JPH04118910A - Manufacture of laminated chip inductor - Google Patents

Abstract

PURPOSE:To obtain a pattern of many kinds of through holes by one metal mold by a method wherein the metal mold used to make the through holes in a green sheet piece is dislocated selectively from the position of the green sheet. CONSTITUTION:For example, protrusions 10 formed so as to decide the position of a green sheet 1 to be arranged are formed on the main face of a pin-receiving metal mold 9 as shown in the figure; the green sheet piece 1 is moved right and left. Thereby, through holes 2 can be made in different positions in the green sheet 1. Positioning through holes 11 are made at four corners of the green sheet 1; a flat board is installed separatedly on the main face of the pin-receiving metal mold; positioning pins 12 which can be inserted into the holes in the green sheet are installed. The flat board can be moved right and left at prescribed intervals on the main face of the pin-receiving metal mold; holes are made in a type of green sheet in a state that the flat board has been moved to the left side; holes are made in another type of green sheet in a state that the flat board has been shifted to the right side. Thereby, the through holes 2 can be made in different positions in the green sheet by using the same pin metal mold.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing a multilayer chip inductor.

[Prior Art] A multilayer chip inductor is an integrated chip-shaped inductor in which a conductor forming a coil is built into a magnetic material or insulating ceramic.

A general method for manufacturing this multilayer chip inductor is as follows.

■Make a green sheet consisting of magnetic ceramic powder and organic binder.

(Drill a through hole in the designated position of the green sheet.)

■ Form a coil pattern on the green sheet using conductive paste.

2) Laminate the green sheets so that the coil patterns are connected between the layers through through holes, and heat and press them together to integrate them.

■The crimped laminate is cut, separated into chips, and fired.

■The product is made by baking external electrodes onto the fired chip.

Figure 2 shows the position of through hole 2 (a) when the coil pattern is 172 turns per layer of green sheet 1.
and (b) and the printed pattern of the conductor coil 3 (A
), (B), (C), and (D).

FIG. 3 is a perspective view showing a simple manufacturing process of a multilayer chip inductor using the green sheets shown in FIG.
Figure (a') shows the respective patterns of through holes 2 and conductor coils on the sheet, and the upper three layers and lower two layers of the laminated green sheet pieces have through holes and printing. It has not been.

Figures (b) to (e) respectively show a stack 4 of green sheets, a chip 5 cut from the stack, a fired chip 6, and a stacked chip inductor to which external electrodes 7 are attached.

Figure 4 shows the position of the through hole 2 (c) when the coil pattern is 3 haterns per layer of the green sheet 1;
(d), (e), (f) and printed patterns of conductor coil 3 (E), (F), (G), (H), (1), (J
) is a plan view showing the.

FIG. 5 is a perspective view showing a simple manufacturing process of a multilayer chip inductor using the green sheets shown in FIG.
Figure (a') shows the respective patterns of through holes 2 and conductor coils on the sheet;
As shown in the figure, the upper 3 layers and the lower 2 layers of the laminated green sheet pieces
The layers do not have through holes or printing, and the subsequent figures are the same as in FIG. 3.

[Problems to be Solved by the Invention] However, in the conventional manufacturing method of multilayer chip inductors, the mold needed to make a through hole in a green sheet is only 1/2 turn per layer of green sheet. 2 types, 4 in case of 8/4 turns per layer
There was a problem in that it was necessary to prepare different types of molds, and that an increase in manufacturing costs due to purchasing a large number of expensive molds was unavoidable.

Therefore, an object of the present invention is to provide a method for manufacturing a multilayer chip inductor that can contribute to reducing manufacturing costs by combining a plurality of molds, which are a factor in increasing manufacturing costs, into one.

c Means and operation for solving the problem In order to achieve the above object, the present inventors found that as a result of research to achieve the above object, the positions of through holes were lined up at equal intervals, and developed a method for opening through holes. The inventors have discovered that by relatively shifting the positions of the mold and the green sheet, a large number of required through-hole patterns can be obtained with one mold, and have arrived at the present invention.

Therefore, the present invention provides a green sheet in which through-holes are bored at predetermined positions in a green sheet mainly composed of magnetic material or insulating ceramic, and the conductive coil pattern formed on the green sheet is connected through the through-hole. In the manufacturing method of a multilayer chip inductor, which comprises stacking, thermocompressing and integrating, separating into chip shapes, and then baking external electrodes on the fired body, the method includes: a mold for punching the through hole; This invention provides a method for manufacturing a multilayer chip inductor, characterized in that green sheet pieces having different through-hole patterns are manufactured using one mold by relatively shifting the position of the green sheet pieces.

