JPH0380346B2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to a face down bonder.

In a semiconductor device, one of the structures for connecting the electrodes of a chip (circuit element) and external leads is as shown in FIG. So-called face-down bonding is known, which connects the wiring layer 4 of the wiring board 3 in an overlapping manner. A face down bonder is used for this bonding.

In the case of this face-down bonder, it is necessary to align the substrate pattern and the chip pattern. In this case, the alignment mechanism includes a method using an optical system using a half mirror (not shown);
There is also a method that utilizes image processing using two industrial television cameras (ITV), as shown in FIGS. 2a and 2b. In other words, the substrate 3 is placed on the table 5
At the same time, the chip 1 is placed on the transparent glass plate 6 with its pump electrode portion facing downward,
The pattern of the board 3 is photographed by the first ITV 7, and the pattern of the chip 1 is photographed by the second ITV 8, and through image processing, both patterns 12 and 13 are visually recognized on the monitor television 10 as shown in FIG. 2B.

After the chip pattern 13 or the substrate pattern 12 is positioned (overlaid) at the position of the drop point 11 of the support tool 9 which holds the chip 1 at the lower end by vacuum suction, the chip 1 is
The supporting tool 9 is moved onto the table 5, the chip 1 is superimposed on the substrate 3, and the respective connections are connected using heat. Further, alignment is performed by moving or rotating the support tool 9, the transparent glass plate 6, and the table 5 in the XY directions.

By the way, conventionally, this alignment procedure is as follows:
First, as shown in FIG. 3a, the support tool 9 is moved to face the transparent glass plate 6, and the second ITV is
8, the supporting tool tip image 11 is projected at the center of the screen of the monitor television 10. After that, the table 5 is controlled to move so that the first support tool tip image 11 is
The substrate patterns 12 projected on the monitor television 10 by the ITV 7 are superimposed and aligned. Next, as shown in FIG. 3b, after moving the support tool 9, the substrate pattern 12 and the second ITV 8 are removed.
The transparent glass plate 6 is moved and controlled to overlap and align the chip pattern 13 and the chip pattern 13 projected by the .

In this way, conventionally, a method has been used in which alignment is performed by sequentially changing the reference pattern. However, in this method, alignment is performed at least twice in one process, which is a major obstacle to improving efficiency and automating the work.

Therefore, an object of the present invention is to provide a face-down bonder having a structure that can improve work efficiency and is also suitable for automation.

In order to achieve such an object, the present invention has a structure in which a reference mark is arranged on an image or screen that can be visually confirmed, and images of each connected object and connected object are superimposed on this reference mark. The present invention, which is a bonder having a positioning mechanism, will be explained below with reference to Examples.

FIG. 4 shows a face-down bonder alignment mechanism according to an embodiment of the present invention. As shown in the figure, two parallel electronic lines 14 and two horizontal lines 14 are drawn on the screen of a monitor television 10, and a mark consisting of a rectangular frame is provided at the center of the screen. This square frame mark is set at the position of the supporting tool tip image and is used as a reference mark 15. In this alignment mechanism, alignment can be performed simply by moving the substrate pattern 12 and chip pattern 13 to the reference mark 15 and overlapping both patterns.

According to such an embodiment, the operation (operation) of moving the support tool during alignment is unnecessary, and the alignment work can be completed in one time. Therefore, workability is improved, and
Since the operation is simple, automation is also possible.
Note that the present invention is not limited to the above embodiments. For example, the eyepiece micro may be used as the reference mark. Further, the reference mark may have other shapes. Furthermore, it goes without saying that the connecting object and the connected object may be other than the substrate and the chip.

As described above, according to the present invention, opposing objects only need to be aligned once, and work efficiency can be improved. It also makes automation easier.

[Brief explanation of drawings]

Figure 1 is a front view showing the face down structure, Figures 2 a and b are schematic diagrams showing the alignment mechanism in a conventional face down bonder, and Figures 3 a and b are
FIG. 4 is a schematic diagram showing a conventional alignment method. FIG. 4 is a schematic diagram showing a face down bonder alignment method according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Chip, 2... Bump electrode, 3... Substrate, 4... Wiring layer, 5... Table, 6... Transparent glass, 7... First ITV (1), 8... Second
ITV (2), 9... Support tool, 10... Monitor TV, 11... Support tool tip image, 13... Chip pattern, 12... Board pattern, 14... Electronic line, 15... Reference mark.

Claims (1)

[Claims] 1. Simultaneously recognize the quantity patterns of the opposing connecting object and the connected object, aligning the connecting object and the connected object, and then superimposing both patterns, and then attempting to connect the connecting object and the connected object. In the face-down bonder, a monitor television is provided that can recognize both patterns at the same time, and by drawing two vertical and two horizontal electronic lines parallel to each other on the screen of the monitor television, a square is created in the center of the screen. A face-down bonder characterized in that a reference mark consisting of a frame is installed, and a connecting object and a connected object are aligned by aligning both patterns to the reference mark.