to the present invention. This is implemented in B.
第２図において、多層基板Ｂを構成する１つの基板が誘
電体板１ａとして用いられ、放射パッチ２ｂが誘電体板
１ａの表面に形成され、グランド板３ｂが放射パッチ２
ｂと平行になるように誘電体板１ａの背面に形成されて
いる。この場合にも同様に、放射パッチ２ｂとグランド
板３ｂの間の誘電体板］、ａの厚さｔは、受信信号の波
長に比べて十分薄く設定される。In FIG. 2, one substrate constituting the multilayer substrate B is used as the dielectric plate 1a, a radiation patch 2b is formed on the surface of the dielectric plate 1a, and a ground plate 3b is used as the radiation patch 2.
It is formed on the back surface of the dielectric plate 1a so as to be parallel to b. In this case as well, the thickness t of the dielectric plate [a] between the radiation patch 2b and the ground plate 3b is set to be sufficiently thin compared to the wavelength of the received signal.
プリント基板１ｂの一方の面全体には、第２図（ｂ）、
（ｃ）に示すように、無線回路を構成する部品Ｐが実装
されるとともに、電源ライン１０ｂと高周波信号ライン
ｌｌｂが形成され、プリント基板１ｂの他方の面がグラ
ンド板３ｂに対向するように、アンテナとプリント基板
１ｂが積層され、多層基板Ｂを構成している。The entire surface of one side of the printed circuit board 1b is shown in FIG. 2(b).
As shown in (c), the components P constituting the wireless circuit are mounted, the power supply line 10b and the high frequency signal line llb are formed, and the other surface of the printed circuit board 1b faces the ground plate 3b. The antenna and the printed circuit board 1b are stacked to form a multilayer board B.
給電点高周波端子５は第２図（ｂ）に示すように、プリ
ント基板１ｂの背面上に形成された無線回路の高周波信
号ライン１１に接続され、給電点アース端子６は、第２
図（ｄ）に示すように、他の無線回路を構成する部品Ｐ
が実装されたプリント基板８ｂとアンテナが多層になる
ように、コネクタ７ａを介してプリント基板８ｂの導ｉ
Ｊ ／＜ターン（図示省略）に接続される。プリント基
板１ｂの背面上に形成された無線回路の電源ライン１０
ｂと高周波信号ラインｌｌｂは、コネクタ７ｂを介して
プリント基板８ｂの導電パターンに接続される。As shown in FIG. 2(b), the feed point high frequency terminal 5 is connected to the high frequency signal line 11 of the wireless circuit formed on the back surface of the printed circuit board 1b, and the feed point ground terminal 6 is connected to the second
As shown in Figure (d), parts P that constitute other wireless circuits
The conductor i of the printed circuit board 8b is connected via the connector 7a so that the antenna and the printed circuit board 8b mounted with the antenna are multilayered.
Connected to J/< turn (not shown). Power supply line 10 of the wireless circuit formed on the back surface of the printed circuit board 1b
b and high frequency signal line llb are connected to a conductive pattern on a printed circuit board 8b via a connector 7b.
したがって、上記実施例では、多層基板Ｂの厚さが第１
の実施例のアンテナの厚さｔより厚くなるが、無線回路
を構成する部品Ｐが多層基板Ｂの背面全体に実装されて
いるので、他のプリント基板８ｂの数を減少することが
でき、したがって、第１の実施例に比べて無線受信機を
更に薄型化することができる。Therefore, in the above embodiment, the thickness of the multilayer substrate B is the first
Although it is thicker than the antenna thickness t in the embodiment, since the components P constituting the radio circuit are mounted on the entire back surface of the multilayer board B, the number of other printed circuit boards 8b can be reduced, and therefore , the wireless receiver can be further made thinner than the first embodiment.
また、上記実施例では、３層の多層基板Ｂを用いたが、
４層以上の基板を用いることにより、無線受信機を更に
薄型化することができる。In addition, in the above embodiment, a three-layer multilayer substrate B was used, but
By using a substrate with four or more layers, the wireless receiver can be made even thinner.
