JPH04218284A - Ic socket - Google Patents

Abstract

PURPOSE:To improve the reliability of an IC socket for mounting a LAG-type IC package. CONSTITUTION:A groove 13 for allowing a slide is provided in a recess 11 in an IC socket main body 10 for storing a LAG-type IC package, and a lever 23 is provided at an upper cover 20 for covering the LAG-type IC package stored in the recess of the IC socket main body to press it. After the LAG-type IC package is connected with and fixed to the IC socket, the lever is pushed to let the IC package slide, contact surfaces of the socket and the package slide to each other to obtain a wiping effect, thereby a reliability of contact can be improved.

Description

[Detailed description of the invention]

[Purpose of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket for mounting a LAG type IC package on a board.

0002

2. Description of the Related Art Conventionally, LAG type IC packages have been mounted by simply pressing and fixing them onto the contact surface of an IC socket from above. Therefore, there were the following problems.

(1) Wiping effect (by cleaning the surface by rubbing the contact surface when connecting the connector,
Since it does not have the effect of increasing the reliability of contact, poor contact sometimes occurred.

(2) It was necessary to clean the contact surfaces between the socket and the package.

[0005]

[Problems to be Solved by the Invention] The present invention provides LAG type I
The objective of the present invention is to improve the reliability of an IC socket that mounts a C package.

[Configuration of the invention]

[0007]

[Means for Solving the Problems] The IC socket of the present invention has a concave portion on the upper surface for receiving a LAG type IC package, and a plurality of recesses corresponding to the plurality of connection pads arranged on the lower surface of the IC package. A contact pin is implanted with its head exposed on the bottom surface of the recess and penetrates the bottom member, and further, one side edge of the IC package is installed at the bottom of one side wall of the recess by a slight length from the end. A groove into which the groove can be inserted is formed, and the side wall of the recess opposite to the side wall with this groove is cut out over a required length to form a notch whose bottom is lower than the bottom surface of the recess, and the outside of the recess is further formed. an IC socket body having a plurality of fixing holes in the IC socket body, and the LAG type IC package which is plate-shaped and overlaps the IC socket body and fits into the recess of the IC socket body and is stored in the recess on the lower surface thereof. It has a convex portion with a height that contacts the upper surface, and has a notch portion that opens outward corresponding to the planar shape of the notch portion at a portion opposite to the notch portion of the IC socket body, and has a notch portion opposite to the notch portion. The intersection part of the angle member is pivoted on a shaft passed between the surrounding walls, and the downward facing side is a LAG whose tip is stored in the recess.
A lever with a length that can come into contact with the outer periphery of the shaped package.
and an upper cover having a plurality of fixing holes corresponding to the fixing holes of the IC socket main body.

[0008]

[Operation] In the IC socket of the present invention, the LAG type IC package can be slid by pressing the lever after fixing it with the top cover. During this sliding, the contact surfaces between the connection pads of the IC package and the heads of the contact pins of the IC socket rub, producing a wiping effect. Therefore, even if there is dirt on the surface, it can be cleaned.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be explained in detail below based on embodiments shown in the drawings.

As shown in FIGS. 1 and 2, the IC socket main body 10 is provided with a recess 11 on the upper surface for receiving the LAG type IC package 30, and a plurality of recesses 11 are arranged on the lower surface of the LAG type IC package 30. A plurality of contact pins 12 respectively connected to the connection pads 31 are exposed at the bottom of the recess 11 and are implanted through the bottom member. Further, a groove 13 is formed in the lower part of one side wall of the recess 11 of the IC socket main body 10, into which one side edge of the IC package 30 can be inserted by a length approximately equal to the head diameter of the contact pin 12. A side wall of the recess facing the side wall 13 is cut out over a required length to form a notch 14 whose bottom is lower than the bottom of the recess 11. Furthermore, fixing holes 15 are provided at four outer corners of the recess 11 of the IC socket body 10.

