JPH0423127U - - Google Patents
Info
- Publication number
- JPH0423127U JPH0423127U JP1990063330U JP6333090U JPH0423127U JP H0423127 U JPH0423127 U JP H0423127U JP 1990063330 U JP1990063330 U JP 1990063330U JP 6333090 U JP6333090 U JP 6333090U JP H0423127 U JPH0423127 U JP H0423127U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- view
- lead frame
- plan
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第1図は本考案に係るリードフレームの一実施
例を示した平面図、第2図は同リードフレームに
チツプ部品を形成した後、その一方のリード端子
を切断した状態を例示した平面図、第3図は本考
案の変形実施例を示した平面図、第4図は第3図
の−線に沿つた拡大断面図、第5図は従来例
に係る第6図の−線に沿つた断面図、第6図
は従来のフレームを示した平面図、第7図は従来
のフレームによる片持ち状態を説明するための平
面図である。
図中、1はコンデンサ素子、2,10はリード
フレーム、3a,3bは側板、4はタイバー、5
aは陽極リード線、5bは陰極リード線、5cは
根元部分、6は樹脂外装体、11,12は根元部
分、13はリブである。
FIG. 1 is a plan view showing an embodiment of a lead frame according to the present invention, and FIG. 2 is a plan view illustrating a state in which one lead terminal is cut after forming a chip component on the lead frame. Fig. 3 is a plan view showing a modified embodiment of the present invention, Fig. 4 is an enlarged sectional view taken along the - line in Fig. 3, and Fig. 5 is a plan view showing a conventional example taken along the - line in Fig. 6. A sectional view, FIG. 6 is a plan view showing a conventional frame, and FIG. 7 is a plan view for explaining a cantilevered state by the conventional frame. In the figure, 1 is a capacitor element, 2 and 10 are lead frames, 3a and 3b are side plates, 4 is a tie bar, and 5
Reference character a is an anode lead wire, 5b is a cathode lead wire, 5c is a root portion, 6 is a resin exterior body, 11 and 12 are root portions, and 13 is a rib.
Claims (1)
バーを梯子状に形成するとともに、各側板の内側
縁に陽極リード端子と陰極リード端子とを対向す
るように連設してなるリードフレームにおいて、
少なくとも上記一方のリード端子の根元側を幅広
く形成したことを特徴とするリードフレーム。 A lead frame in which a plurality of tie bars are formed in a ladder shape between a pair of side plates extending parallel to each other, and an anode lead terminal and a cathode lead terminal are arranged facing each other on the inner edge of each side plate,
A lead frame characterized in that a base side of at least one of the lead terminals is formed wide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990063330U JPH087618Y2 (en) | 1990-06-15 | 1990-06-15 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990063330U JPH087618Y2 (en) | 1990-06-15 | 1990-06-15 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0423127U true JPH0423127U (en) | 1992-02-26 |
| JPH087618Y2 JPH087618Y2 (en) | 1996-03-04 |
Family
ID=31593279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990063330U Expired - Lifetime JPH087618Y2 (en) | 1990-06-15 | 1990-06-15 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087618Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0640114U (en) * | 1992-10-30 | 1994-05-27 | 大松 敏一 | Expansion joints |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62162322A (en) * | 1986-01-13 | 1987-07-18 | アルプス電気株式会社 | Manufacture of electronic parts for network |
| JPS62135445U (en) * | 1986-02-19 | 1987-08-26 |
-
1990
- 1990-06-15 JP JP1990063330U patent/JPH087618Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62162322A (en) * | 1986-01-13 | 1987-07-18 | アルプス電気株式会社 | Manufacture of electronic parts for network |
| JPS62135445U (en) * | 1986-02-19 | 1987-08-26 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0640114U (en) * | 1992-10-30 | 1994-05-27 | 大松 敏一 | Expansion joints |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH087618Y2 (en) | 1996-03-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2777512B2 (en) | Structure of molded solid electrolytic capacitor | |
| JPH0423127U (en) | ||
| JPH0423128U (en) | ||
| JPS62104435U (en) | ||
| JPH0423129U (en) | ||
| JPH01123328U (en) | ||
| JPS63201342U (en) | ||
| JPH044733U (en) | ||
| JPH0316322U (en) | ||
| JPS6115728U (en) | Tab terminal manufacturing equipment for electrolytic capacitors | |
| JPH0338646U (en) | ||
| JPS62163963U (en) | ||
| JPH0282046U (en) | ||
| JPS63191649U (en) | ||
| JPS6422043U (en) | ||
| JPH0432540U (en) | ||
| JPH0444134U (en) | ||
| JPS62114435U (en) | ||
| JPH0245625U (en) | ||
| JPS6138928U (en) | lead frame | |
| JPH03117845U (en) | ||
| JPH0429232U (en) | ||
| JPH03110841U (en) | ||
| JPS61106044U (en) | ||
| JPH0482801U (en) |