発明の詳細
な説明したように、本発明は、無線回路を構成する部品
をマイクロストリップアンテナの一方の面に実装したり
、また、マイクロストリップアンテナの放射パッチを誘
電体の一方の面に形成し、グランド板を誘電体の他方の
面に形成するとともに、無線回路を構成する部品が一方
の面に実装されたプリント基板の反対側の面がクランド
板に対向するように、マイクロストリップアンテナとプ
リント基板を積層したので、無線回路を構成する他の部
品が゛実装されるプリン！・基板の部品配置の自由度を
向上したり、他のプリ〉ト基板の数を減少することがで
き、したがって、無線受信機の外形を薄型化することが
できる。As described in detail, the present invention is capable of mounting components constituting a wireless circuit on one side of a microstrip antenna, and forming a radiation patch of a microstrip antenna on one side of a dielectric material. , a ground plate is formed on the other side of the dielectric material, and the microstrip antenna and the printed circuit board are mounted on one side of the printed circuit board with the components constituting the wireless circuit mounted so that the other side of the printed circuit board faces the ground plate. Since the boards are laminated, the other parts that make up the wireless circuit are mounted! - The degree of freedom in arranging components on the board can be improved, the number of other printed circuit boards can be reduced, and the external shape of the wireless receiver can therefore be made thinner.
第１図（ａ）は、本発明に係る無線受信機の一実施例の
要部を示す平面図、第１図（ｂ）は、同側面断面図、第
１図（ｃ）は、同背面図、第１図（ｄ）は、本発明に係
る無線受信機の一実施例の全体を示す側面図、第２図（
ａ）は、本発明に係る無線受信機の第２の実施例の要部
を示す平面図、第２図（ｂ）は、同側面断面図、第２図
（Ｃ）は、同背面図、第２図（ｄ）は、本発明に係る無
線受信機の第２の実施例の全体を示す側面図、第３図（
ａ）は、従来の無線受信機の要部を示す平面図、第３図
（ｂ）は、同側面断面図、第３図（ｃ）は、同背面図、
第３図（ｄ）は、従来の無線受信機の全体を示す側面図
である。
１．１ ａ −誘電体板、ｌｂ、８ａ、８ｂ、９ａ・・
・プリント基板、２ａ、２ｂ・・・放射パッチ、３ａ、
３ｂ・・・グランド板、Ｐ・・・部品、Ｂ・・・多層基
板。FIG. 1(a) is a plan view showing essential parts of an embodiment of the wireless receiver according to the present invention, FIG. 1(b) is a side sectional view of the same, and FIG. 1(c) is a rear view of the same. 1(d) are side views showing the entire embodiment of the wireless receiver according to the present invention, and FIG.
FIG. 2(b) is a side sectional view of the same, FIG. 2(C) is a rear view of the same, FIG. 2(d) is a side view showing the entire second embodiment of the wireless receiver according to the present invention, and FIG.
a) is a plan view showing the main parts of a conventional radio receiver, FIG. 3(b) is a side sectional view of the same, FIG. 3(c) is a rear view of the same,
FIG. 3(d) is a side view showing the entire conventional radio receiver. 1.1 a - dielectric plate, lb, 8a, 8b, 9a...
・Printed circuit board, 2a, 2b... Radiation patch, 3a,
3b...Ground plate, P...Components, B...Multilayer board.
Claims (2)
ンテナの一方の面に実装した無線受信機。(1) A wireless receiver in which the components that make up the wireless circuit are mounted on one side of a microstrip antenna.
