JPH0317067U - - Google Patents
Info
- Publication number
- JPH0317067U JPH0317067U JP7720589U JP7720589U JPH0317067U JP H0317067 U JPH0317067 U JP H0317067U JP 7720589 U JP7720589 U JP 7720589U JP 7720589 U JP7720589 U JP 7720589U JP H0317067 U JPH0317067 U JP H0317067U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- electronic components
- sealing
- adhesive part
- supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図ａ，ｂは本考案の一実施例による電子部
品の供給テープの平面図、及び断面図、第２図ａ
，ｂは本考案の他の実施例による電子部品の供給
テープの平面図、及び断面図、第３図ａ，ｂは従
来の電子部品の供給テープの平面図、及び断面図
、第４図は本考案の第１の実施例による実験結果
を示す図、また第５図は本考案の第２の実施例に
よる実験結果を示す図である。
１……キヤリアテープ、２……トツプテープ、
３……粘着部、４……ミシン目状の孔、５……電
子部品、６……エンボス部、７……テープ送り用
の透孔、８……破線状の切り溝、９……熱圧着部
分。
Figures 1a and b are a plan view and a sectional view of an electronic component supply tape according to an embodiment of the present invention, and Figure 2a is a
, b are a plan view and a sectional view of an electronic component supply tape according to another embodiment of the present invention, FIGS. 3 a and b are a plan view and a sectional view of a conventional electronic component supply tape, and FIG. FIG. 5 is a diagram showing experimental results according to the first embodiment of the present invention, and FIG. 5 is a diagram showing experimental results according to the second embodiment of the present invention. 1...Carrier tape, 2...Top tape,
3... Adhesive part, 4... Perforated hole, 5... Electronic component, 6... Embossed part, 7... Through hole for tape feeding, 8... Broken line cut groove, 9... Heat Crimp part.
Claims (1)
送り用の透孔をそれぞれ等間隔に設けたキヤリア
テープと、該キヤリアテープの上面をシールする
トツプテープとからなる電子部品の供給テープに
おいて、前記トツプテープのシール部に粘着部を
備え、かつ該粘着部の内側に沿つてトツプテープ
剥し用の孔を備えることを特徴とする電子部品の
供給テープ。 A supply tape for electronic components comprising a carrier tape having embossed parts for inserting and fixing electronic components and through holes for tape feeding at equal intervals, and a top tape for sealing the top surface of the carrier tape, the sealing part of the top tape 1. A supply tape for electronic components, comprising an adhesive part and a hole for peeling off the top tape along the inside of the adhesive part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7720589U JPH0317067U (en) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7720589U JPH0317067U (en) | 1989-06-29 | 1989-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317067U true JPH0317067U (en) | 1991-02-20 |
Family
ID=31619374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7720589U Pending JPH0317067U (en) | 1989-06-29 | 1989-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317067U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5923799B2 (en) * | 1980-09-08 | 1984-06-05 | ユ−オ−ピ−・インコ−ポレイテツド | How to separate cane sugar from sugar mixture |
-
1989
- 1989-06-29 JP JP7720589U patent/JPH0317067U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5923799B2 (en) * | 1980-09-08 | 1984-06-05 | ユ−オ−ピ−・インコ−ポレイテツド | How to separate cane sugar from sugar mixture |