JPH0314061U - - Google Patents
Info
- Publication number
- JPH0314061U JPH0314061U JP7336589U JP7336589U JPH0314061U JP H0314061 U JPH0314061 U JP H0314061U JP 7336589 U JP7336589 U JP 7336589U JP 7336589 U JP7336589 U JP 7336589U JP H0314061 U JPH0314061 U JP H0314061U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- nozzle
- solder
- side wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 8
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Description
第１図は本考案の噴流式半田付装置に使用する
噴流ノズルで、ゲート板を昇降可能とした実施例
の要部の斜視図、第２図は同上平面図、第３図は
湾曲板の着脱交換構造を示す要部の平面図、第４
図は反りのないプリント基板の半田付け時におけ
る半田流を示す要部の一部切欠側面図、第５図は
反りのあるプリント基板の半田付け時における半
田流を示す要部の一部切欠側面図、第６図はゲー
ト板を回動可能とした実施例で、反りのないプリ
ント基板の半田付け時における半田流を示す要部
の一部切欠側面図、第７図は反りのあるプリント
基板の半田付け時における半田流を示す要部の一
部切欠側面図である。
１……噴流ノズル、２……側板、３……プリン
ト基板、４……ノズル側壁、５……側壁、６……
戸溝、７……側板、８……ゲート板、９……案内
長孔、１０……ガイドピン、１１……ユニバーサ
ルジヨイント、１２……ロツド、１３……シリン
ダ。
Figure 1 is a perspective view of the main parts of the jet nozzle used in the jet soldering device of the present invention, in which the gate plate can be raised and lowered, Figure 2 is a plan view of the same, and Figure 3 is a curved plate. Plan view of main parts showing detachable and exchangeable structure, 4th
The figure is a partially cutaway side view of the main part showing the solder flow when soldering a printed circuit board without warpage, and Figure 5 is a partially cutaway side view of the main part showing the solder flow when soldering a warped printed circuit board. Figure 6 shows an embodiment in which the gate plate is rotatable, and a partially cutaway side view of the main part showing the solder flow when soldering a printed circuit board without warping, and Fig. 7 shows an example in which the gate plate is rotatable. FIG. 3 is a partially cutaway side view of the main part showing the solder flow during soldering. 1... Jet nozzle, 2... Side plate, 3... Printed circuit board, 4... Nozzle side wall, 5... Side wall, 6...
Door groove, 7... Side plate, 8... Gate plate, 9... Guide slot, 10... Guide pin, 11... Universal joint, 12... Rod, 13... Cylinder.
Claims (1)
プリント基板を進入側から進出側方向に向け上向
き傾斜搬送するとともに、上記半田噴流ノズルを
構成するプリント基板進入側のノズル側壁を、プ
リント基板の進出方向に向け凹状に湾曲形成し、
少なくとも、プリント基板の進入側に半田付け作
用をなす半田の流れをもつ噴流式半田付装置にお
いて、 上記凹状湾曲したプリント基板進入側のノズル
側壁前面部に、最高位が上記ノズル側壁の上端面
と略同高で、かつ、上下動調節可能な上端面をも
つゲート板を配設したことを特徴とする噴流式半
田付装置。[Scope of claim for utility model registration] Regarding the solder jetted from the solder jet nozzle,
The printed circuit board is conveyed upwardly from the entry side toward the exit side, and the nozzle side wall on the printed board entry side constituting the solder jet nozzle is curved in a concave shape toward the exit direction of the printed circuit board,
At least in a jet soldering device having a flow of solder that performs a soldering action on the entry side of a printed circuit board, the concavely curved front part of the nozzle side wall on the entry side of the printed circuit board is provided with the highest point being the upper end surface of the nozzle side wall. A jet soldering device characterized by having a gate plate having an upper end surface that is approximately the same height and that can be adjusted vertically.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7336589U JPH0314061U (en) | 1989-06-21 | 1989-06-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7336589U JPH0314061U (en) | 1989-06-21 | 1989-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0314061U true JPH0314061U (en) | 1991-02-13 |
Family
ID=31612123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7336589U Pending JPH0314061U (en) | 1989-06-21 | 1989-06-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0314061U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4846652U (en) * | 1971-10-02 | 1973-06-19 | ||
| JPS4992250U (en) * | 1972-11-29 | 1974-08-09 | ||
| JPS50130965U (en) * | 1974-04-10 | 1975-10-28 |
-
1989
- 1989-06-21 JP JP7336589U patent/JPH0314061U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4846652U (en) * | 1971-10-02 | 1973-06-19 | ||
| JPS4992250U (en) * | 1972-11-29 | 1974-08-09 | ||
| JPS50130965U (en) * | 1974-04-10 | 1975-10-28 |
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