体の一方の面に形成し、グランド板を誘電体の他方の面
に形成するとともに、無線回路を構成する部品が一方の
面に実装されたプリント基板の反対側の面が前記クラン
ド板に対向するように、マイクロストリップアンテナと
プリント基板を積層した無線受信機。(2) A printed circuit board on which the radiation patch of the microstrip antenna is formed on one side of the dielectric, the ground plate is formed on the other side of the dielectric, and the components constituting the wireless circuit are mounted on one side. A wireless receiver in which a microstrip antenna and a printed circuit board are stacked such that the opposite side faces the ground plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1266502A JPH03127521A (en) | 1989-10-13 | 1989-10-13 | Radio receiver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1266502A JPH03127521A (en) | 1989-10-13 | 1989-10-13 | Radio receiver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03127521A true JPH03127521A (en) | 1991-05-30 |
Family
ID=17431808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1266502A Pending JPH03127521A (en) | 1989-10-13 | 1989-10-13 | Radio receiver |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03127521A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299935A (en) * | 1992-02-04 | 1993-11-12 | Trimble Navigation Ltd | Microstrip antenna integrally provided with low-noise amplifier used for global positioning system(gps) receiver |
| JPH0661919A (en) * | 1992-08-04 | 1994-03-04 | Matsushita Electric Ind Co Ltd | Selective radio call receiver |
| JP2005012375A (en) * | 2003-06-17 | 2005-01-13 | Mitsumi Electric Co Ltd | Antenna device |
| KR100495209B1 (en) * | 2002-10-01 | 2005-06-14 | 삼성전기주식회사 | A single unit antenna rf module forbluetooth |
| WO2006098390A1 (en) * | 2005-03-15 | 2006-09-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device having the same |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63287103A (en) * | 1987-05-19 | 1988-11-24 | Matsushita Electric Works Ltd | Transmitter-receiver |
| JPS63287115A (en) * | 1987-05-19 | 1988-11-24 | Matsushita Electric Works Ltd | Radio equipment |
| JPS63287102A (en) * | 1987-05-19 | 1988-11-24 | Matsushita Electric Works Ltd | Transmitter-receiver |
| JPH01189207A (en) * | 1988-01-22 | 1989-07-28 | Sony Corp | Antenna system |
| JPH02113605A (en) * | 1988-10-21 | 1990-04-25 | Mitsubishi Electric Corp | Micro strip antenna |
| JPH02180404A (en) * | 1988-12-30 | 1990-07-13 | Nippon Mektron Ltd | Plane receiving antenna equipment |
| JPH02180405A (en) * | 1988-12-30 | 1990-07-13 | Nippon Mektron Ltd | Plane antenna board |
| JPH02214205A (en) * | 1989-02-14 | 1990-08-27 | Fujitsu Ltd | Electronic circuit device |
-
1989
- 1989-10-13 JP JP1266502A patent/JPH03127521A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63287103A (en) * | 1987-05-19 | 1988-11-24 | Matsushita Electric Works Ltd | Transmitter-receiver |
| JPS63287115A (en) * | 1987-05-19 | 1988-11-24 | Matsushita Electric Works Ltd | Radio equipment |
| JPS63287102A (en) * | 1987-05-19 | 1988-11-24 | Matsushita Electric Works Ltd | Transmitter-receiver |
| JPH01189207A (en) * | 1988-01-22 | 1989-07-28 | Sony Corp | Antenna system |
| JPH02113605A (en) * | 1988-10-21 | 1990-04-25 | Mitsubishi Electric Corp | Micro strip antenna |
| JPH02180404A (en) * | 1988-12-30 | 1990-07-13 | Nippon Mektron Ltd | Plane receiving antenna equipment |
| JPH02180405A (en) * | 1988-12-30 | 1990-07-13 | Nippon Mektron Ltd | Plane antenna board |
| JPH02214205A (en) * | 1989-02-14 | 1990-08-27 | Fujitsu Ltd | Electronic circuit device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299935A (en) * | 1992-02-04 | 1993-11-12 | Trimble Navigation Ltd | Microstrip antenna integrally provided with low-noise amplifier used for global positioning system(gps) receiver |
| JPH0661919A (en) * | 1992-08-04 | 1994-03-04 | Matsushita Electric Ind Co Ltd | Selective radio call receiver |
| KR100495209B1 (en) * | 2002-10-01 | 2005-06-14 | 삼성전기주식회사 | A single unit antenna rf module forbluetooth |
| JP2005012375A (en) * | 2003-06-17 | 2005-01-13 | Mitsumi Electric Co Ltd | Antenna device |
| WO2006098390A1 (en) * | 2005-03-15 | 2006-09-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device having the same |
| US8783577B2 (en) | 2005-03-15 | 2014-07-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device having the same |
| US10236271B2 (en) | 2005-03-15 | 2019-03-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device having the same |
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