JPH0351789B2 - - Google Patents

Info

Publication number
JPH0351789B2
JPH0351789B2 JP58128884A JP12888483A JPH0351789B2 JP H0351789 B2 JPH0351789 B2 JP H0351789B2 JP 58128884 A JP58128884 A JP 58128884A JP 12888483 A JP12888483 A JP 12888483A JP H0351789 B2 JPH0351789 B2 JP H0351789B2
Authority
JP
Japan
Prior art keywords
throttle valve
evaporation
vapor
strip
valves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58128884A
Other languages
Japanese (ja)
Other versions
JPS6021377A (en
Inventor
Takehiko Ito
Norio Tsukiji
Takuya Aiko
Toshiharu Kitsutaka
Heizaburo Furukawa
Mitsuo Kato
Tetsuyoshi Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Nippon Steel Nisshin Co Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Nisshin Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd, Nisshin Steel Co Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP12888483A priority Critical patent/JPS6021377A/en
Publication of JPS6021377A publication Critical patent/JPS6021377A/en
Publication of JPH0351789B2 publication Critical patent/JPH0351789B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Description

【発明の詳細な説明】 本発明は連続真空蒸着装置の改良に関する。よ
り詳細にいえば、その内部に蒸発槽を配置した真
空容器からなり、そのなかに鋼帯などの帯状金属
材料を通過させて真空蒸着を行なうための改良さ
れた装置を提供するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in continuous vacuum deposition equipment. More specifically, the present invention provides an improved apparatus for performing vacuum deposition by passing a strip-shaped metal material such as a steel strip through a vacuum container having an evaporation tank disposed therein.

従来この種の真空蒸着装置の代表的なものは、
概念図としての第1図に示されている。この装置
は帯状金属材料2が(紙面に垂直方向に)通過し
てゆくことのできる真空容器1とそのなかに配置
された蒸着材6の蒸発槽3からなつている。蒸発
槽3は加熱手段7で加熱される。通常蒸発槽の上
部は蒸気導路5となり、その終端は通過する帯状
金属に接近した位置で開口4となる。帯状金属材
料2が垂直に移動し、蒸気導路5がエルボー状に
90°湾曲して垂直に開口している形状のものもあ
り、また蒸発槽や蒸気導路の要所に断熱手段や加
熱手段を設けたものもある。
Conventionally, typical vacuum evaporation equipment of this type is:
This is shown in FIG. 1 as a conceptual diagram. This apparatus consists of a vacuum vessel 1 through which a strip of metal material 2 can pass (in a direction perpendicular to the plane of the drawing) and an evaporation tank 3 in which a vapor deposition material 6 is placed. Evaporation tank 3 is heated by heating means 7. Usually, the upper part of the evaporation tank becomes a steam guide path 5, and the end thereof becomes an opening 4 at a position close to the metal band passing through. The strip metal material 2 moves vertically, and the steam guide path 5 becomes an elbow shape.
Some have a 90° curve and open vertically, while others have insulation or heating means installed at important points in the evaporation tank or steam guide.

このような装置で製造される蒸着めつき材は、
蒸着膜の幅方向における厚さの分布は均一でな
く、また意図した付着分布を得ることができな
い。
Vapor-deposited plating materials manufactured with such equipment are
The thickness distribution of the deposited film in the width direction is not uniform, and the intended adhesion distribution cannot be obtained.

一般に、加熱される蒸着材より発生する蒸気は
それ自身の温度分布、従つて密度分布が不均一で
あり、また被蒸着基材の表面の温度分布も不均一
であるために、生成する蒸着皮膜の付着量分布を
一定にすることは困難である。均一な付着量、な
らびに意図する付着量分布を達成するためには、
発生した蒸気の密度分布を何らかの手段で制御す
る必要がある。
Generally, the vapor generated from the heated vapor deposition material has an uneven temperature distribution and therefore an uneven density distribution, and the temperature distribution on the surface of the substrate to be vapor deposited is also uneven, so the vapor deposited film that is generated is It is difficult to maintain a constant coating amount distribution. In order to achieve a uniform coating weight as well as the intended coating weight distribution,
It is necessary to control the density distribution of the generated steam by some means.

