JPH0412683Y2 - - Google Patents

Description

[Detailed Description of the Invention] "Industrial Field of Application" This invention relates to a heat radiator used in various electronic devices, particularly to support heat-generating components and help dissipate heat.

"Prior Art" Figure 4 shows the structure of a conventional heatsink and its mounting state.

A conventional heat sink has a plurality of heat dissipation fins 2 projecting upward from the top surface of a bottom plate 1, and components 3 that generate heat, such as transistors, are attached to the outer surfaces of the heat dissipation fins at both ends. There is. If there are a large number of components that generate heat, the radiator is formed long and the components 3 are attached to the side walls of the radiator.

When the number of parts 3 that generate heat is even larger, a plurality of heat radiators are arranged in parallel, and the parts 3 are attached to each heat radiator and attached to the printed circuit board 4. That is, the bottom plate 1 constituting the heatsink is mounted on the printed circuit board 4 via the spacer 5, and the leads 3A of the component 3 are inserted into the component mounting hole of the printed circuit board 4, and soldered on the back side to be mounted. .

``Problem that the invention aims to solve'' In order to remove the mounted component 3 in a conventional heatsink, it is necessary to remove the screw 6 that attaches the component 3, but if the heatsink is placed close to each other, a tool such as a screwdriver can be removed. Since it is not possible to engage the screw 6 with the screw 6, the screw 6 cannot be removed. For this reason, part 3
To replace the radiator, first remove the entire heatsink from printed circuit board 4.
must be removed from the

However, in order to remove the heatsink from the printed circuit board 4, all the solder adhering to the lead 3A of the component 3 attached to the heatsink must be sucked off with a sucker to make it free, and the heatsink must be removed in that state. . This has the disadvantage that it takes time and effort.

In order to be able to replace parts individually without removing the heat sink from the printed circuit board 4, the heat sinks must be arranged at large intervals so that the screws 6 can be operated freely.

However, if the arrangement spacing of the heat sinks is increased in this way, the mounting density on the printed circuit board will be reduced, resulting in the disadvantage that the device will become larger.

The purpose of this invention is to provide a heat radiator having a structure in which only the parts can be freely replaced without removing the heat radiator from the printed circuit board even if the arrangement spacing between the heat radiators is small.

``Means for solving the problem'' In this invention, the cross section of the block formed of a good thermal conductor is approximately trapezoidal, the component mounting surface is formed on the upwardly sloping surface of the trapezoid, and the bottom surface of the trapezoid is A heat radiator is constructed by forming heat radiation fins projecting upward from the side or downward from the top surface side.

According to the configuration of this invention, since the surface inclined to the upper surface of the trapezoid is used as the component mounting surface, components can be mounted diagonally from above. Therefore, even if the heatsinks are arranged close to each other, only the components can be mounted individually on the heatsink.
Also, only the parts can be removed individually from the heat sink.

As a result, it is possible to easily replace parts, increase the mounting density of parts, and provide a device that is compact and easy to maintain.

``Example'' Figure 1 shows an example of this invention. 11 in the diagram
shows a block made of a good thermal conductor made of extruded aluminum, for example. The cross section of this block 11 is approximately trapezoidal, and the bottom surface 12 of the trapezoid is the mounting surface to the printed circuit board.
The side surfaces 13A and 13B adjacent to 2 are used as component mounting surfaces.

The component mounting surfaces 13A and 13B have trapezoidal shapes and are sloped surfaces facing upward, and component mounting holes 14 are formed at predetermined positions.

The embodiment shown in FIG. 1 shows a case where the heat dissipation fins 2 are formed upward from the bottom surface 12 side. However, the radiation fins 2 may be formed downward from the upper surface side as shown in FIG.

FIG. 2 shows a structure in which a heat sink according to this invention is mounted on a printed circuit board 4. The bottom surface of the heat sink is attached to the printed circuit board 4 via the spacer 5. A component 3 that generates heat, such as a power transistor, is mounted on the upwardly inclined component mounting surfaces 13A and 13B using screws 6.

The leads 3A of the component 3 are inserted into the holes of the printed circuit board 4, and are electrically connected to the wiring conductor with solder 8 on the opposite side.

As is clear from the mounting structure shown in FIG. 2, according to this invention, the component mounting surfaces 13A, 13B
Since it faces upward, a tool 9 such as a screwdriver can be inserted obliquely from above and engaged with the screw 6 as shown in the figure.

"Effects of the Invention" Therefore, according to this invention, even if the radiators are arranged close to each other on the printed circuit board 4, the adjacent radiators do not interfere with each other. As a result, the component 3 can be attached to and removed from the heat sink by itself.

Therefore, according to the heat sink of this invention, the mounting density of components can be increased, and the device can be made more compact. In addition, it is possible to provide a device that is small in size but whose parts can be easily replaced and which is easy to repair, and its effects are extremely large in practical use.

[Brief explanation of the drawing]

Fig. 1 is a perspective view for explaining an embodiment of the heatsink according to this invention, Fig. 2 is a side view for explaining the state in which the heatsink of this invention is mounted on a printed circuit board, and Fig. 3 is a side view for explaining the state in which the heatsink according to this invention is mounted on a printed circuit board. FIG. 4 is a perspective view for explaining another embodiment of the invention, and FIG. 4 is a side view for explaining the conventional technique. 3... Parts that generate heat, 4... Printed circuit board,
5... Spacer, 6... Screw, 11... Block, 12... Bottom surface, 13A, 13B... Parts mounting surface, 14... Parts mounting hole.

Claims (1)

[Claims for Utility Model Registration] A. The cross section of the block made of a good thermal conductor is approximately trapezoidal, and the component mounting surface is composed of an upwardly inclined surface of the trapezoid, and B. From the bottom side of the trapezoid. A radiator consisting of a radiator fin that protrudes upward or downward from the top side;