In the method of the present invention, by relatively shifting the positions of the mold for forming through holes in a green sheet piece and the green sheet, it is possible to obtain many types of through hole patterns with one mold.

FIG. 1 shows an example of an embodiment of the present invention, (
As shown in the plan view of (1) and the perspective view of (1') of the same figure, a punching bottle mold 8 in which bottles are planted at predetermined intervals on the main surface of a vertically movable flat plate, and a punching bottle mold 8 into which the bottles are fitted are shown. In the green sheet punching mold, the pin holder has a die 9 and a pin holder has an attachment hole 10 provided on the main surface of the die 9 to determine the position where the green sheet is placed. By providing the green sheet as shown in the figure and moving the green sheet piece from side to side, through holes can be punched at different positions on the green sheet. Naturally, the die of the pin receiver is provided with a hole into which the pin is inserted at a position corresponding to the position of the punched pin.

In addition, as seen in the plan view of FIG. 1 (2) and the side view of FIG. A positioning pin 12 that can be fitted into the hole of the green sheet is provided on the flat plate. The pin holder can move the flat plate by a predetermined distance left and right on the main surface of the mold, and some green sheets are punched with the flat plate moved to the left, and other green sheets are punched with the flat plate moved to the left. By drilling holes while moving to the right side, through holes can be drilled at different positions on the green sheet using the same pin mold.

Furthermore, as seen in the plan view of FIG. 1 (3) and the side view of FIG. The sheet piece 1 is supplied to a green sheet punching die while being attached to the frame 13. Therefore, in this embodiment, instead of inserting the through hole of the green sheet made of a flat plate with a pin into the positioning pin as explained in FIG. 1 (2), the hole is inserted into the positioning pin. Other than that, the process is carried out in the same manner as in the case of FIG. 1 (2).

In addition, the plan view of Fig. 1 (4), and (4a) and (4b)
) is shown in the side view of FIG. 1(2) and (
3) is a method of forming four different types of holes in the green sheet by moving the moving direction in the vertical direction and the horizontal direction.

The present invention will be further explained below with reference to Examples.

[Example 1 N containing Fe2O3, Zn0SNip, and CuO as main components]
A long green sheet with a thickness of 100 m was prepared using i-Zn-Cu ferrite powder and polyvinyl butyral as a binder by a doctor blade method. This was cut into a predetermined size to obtain a rectangular green sheet piece.

Set this rectangular green sheet piece in a punching mold,
A through hole was drilled in the designated position.

At this time, the relative positions of the mold and the green sheet piece are adjusted at two places on the left and right by the mounting pads 10, as shown in Figure 1 (1).
By using the position of , through-holes were drilled in two different positions. That is, green sheet pieces having two types of through-hole patterns shown in FIGS. 2(a) and 2(b) were obtained.

Next, conductive paste was printed on the green sheet pieces with the through-hole pattern in (a) above to obtain the green sheet pieces (A) and (C) shown in Figure 2, and the through-hole pattern in (b) was printed on the green sheet pieces. A conductive paste was printed on a piece of green sheet with a hole in it to obtain the green sheet piece shown in Figure (B), and a conductive paste was printed on a piece of green sheet without through holes to obtain the green sheet piece shown in Figure (D). A sheet piece was obtained.

Next, these green sheet pieces were stacked as shown in Figure 3(a), and heated at 100°C and 300kg/cm2
After thermocompression bonding was carried out to form a laminate as shown in FIG. 2(b), it was cut into individual chips using a cutting machine.

This was fired at 900° C. for 1 hour to obtain a chip-shaped sintered body. Furthermore, an external electrode containing Ag as a main component was coated on this sintered body and baked at 800° C. to obtain a multilayer chip inductor.

After obtaining a rectangular green sheet piece in the same manner as in Example 1, the relative positions of the mold and the green sheet piece were determined as shown in Figure 1 (
As shown in 2), positioning holes were made at predetermined positions on the green sheet, and through holes were made at two different positions by shifting the corresponding positions of the positioning pins on the mold. The specific two types of through-hole patterns were the same as in Example 1, and the subsequent operations were carried out in accordance with the procedure described in Example 1 to manufacture a multilayer chip inductor.

