JPH0346248A - Probing device - Google Patents

Abstract

PURPOSE:To make it possible to execute easily the initial alignment of the probe of a probe card and the like by a method wherein a probing device is provided with an indirect mechanism having a fixable stopper and a vertically moving mechanism provided on the side of the point of this indirect mechanism. CONSTITUTION:An indirect mechanism 14 having a fixable stopper is provided at a position, where the side of the point of a supporting arm 13 is rotated at a prescribed angle in almost the center of the longitudinal direction of the supporting arm 13 provided rotatably on almost an vertically provided support pillar 11, add a microscope 12 is fixed on a point part 13a, which is provided with a vertically moving mechanism 15, of the arm 13 on the side of the point of this rotating mechanism. Accordingly, the microscope 12 can be fixed easily and reliably at a prescribed position, the effect of the vibrations of a measurement stage 6 and the like is reduced and the initial alignment of a probe 9 of a probe card 10 and the like can be easily executed.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a probe device.

(Prior Art) Generally, a large number of semiconductor devices are formed on a semiconductor wafer using precision photo transfer technology, etc., and then cut into individual semiconductor devices. It is used to inspect the electrical characteristics of semiconductor devices (in wafer state).

That is, the probe device holds a semiconductor wafer by suction on a measurement stage that is movable in, for example, The electrode pads of the semiconductor devices formed on the semiconductor device are brought into contact with each other one after another. Then, the electrical characteristics of the semiconductor device are tested using a tester electrically connected to the probe of the probe card.

In addition, in such a probe device, it is necessary to perform initial positioning (teaching) so that the numerous probes provided on the probe card can accurately contact the electrode pads of semiconductor devices formed on the semiconductor wafer. . However, such electrode pads are so small that it is difficult to visually observe them directly. Therefore, many probe devices are equipped with a microscope that can be placed above the holding mechanism.

(Problems to be Solved by the Invention) Recently, in the above-mentioned probe device, for example, a semiconductor wafer loader is provided in the center, and a holding mechanism for holding the probe card in a predetermined position, a measurement stage, etc. are each provided on each side of the loader. A probe device is also being considered in which a total of two probe devices are provided, each serving as a single loader. In such a probe device, the microscope can be moved to the top of two holding mechanisms using a rotatable support arm, etc., so that it can be used as one microscope, thereby reducing the manufacturing cost of the device. Conceivable.

However, in such a probe device having multiple measurement stages, for example, while initial alignment is being performed on one side, the measurement stage may be driven on the other side to perform measurement, and the drive of this measurement stage may be difficult. A problem arises in that the microscope vibrates due to vibrations caused by the above, and initial positioning etc. cannot be performed.

The present invention has been made in response to such conventional circumstances, and allows the microscope to be easily and securely fixed in a predetermined position, reduces the influence of vibrations of the measurement stage, etc., and allows the tip of the probe card to The present invention aims to provide a probe device that can easily perform initial positioning and the like.

[Structure of the Invention] (Means for Solving the Problem) That is, the present invention includes a plurality of holding mechanisms that hold a probe card having a large number of probes in a predetermined position, and a semiconductor wafer placed on the top surface. a plurality of measurement stages that bring the probe into contact with semiconductor devices formed on the semiconductor wafer by moving the probes; and a support arm configured to be rotatable around a support; and a microscope configured to be able to be placed above the plurality of holding mechanisms, wherein the support arm has a stopper that can be fixed at a position where the tip of the support arm is rotated by a predetermined angle in both left and right directions. It is characterized by comprising a joint mechanism and a vertical movement mechanism provided on the distal end side of the joint mechanism.

(Function) In the probe device of the present invention having the above configuration, the support arm is rotatably provided on a post provided approximately vertically, and the distal end side is rotated by a predetermined angle at approximately the center in the longitudinal direction. A microscope is fixed to the distal end of a support arm that has a joint mechanism with a stopper that can be fixed in position, and a vertical movement mechanism on the distal end side of this rotation mechanism.

Therefore, the microscope can be easily and securely fixed in a predetermined position, reducing the influence of vibrations of the measurement stage, etc.
Initial positioning of the probes of the probe card, etc. can be easily performed.

(Embodiment) An embodiment of the probe device of the present invention will be described below with reference to the drawings.

The probe device 1 is comprised of a loader part 2 provided at the center and measurement stage parts 3a and 3b provided on both sides of the rogue part 2.

As shown in FIG. 2, a semiconductor wafer 5 is suctioned and held on the upper surface of the housing 4 of the measurement stage sections 3a and 3b by, for example, a vacuum chuck. A measuring stage 6 is provided which is moved in the direction. In addition, a jig 8 is provided in a circular lower part provided at the center of the upper surface of the housing 4, and a large number of probes 9 are provided.
The probe card 10 on which the probe card 10 is implanted is fixed in a predetermined position, and the probes 9 of the probe card 10 can be electrically connected to a tester (not shown). Then, by moving the measurement stage 6 in the x-y-z directions, the electrode pads of the semiconductor devices formed on the semiconductor wafer 5 held on the upper surface of the probe 9 are sequentially brought into contact with each other. The device is configured to test electrical characteristics.

