JPH0356069Y2 - - Google Patents

Description

[Detailed description of the invention] (Field of industrial application) This invention relates to IC mounting for driving high-density multi-terminal display panels using a film carrier (also called a tape carrier), and provides a thinner display panel. It is something to do.

(Conventional technology) Conventionally, printed wiring boards (hereinafter referred to as PCD)
Dual-in-line packages (hereinafter referred to as DIP) and flat package packages (hereinafter referred to as FP) were soldered on the entire surface of copper-clad laminates called ``DIP''. inside this package
An IC chip was installed. In addition, display panels such as liquid crystal displays (hereinafter referred to as LCD), electroluminescent displays (hereinafter referred to as EL), and plasma displays (hereinafter referred to as PDP) are manufactured using flexible printed circuits (hereinafter referred to as EPC) such as heat seals or The joints were assembled by soldering.

(Problem that the invention attempts to solve) PCB is a relatively thick resin board of 1 to 2 mm.
Furthermore, since DIP and EP have a considerable volume, there is a limit to how thin the display panel can be made. Although the film carrier method has a high degree of integration and is advantageous for automation, the IC chip itself, which has a protective film, is not fully fixed to the display panel. Further, in the method of fixing the IC chip and the panel substrate using adhesive, it is difficult to accurately align the film carrier and the panel substrate.

(Means for Solving the Problem) The present invention solves the problem by soldering the soldered alignment marks of the film carrier on which the IC chip is inner-bonded and the alignment marks of the metalized panel board. This is a display panel with the rear fixed to the panel substrate.

(Function) The present invention provides 3 lines/mm in the manufacturing of display panels.
The above integration is possible, and the lead terminals from each electrode and the alignment mark can be bonded together at the same time, they are joined at a point including the alignment mark, and film tape can be used. There are many features that make it extremely easy to automate.

(Details of the idea) The present invention will be described in detail along with examples.

FIG. 1 shows an external lead 8 corresponding to a control signal line, an electrode lead 7 connected to a pixel electrode to be selected, and a terminal portion 6 of the external lead 8 arranged diagonally on a polyimide film 4, and alignment marks 10. 2 is a schematic diagram showing a part of the present invention in which the IC chip 5 of the driver is inner bonded in two places and the driver's IC chip 5 is bonded in the center. In this figure, the number of lead wires is small for the sake of explanation, but the actual number of lead wires is 100, and IC chips 5 are stacked using giant bonding. Moreover, IC chip 5 was protected with epoxy resin. Further, the terminal portion 6, the end portion of the electrode lead 7, and the alignment mark 10 were solder-plated.

FIG. 2 is a schematic diagram of one half of a liquid crystal display panel showing an implementation state of the present invention. A common electrode is formed on the display electrode plate 2, and each pixel electrode is patterned with a transparent electrode on the effective display surface 3 on the counter electrode plate 1, and a common electrode corresponding to the end 9 of the pixel electrode and a control signal line is formed. Lines 11, 12, 13, 14, 1
5, 16, 17, 18, and alignment marks 10 in the same pattern as the above alignment marks.
was metalized with a two-layer structure of Al and Ni. 1st
The film carrier explained in the figure was aligned using alignment marks, and the terminal portion 6, the end portion 9 of the electrode lead 7, and the alignment mark 10 were simultaneously subjected to gang bonding. As a result, the film carrier was bonded to the panel substrate using solder, and the display panel of the present invention could be created.

(Effects of the invention) In the present invention, both ends of the film carrier are soldered with terminals, etc., and the center part is soldered with an alignment mark, so that the film carrier for fixing can be firmly held and reliability is improved. Additionally, since soldering can be done in one step, processes using adhesives and the like are not required, improving productivity. Furthermore, high-density mounting, which is a feature of the film carrier method, and automation using the tape carrier became possible.

In the present invention, the solder material is coated by plating, but it can also be coated by dipping or printing. The metallization of the display electrode plate and counter electrode plate is made of Al/Ni, Cr/Ni, or Ni.
Plating with Au, Pd, Cu, etc. may be applied. Although the shape of the alignment mark is shown as a triangle in the embodiment, the shape is not particularly determined, such as a diamond, a circle, or a cross mark, and any pattern such as a pattern that is easy to automate or a pattern that is easy to inspect with good visibility may be used. There are no limitations on the number or position of marks either.

It is also possible to provide color by forming a color filter on one electrode plate.

Furthermore, when alignment marks are used for connection as in the present invention, alignment accuracy is good and failures such as short circuits are reduced.

[Brief explanation of drawings]

FIGS. 1 and 2 are schematic plan views showing the present invention. 1... Counter electrode plate, 2... Display electrode plate, 4...
Film, 5...IC chip, 6...Terminal section, 1
0...Alignment mark.

Claims (1)

[Scope of utility model registration request] A display panel in which the soldered alignment mark on a film carrier with an IC chip inner bonded to the alignment mark on a metalized panel board is connected by soldering.