上記の欠点に対処するために、蒸発口4の部分
に開口部を有するマスクを挿入固定することが行
なわれているが、帯状の被蒸着基材の幅を変更す
る場合、また付着量を変更する場合には、開口部
の大きさと形状の異なるマスクと交換しなければ
ならず、この場合には操業の連続性が阻害され
る。
In order to deal with the above drawbacks, a mask having an opening is inserted and fixed in the evaporation port 4, but when changing the width of the strip-shaped substrate to be evaporated, or changing the amount of deposition. In this case, it is necessary to replace the mask with a mask having a different opening size and shape, and in this case, continuity of operations is disrupted.

種々の幅の被蒸着基材について、意図する付着
量分布を、操業の連続性を阻害することなく、自
由に達成することのできる装置は現在のところ知
られていない。
At present, there is no known device that can freely achieve the intended distribution of deposition amount on substrates of various widths without interfering with the continuity of operation.

本発明は上記の事情に鑑みてなされたもので、
その目的は、均一もしくは意図する被蒸着基材の
付着量分布を操業の連続性を阻害することなく達
成することで、その目的は前記の従来の真空蒸着
装置の蒸発口に至る導路に蒸気流の可変阻止手段
を設けて、絞り効果による密度の変更ならびに撹
拌による密度分布の均一化を実現することによつ
て達成される。
The present invention was made in view of the above circumstances, and
The purpose is to achieve uniformity or the intended distribution of the amount of deposition on the substrate to be deposited without interfering with the continuity of operation. This is achieved by providing a variable flow blocking means to change the density by a throttling effect and to equalize the density distribution by stirring.

即ち、本発明によれば、帯状の被蒸着基材が通
過する真空容器内に蒸着材を入れた蒸発槽を配置
した真空蒸着装置において、蒸着材の蒸気が被蒸
着基材の表面に到達する道路中に、複数個の絞り
弁を設けたことを特徴とする真空蒸着装置が提供
される。
That is, according to the present invention, in a vacuum evaporation apparatus in which an evaporation tank containing a evaporation material is arranged in a vacuum container through which a strip-shaped substrate to be evaporated passes, the vapor of the evaporation material reaches the surface of the substrate to be evaporated. A vacuum evaporation device characterized in that a plurality of throttle valves are provided in a road is provided.

本明細書において、使用される絞り弁という語
は蒸気導路の断面積を増減することのできる機構
を意味し観音開きの扉のような構造でもよいが、
長方形の回転板(以下スロツトル弁と称する)が
有利であり、一つまたは複数個設けられる。好ま
しい態様において、複数個の弁が上下に少なくと
も2段に配置され、必要により、上下の弁の回転
軸が直交する方向に配置される。
In this specification, the term throttle valve used means a mechanism that can increase or decrease the cross-sectional area of a steam guide path, and may have a structure like a double door.
Rectangular rotating plates (hereinafter referred to as throttle valves) are advantageous and are provided one or more times. In a preferred embodiment, a plurality of valves are arranged in at least two stages, one above the other, and, if necessary, the rotation axes of the upper and lower valves are arranged in a direction perpendicular to each other.

次に本発明を図面を参照してその好適実施態様
について説明する。
Next, preferred embodiments of the present invention will be described with reference to the drawings.

第2図は、本発明の一実施態様の概念を示す断
面図である。
FIG. 2 is a sectional view showing the concept of one embodiment of the present invention.

この装置の一般構造は先に第1図について説明
したところと同様である。
The general structure of this device is similar to that described above with respect to FIG.