[Example 3] After obtaining a rectangular green sheet piece in the same manner as in Example 1, the relative positions of the mold and the green sheet piece were determined as shown in Figure 1 (
As shown in 3), a piece of green sheet was attached to a metal picture frame, and through holes were made in two different positions by shifting the positions of the positioning pins of the mold that corresponded to the positioning holes of the frame. The two specific through-hole patterns were the same as in Example 1, and the green sheet pieces were stacked after being taken out from the frame and punched into a rectangular shape using a separate die. Note that each step after lamination was performed in the same manner as in Example 1 to obtain a laminated chip inductor.

[Example 4] Under the same conditions and method as in Example 2, the positions of the positioning pins of the mold were shifted up and down and left and right as shown in Figure 1 (4). Green sheet pieces having four types of through hole patterns shown in (d), (e) and (f) were obtained.

Next, conductive paste was printed on the green sheet piece with the through-hole pattern shown in Figure 4 (C) to obtain the green sheet piece shown in Figure 4 (E), and in the same way, using the green sheet piece shown in Figure 4 (D). Using (F) and (e), (G) and (1), (to)
Green sheet pieces (H) and (J) were obtained using green sheet pieces without through holes.

Next, these green sheet pieces were laminated as shown in FIG. 5, and a laminated chip inductor was obtained in the same manner as in Example 1.

[Effects of the Invention] As explained above, by manufacturing a laminated inductor according to the method of the present invention, it is possible to reduce the number of molds that were previously required in multiple molds into one, thereby reducing the number of expensive molds. This has the effect of enabling cost reduction.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a method of positioning a green sheet piece and a mold employed in each embodiment of the manufacturing method of the present invention, and shows (1), (1'), (2), ( 2a), (3
) and (3a) both involve moving the relative position of the mold and the green sheet piece in the lateral direction, and both are shown in figure (1).
A plan view of the case in which the fitting is used, Figure (1') is a perspective view showing the punching pin mold and pin receiver when the fitting is used, and Figure (2) is a perspective view of the green sheet. A plan view and a side view when positioning holes are provided at the four corners of the piece, and (3) and (3a) are plan views and side views when positioning holes are provided at the four corners using a frame-like frame. FIG. Figure (4) is a plan view when the movement direction of figure (3) is moved both vertically and horizontally, and figure (4a)
, (4b) are both side views. Figure 2 shows through-hole patterns (A) and (B) and conductor coil printed patterns (A) and (B) when the coil pattern is 1/2 turn per green sheet layer.
), (C), and (D) are plan views. FIG. 3 is a perspective view showing a simple manufacturing process of a multilayer chip inductor using green sheets having the patterns shown in FIG. 2. FIG. Figure 4 shows through-hole patterns (c), (d), (e), (f) and conductor coil printed patterns (c) when the coil pattern is 3 ha turns per green sheet layer.
It is a top view which shows E), (F), (G), (H), (1), and (J). FIG. 5 is a perspective view showing a simple manufacturing process of a multilayer chip inductor using green sheets having the patterns shown in FIG. 4. FIG. Explanation of symbols 1...Green sheet piece 2...Through hole 3...Conductor coil 4...Laminated body 5...
... Chip 6 ... Fired body 7 ... External electrode 8 ... Punching pin mold 9 ... Pin receiver is mold lO ... Fitting 11 ... Positioning penetration Hole 12...Positioning pin 13...Picture frame method patent applicant Taiyo Yuden Co., Ltd. Agent Patent attorney Masahiko Maruoka 11...Only f9. 1 through hole 12, position down 0 in 13, a-tilt I large frame diagram, clean route h 2, through piece 3, conductor coil diagram, diagram 5, procedure amendment (method) 1 , Display of the case 1990 Patent Application No. 43776 Name of the invention Person who amends the manufacturing method of a multilayer chip inductor Relationship to the case

Claims (1)

[Claims] Through-holes are punched at predetermined positions in green sheets mainly made of magnetic material or insulating ceramics, and the green sheets are stacked so that the conductor coil pattern formed on the green sheets is connected through the through-holes, and then thermocompression bonded. In the manufacturing method of a multilayer chip inductor, which comprises integrating the multi-layered chip inductor, separating it into chip shapes, and then baking external electrodes on the fired body, two or more green sheets are placed in a mold for punching the through-holes. By providing fixing means that can be fixed at different relative positions of the mold and the green sheet piece, and by making it possible to fix the mold and the green sheet piece by shifting their positions relative to each other, greens with different through-hole patterns can be created with one mold. A method for manufacturing a multilayer chip inductor, which comprises manufacturing a sheet piece.