On the other hand, the loader part 2 loads and unloads semiconductor wafers 5 from a wafer cassette (not shown) configured to accommodate a plurality of semiconductor wafers 5 to and from the measurement stages 6 of the measurement stage parts 3a and 3b. Loader ~ (not shown)
is provided.

In addition, at the rear of this loader part 2, there is a column 1 extending vertically.
1 is provided, and this column 11 is provided with a support arm 13 for supporting a microscope 12.

This support arm 13 is configured to be rotatable around the support 11 on the measurement stage section 3a side and on the fixed stage section 3b, and has a predetermined angle (angle θ shown in FIG. 1) on both sides. A stopper mechanism (not shown) is provided to enable fixation in the rotated position. The support arm 13 is also provided with a stopper mechanism that fixes the support arm tip 13a at a position rotated by a predetermined angle (angle θ shown in FIG. 1) with respect to the support arm main body 13b (post 11 side). a joint mechanism 14 having the joint mechanism 1;
A vertical movement mechanism 15 for vertically moving the microscope VT12 is provided on the distal end side of the microscope VT12.

Note that the joint mechanism 14 is configured by, for example, as shown in FIG. 3, a shaft 16 provided at the tip end portion 13a of the support arm is pushed into a through hole 18 of the support arm main body portion 13b having a bearing 17 so as to be movable together. be able to. Further, the stopper mechanism can be configured by, for example, a stopper 20 biased by one coil spring, a circular hole 21 into which this stopper 20 can fit, and the like. In other words, the stopper 20 is normally in a contracted state, and the support arm tip 13a is rotatable around the shaft 16.
When the stopper 20 is located in the circular hole 21, the stopper 20 is fitted into the circular hole 21 by one coil spring, and the rotation of the support arm tip 13a is stopped.

In other words, klR@m12 is in a state where it can be used from the front side of the probe device 1 ( The microscope 12 is configured so that it can be placed above the probe card 10 of the measurement stage section 3a s 3b with the two eyepieces parallel to the front surface of the probe device 1. Then, the vertical position of the microscope 12 is adjusted by the vertical movement mechanism 15, and the probe card 10 of the measurement stage section 3as 3b is adjusted.
However, while visually observing the magnified image of this microscope 12,
The structure is such that adjustments such as initial alignment (teaching) between the electrode pads of the semiconductor devices formed on the semiconductor wafer 5 and the like can be performed.

That is, the probe device 1 of this embodiment includes a joint mechanism 14 having a stopper that can fix the support arm distal end 13a at a position rotated by a predetermined angle in both left and right directions, and an upper and lower joint provided on the distal end side of the joint mechanism 14. The support arm 13 equipped with the movement mechanism 15 allows the microscope 12 to be easily and reliably fixed on the probe card 10 of the measurement stage section 3a13b, reducing the influence of vibrations of the measurement stage 6, etc. Initial positioning of the ten probes 9, etc. can be easily performed.

[Effects of the Invention] As explained above, according to the probe device of the present invention,
The microscope can be easily and securely fixed in place,
By reducing the influence of vibrations of the a1+1 constant stage, etc., it is possible to easily perform initial positioning of the probes of the probe card.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the configuration of a probe device according to an embodiment of the present invention, FIG. 2 is a diagram showing a longitudinal section of the probe device in FIG. 1,
FIG. 3 is an enlarged cross-sectional view of a main part of the probe device shown in FIG. 1. 1... Probe device, 2... Loader part, 3a. 3b...Measurement stage section, 4...Housing, 5...Semiconductor wafer, 6...Measurement stage, 7...Opening, 8...Jig, 9
・・・・・・Probe, 10・・・Probe card,
11... Support, 12... Microscope, 13
...Support arm, 13a...Support arm tip, 13b...Support arm main body, 14
...Joint mechanism, 15...Vertical movement mechanism,
16...Shaft, 17...Bearing, 18...Through hole, 19...Coil spring, 20...Stopper 21...・・・
・Eye hole.

Claims (1)

[Claims] (1) A plurality of holding mechanisms that hold a probe card having a large number of probes in a predetermined position, and a semiconductor device formed on the semiconductor wafer by moving while holding a semiconductor wafer placed on the top surface. A microscope configured to include a plurality of measurement stages that bring probes into contact with each other, and a support arm that is configured to be rotatable about a support, and that can be placed on top of the plurality of holding mechanisms by rotation of the support arm. In the probe device, the support arm includes a joint mechanism having a stopper that can fix the distal end of the support arm at a position rotated by a predetermined angle in both left and right directions, and a vertically movable joint mechanism provided on the distal end side of the joint mechanism. A probe device comprising a mechanism.