JPH0324364U - - Google Patents
Info
- Publication number
- JPH0324364U JPH0324364U JP8575289U JP8575289U JPH0324364U JP H0324364 U JPH0324364 U JP H0324364U JP 8575289 U JP8575289 U JP 8575289U JP 8575289 U JP8575289 U JP 8575289U JP H0324364 U JPH0324364 U JP H0324364U
- Authority
- JP
- Japan
- Prior art keywords
- zone
- reflow
- preheating zone
- board
- series
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007723 transport mechanism Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は対流循環加熱方式の予熱ゾーン、リフ
ローゾーンの基本的構造を示す一部切欠正面図、
第２図は同上要部の一部切欠正面図、第３図は吸
気筒の斜視図である。
１……プリント基板、２……搬送機構、３……
予熱ゾーン、４……リフローゾーン、５……加熱
ヒータ、６……ノズル部材、７……案内側壁、８
……対流路、９……フアン、１０……モータ、１
１……吸気筒、１１ａ……底部、１１ｂ……開口
、１２……案内筒、１３……締付けボルト。
Figure 1 is a partially cutaway front view showing the basic structure of the preheating zone and reflow zone of the convection circulation heating method.
FIG. 2 is a partially cutaway front view of the essential parts of the same, and FIG. 3 is a perspective view of the intake cylinder. 1... Printed circuit board, 2... Transport mechanism, 3...
Preheating zone, 4... Reflow zone, 5... Heater, 6... Nozzle member, 7... Guide side wall, 8
...Convection path, 9...Fan, 10...Motor, 1
1... Intake cylinder, 11a... Bottom, 11b... Opening, 12... Guide tube, 13... Tightening bolt.
Claims (1)
基板の搬送始端部から搬送終端部に向け、基板の
予熱ゾーン、リフローゾーン、冷却ゾーンを直列
に配設し、上記予熱ゾーン、リフローゾーンを、
加熱ヒータとフアンとの対流循環構造のしたリフ
ロー半田付装置において、 少なくとも、上記予熱ゾーンを構成する天井壁
一側に、下部一側方に開口を備えた吸気筒を昇降
可能に設けたことを特徴とするリフロー半田付装
置。[Scope of claim for utility model registration] Equipped with a transport mechanism for a board on which electronic components are mounted,
A preheating zone, a reflow zone, and a cooling zone for the substrate are arranged in series from the start end of the board to the end of the transport, and the preheating zone and reflow zone are arranged in series.
In a reflow soldering apparatus having a convection circulation structure between a heater and a fan, at least an intake cylinder with an opening on one side of the lower part is provided on one side of the ceiling wall constituting the preheating zone so as to be movable up and down. Characteristic reflow soldering equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8575289U JPH0324364U (en) | 1989-07-20 | 1989-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8575289U JPH0324364U (en) | 1989-07-20 | 1989-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0324364U true JPH0324364U (en) | 1991-03-13 |
Family
ID=31635043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8575289U Pending JPH0324364U (en) | 1989-07-20 | 1989-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0324364U (en) |
-
1989
- 1989-07-20 JP JP8575289U patent/JPH0324364U/ja active Pending
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