本装置では蒸着材蒸気の導路5内に複数個のス
ロツトル弁8が1段設けられている。本装置でた
とえば、被蒸着基材の板幅中央部の蒸着材の付着
量が少ない場合には中央部のスロツトル弁の開度
を大きくし、蒸着材の通過量を多くすれば付着量
の均一化がはかられる。この場合、蒸気はスロツ
トル弁で反射されるために、当然、蒸気密度の均
一化効果もある。
In this apparatus, a plurality of throttle valves 8 are provided in one stage in the guide path 5 for the vapor deposition material. With this device, for example, if the amount of deposition material deposited at the center of the width of the substrate to be deposited is small, increase the opening degree of the throttle valve in the center and increase the amount of deposition material passing through to ensure a uniform deposition amount. change is being measured. In this case, since the steam is reflected by the throttle valve, it naturally has the effect of equalizing the steam density.

図では弁は左右対称均等に設けられているが、
特殊な蒸着材付着量の分布を意図するときは、非
対称、不均一に設けてもよい。
In the figure, the valves are placed symmetrically and evenly,
When a special distribution of the amount of deposited material is intended, it may be provided asymmetrically or non-uniformly.

第2図では4個のスロツトル弁8が1段に設け
られているが、この4個のスロツトル弁8の回転
軸は外部から操作でき、各スロツトル弁8の開度
を加減することによつて所望の付着量分布を得る
ことができる。複数の弁の開度の加減は経験的
に、また簡単な予備試験によつて決定できる。
In FIG. 2, four throttle valves 8 are provided in one stage, but the rotation shafts of these four throttle valves 8 can be operated from the outside, and by adjusting the opening degree of each throttle valve 8. A desired coating weight distribution can be obtained. The degree of opening of the plurality of valves can be determined empirically or by simple preliminary tests.

以上述べたスロツトル弁8の数は多いことが好
ましいが、蒸着材蒸気の導路5内の大きさの点か
ら、取付可能なスロツトル弁8の数にはおのずか
ら制約がある。このため、第3図の実施態様に示
すように、複数段のスロツトル弁8を設けること
が好ましい。
Although it is preferable to have a large number of throttle valves 8 as described above, the number of throttle valves 8 that can be attached is naturally limited due to the size of the vapor deposition material vapor guide path 5. For this reason, it is preferable to provide a multi-stage throttle valve 8, as shown in the embodiment shown in FIG.

第4図は本発明の別の実施態様の概念を示す断
面図である。
FIG. 4 is a sectional view showing the concept of another embodiment of the present invention.

この実施態様は、蒸発槽3の蒸気導路部5が
90°湾曲していて蒸発口4が垂直に開口しており、
帯状被蒸着基材2が垂直に通過する。
In this embodiment, the steam guide section 5 of the evaporation tank 3 is
It is curved 90° and the evaporator port 4 opens vertically.
A strip-shaped substrate 2 to be deposited passes vertically.

また、スロツトル弁8,9,10が3段に設け
られており、そのうち下流側2段の弁9,10
は、一部が図面の紙面に垂直の軸の回りに回転
し、一部が図面の紙面に平行の軸の回りに回転す
る。
Further, throttle valves 8, 9, and 10 are provided in three stages, of which the valves 9, 10 in two stages on the downstream side
rotates partly around an axis perpendicular to the plane of the drawing, and partly around an axis parallel to the plane of the drawing.

このような配置により、一層均一な、また一層
微妙な付着量分布を達成することができる。
Such an arrangement makes it possible to achieve a more uniform and finer coating weight distribution.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の真空蒸着装置の概念を示す断面
図である。第2図は本発明の一実施態様の概念を
示す断面図である。第3図は本発明の別の実施態
様の概念を示す断面図である。第4図は本発明の
さらに別の実施態様の概念を示す断面図である。 これらの図面において、1:真空容器、2:帯
状の被蒸着基材、3:蒸発槽、4:蒸発槽開口、
5:蒸気導路、8,9,10:絞り弁。
FIG. 1 is a sectional view showing the concept of a conventional vacuum evaporation apparatus. FIG. 2 is a sectional view showing the concept of one embodiment of the present invention. FIG. 3 is a sectional view showing the concept of another embodiment of the present invention. FIG. 4 is a sectional view showing the concept of yet another embodiment of the present invention. In these drawings, 1: vacuum vessel, 2: strip-shaped substrate to be evaporated, 3: evaporation tank, 4: evaporation tank opening,
5: Steam guide path, 8, 9, 10: Throttle valve.