As shown in FIGS. 1 and 3, the upper cover 20 has a plate shape that overlaps the IC socket main body 10, and has a lower surface that fits into the recess 11 of the IC socket main body 10.
It has a convex portion 21 having a height that comes into contact with the upper surface of the LAG type IC package 30 stored in the IC socket body 10, and a notch portion 14 at a portion opposite to the notch portion 14 of the IC socket body 10.
A notch 22 is provided which opens outward corresponding to the planar shape of the lever 23, and the intersection part of the angle member is pivotally supported by a shaft extending between the opposing circumferential walls of the notch 22. is installed. The side facing down of this lever 23 is
The tip has a length that allows it to come into contact with the outer periphery of the LAG type IC package 30 stored in the recess 11 of the IC socket main body 10, and the upwardly facing side has a length that can be pressed by hand. This upper cover 20 also has a fixing hole 15 in the IC socket body 10.
It has a plurality of fixing holes 24 corresponding to.

The IC socket according to one embodiment of the present invention configured as described above has a printed circuit board 50 as shown in FIG.
In the recess 11 of the IC socket body 10, the contact pin 12 is connected to the pattern at a predetermined position.
The LAG type IC package 30 is stored so that its connection pad 31 and contact pin 12 are in contact with each other, and the top cover 20 is placed over it by fitting the convex part 21 into the concave part 11, and the fixing screw 40 is tightened. It is passed through each of the fixing holes 24, 15 and the hole of the board 50, and then screwed in with a nut 41 to fix it. Then, by pushing the upward side of the lever 23, the downward side of the lever 23 pushes the side edge of the LAG type IC package 30, and the other side edge enters the groove 13. The LAG type IC package 30 slides. When sliding this, the connection pad 31 of the IC package 30
The contact surface between the head of the contact pin 12 of the IC socket body 10 rubs, and a wiping effect is obtained, increasing the reliability of the contact. This has the advantage of the LGA type IC package that no leads are required, and that the LGA type IC package has the advantage of being easy to attach and detach the IC, and has no solder bridges because it does not require soldering.
It is possible to take advantage of the advantages of sockets for type IC packages. In addition, wiping allows cleaning of any dirt on the contact surface, making it easier to handle the contact surface.

[0013]

[Effects of the Invention] As detailed above, according to the present invention, L
A groove is provided in the recess of the IC socket body that stores the AG type IC package to allow sliding, and a lever is provided on the upper lid that covers and presses the LGA type IC package stored in the recess of the IC socket body from above. By realizing an IC socket like this, after connecting and fixing the LAG type IC package to the IC socket, press the lever to connect the LAG type IC package to the IC socket.
The G-type IC package can be slid, and the contact surfaces between the socket and the package rub against each other, creating a wiping effect and increasing contact reliability. This allows the Lee
The advantage of the LAG type IC package is that no code is required,
It is possible to take advantage of the advantages of LAG type IC sockets, such as easy attachment and detachment of ICs, no solder bridges, and no solder required. In addition, wiping allows cleaning of any dirt on the contact surface, making it easier to handle the contact surface.

[Brief explanation of the drawing]

FIG. 1 is an exploded sectional view showing an IC socket according to an embodiment of the present invention.

FIG. 2 is a plan view of the IC socket main body of FIG. 1;

FIG. 3 is an external perspective view of the upper lid of FIG. 1;

[Explanation of symbols]

10...IC socket body 11... recess 12...Contact pin 13...Groove 14...Notch 20...Top lid 21...Protrusion 22...Notch 23...Lever 30...LAG type IC package 31...Connection pad

Claims (1)

[Claims] 1. A recessed portion for receiving a LAG (Land Grid Array) type IC package to be connected is provided on the upper surface, and a plurality of contacts corresponding to the plurality of connection pads arranged on the lower surface of the IC package. A pin is implanted with its head exposed at the bottom surface of the recess and penetrates through the bottom member, and the pin is embedded in the lower part of one side wall of the recess.
A groove is formed into which one side edge of the C package can fit a short length from the end, and the side wall of the recess opposite to the side wall with this groove is cut out over the required length so that the bottom is lower than the bottom of the recess. an IC socket body formed in a notch portion formed in the recessed portion and further having a plurality of fixing holes on the outside of the recessed portion; It also has a convex portion high enough to come into contact with the upper surface of the LAG type IC package stored in the recessed portion, and an outer portion corresponding to the planar shape of the notch portion at a portion facing the notch portion of the IC socket body. The intersection part of the angle material body is pivotally supported by a shaft extending between opposing peripheral walls of this notch part, and the tip of the downwardly facing side is stored in the recessed part. L
A lever is provided with a length that can come into contact with the outer periphery of the AG type IC package, and further includes an upper lid having a plurality of fixing holes corresponding to the fixing holes of the IC socket body. IC socket.