Claims (1)

【特許請求の範囲】 1 帯状の被蒸着基材が通過する真空容器内に蒸
着材を入れた蒸発槽を配置した真空蒸着装置にお
いて、蒸着剤の蒸気が被蒸着基材の表面に到達す
る導路中に、複数個の絞り弁を設けたことを特徴
とする真空蒸着装置。 2 特許請求の範囲第1項に記載の装置であつ
て、絞り弁がスロツトル弁(回転板弁)であるこ
とを特徴とする装置。 3 特許請求の範囲第2項に記載の装置であつ
て、スロツトル弁を少なくとも2段に設けたこと
を特徴とする装置。 4 特許請求の範囲第3項に記載の装置であつ
て、スロツトル弁が2段に設けられ、上段のスロ
ツトル弁と下段のスロツトル弁の回転軸が直角を
なしていることを特徴とする装置。 5 特許請求の範囲第1ないし3項のいずれかの
項に記載の装置であつて、蒸気導が路90°曲げら
れ、帯状被蒸着基材が垂直に通過することを特徴
とする装置。
[Scope of Claims] 1. In a vacuum evaporation apparatus in which an evaporation tank containing a evaporation material is disposed in a vacuum container through which a strip-shaped substrate to be evaporated passes, there is a method for guiding the vapor of the evaporation agent to reach the surface of the substrate to be evaporated. A vacuum evaporation apparatus characterized in that a plurality of throttle valves are provided in the path. 2. The device according to claim 1, wherein the throttle valve is a throttle valve (rotary plate valve). 3. The device according to claim 2, characterized in that the throttle valve is provided in at least two stages. 4. The device according to claim 3, wherein the throttle valves are provided in two stages, and the rotation axes of the upper stage throttle valve and the lower stage throttle valve are perpendicular to each other. 5. The apparatus according to any one of claims 1 to 3, characterized in that the path of the vapor guide is bent by 90 degrees, and the strip-shaped substrate to be vapor-deposited passes vertically.
JP12888483A 1983-07-15 1983-07-15 Vacuum vapor deposition plating apparatus provided with deposited amount distribution controlling means Granted JPS6021377A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12888483A JPS6021377A (en) 1983-07-15 1983-07-15 Vacuum vapor deposition plating apparatus provided with deposited amount distribution controlling means

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12888483A JPS6021377A (en) 1983-07-15 1983-07-15 Vacuum vapor deposition plating apparatus provided with deposited amount distribution controlling means

Publications (2)

Publication Number Publication Date
JPS6021377A JPS6021377A (en) 1985-02-02
JPH0351789B2 true JPH0351789B2 (en) 1991-08-07

Family

ID=14995732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12888483A Granted JPS6021377A (en) 1983-07-15 1983-07-15 Vacuum vapor deposition plating apparatus provided with deposited amount distribution controlling means

Country Status (1)

Country Link
JP (1) JPS6021377A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6173875A (en) * 1984-09-17 1986-04-16 Mitsubishi Heavy Ind Ltd Vacuum depositing apparatus provided with plate for regulating width of path
JPH0696767B2 (en) * 1986-06-11 1994-11-30 住友重機械工業株式会社 Continuous vacuum deposition equipment

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5547871Y2 (en) * 1977-06-23 1980-11-10
DD160563A1 (en) * 1981-07-14 1983-09-14 Guenter Jaesch METHOD FOR OPERATING A ZINC EVAPORATOR AND EVAPORATOR

Also Published As

Publication number Publication date
JPS6021377A (en) 1985-02-02

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