JPH0423831B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention has at least one collecting passage for supplying a cooling liquid, the collecting passage is connected to a plurality of cooling slits, and the cooling The present invention relates to a liquid cooling body for liquid cooling of power semiconductor components, in which slits are formed in at least one flat semiconductor mounting surface, and the cooling body further has liquid outlet holes opening on the edge side of the cooling body.

BACKGROUND OF THE INVENTION A cooling body of the above-mentioned type is known from DE 24 02 606 A1.
Here, a cooling body for semiconductors of various shapes is shown, in which the cooling liquid passes through a large-diameter axial hole and through a narrow connecting channel into a waffle-shaped recess. This waffle-shaped cutout extends to the bottom of the connection of the semiconductor component, thereby allowing direct cooling of the semiconductor component. From here the cooling liquid flows radially outwards through the edge annular passages and outlet holes into the chamber surrounding the cooling body.

OBJECT OF THE INVENTION An object of the invention is to improve the cooling effect of the coolant in a configuration as simple as possible.

Means for solving the problem A means for solving the above-mentioned problem is that the cooling body has a cooling member on the edge side.

In an advantageous embodiment of the invention, the heat exchange surface is widened at the outer periphery of the cooling body by forming the cooling element in the form of cooling ribs, cooling pins, etc. Significantly more heat is removed per hour than a cooling body without.

An advantageous embodiment of the invention improves the cooling effect by a targeted and enhanced flow around the cooling ribs of the cooling body. In this case, the cooling liquid flows in the connection direction from the cooling slot into the surrounding chamber and in this case removes additional heat from the cooling body. As a result, the thermal resistance during oil cooling is reduced because not only does it not have cooling ribs or pins and the cooling effect flowing around it is not strengthened, but only the semiconductor mounting surface is affected by the cooling liquid. This is reduced to 1/3 compared to a cooling body that is not cooled by heat.

It is advantageous for the cooling slits to have a rectangular shape, which simplifies the manufacturing technology considerably. According to further advantageous embodiments, the cooling slits can be designed triangular, semicircular or trapezoidal.

In short, the shape of the cooling slits can be adapted arbitrarily to the respective requirements.

If the cooling slits are displaced from their parallel mutual position,
For example, in the case of a radial arrangement, it is advantageous if the cooling slots have the form of a meandering line or an elongated line. A radial arrangement of the cooling slots is suitable if the cooling body is cylindrical, in which case the diameter of the cylindrical cooling body naturally corresponds to the diameter of the surface to be cooled.

If the cooling slots are designed helically, the cooling fluid is in contact with the cooling element over a relatively long distance, so that particularly effective cooling is achieved. Due to the angular outflow of the coolant relative to the radial direction, the swirling of the coolant at the circumferential surface of the cooling body is strengthened, which results in an advantageous cooling.

Due to the general mode of operation, the cooling slots have a constant cross-sectional shape. However, it may be advantageous if the cooling slots are designed with an enlarged cross-section. By varying the cross-sectional size, the flow rate of the coolant is also varied.

Furthermore, the cooling action can be further improved by providing a notch in the edge of the cooling slit and/or by arranging a vortex-forming member in the cooling slit in order to generate a swirling flow of the cooling liquid within the cooling slit. be done.

Embodiment In FIGS. 1 and 2, a disc-shaped cooling body 1
is provided with two semiconductor mounting surfaces 2. A plurality of parallel cooling slits 3 are formed on each semiconductor mounting surface 2, and the cooling slits have a rectangular cross-sectional shape 3.1 or a triangular cross-sectional shape 3.2.
Alternatively, it can be formed in a semicircular cross-sectional shape 3.3 with a semicircular bottom or in a trapezoidal cross-sectional shape 3.4. For the sake of simplicity, such different shaped slits are shown in one cooling body in FIG. 3, but in reality, for example, only one of these shaped slits can be used in one cooling Used on the body.

The cooling slits 3 each have two connecting passages 4
It is connected to the collective passage 7 via. Reference numeral 5 indicates the centering hole. A thread 8 is formed at the end of the collecting passage 7. The holes 6 are used as electrical connections for the cooling body 1.

Reference numeral 9 designates a cooling element, which can be formed by flat cooling ribs 9.1 or by individual cooling pins 9.2.
cooling needles 9.3. The cooling pins are rod-shaped or cone-shaped and preferably have a rhomboid or square cross-section, the diagonals of which are oriented at right angles to the main flow direction of the cooling liquid. The cooling pins of adjacent examples are preferably offset from each other, thus forming an advantageous vortex of the cooling fluid flowing past. It is important that the cooling element has a relatively large heat-conducting surface so that the heat to be removed can be efficiently transferred to the cooling liquid. The cooling body with the cooling element 9 consists of a heat-conducting metal, such as copper, aluminum or a compound thereof.

In FIG. 2, only a disk-shaped power semiconductor component 10 is shown for the sake of simplification, which flows through the semiconductor support surface 2 and through the cooling slit 3 during operation. Cooled directly by cooling fluid. From the cooling slots 3, which open in the area of the chamfer, the cooling liquid flows freely into a liquid container, which is not shown. Cooling liquid is supplied to the collecting channel 7 under pressure. Several component groups to be cooled can be arranged next to each other or one after the other in the coolant container. Such constituent groups are commonly used in power electronics.
Cooling body, power semiconductor, cooling body, power semiconductor, etc. are arranged in a sandwich-like order.
The disc-shaped elements of the component groups are clamped together by means of a clamping device, which is not shown, so that an advantageous electrical and thermally conductive contact occurs between them, which is disclosed, for example, in the German patent application It is described in the specification of Publication No. 2903771.

The plan view of FIG. 4 is similar to that of FIGS.
2 shows cooling slots 3 arranged in a spiral manner in the cooling body 1 of the figure. The cooling slit 3 has a coolant outflow angle α in the range of 40 degrees to 90 degrees at the outer edge of the cooling body, and this coolant outflow angle α is between the radial axis A at the liquid outflow end and the center of the cooling slit. It is measured between axis B. This allows a cooling liquid, for example oil, to flow between the cooling element and the cooling body and past the cooling element 9 at the outer edge of the cooling body 1 and to remove heat from this cooling element 9.

Figure 3 shows the cooling slits 3 and 4 in the cooling body 1.
Two embodiments are shown in a cutaway manner. The cooling slit 3 is
In two embodiments it is guided radially, and in two other embodiments it is guided approximately radially. The cooling slits are connected via a connecting passage 4 to a collecting passage 7, which is not shown in FIG. As is clear from the drawing, the liquid is guided into the center of the cooling body 1 and then flows from there to the outer edges of the cooling body. The cooling slit has a linear profile 3.5, another cooling slit has an outwardly enlarged profile 3.6, and a further cooling slit has a meandering linear profile 3.7.
The further cooling slit has an elongated line shape 3.8. The two last-mentioned cooling slots 3.7, 3.8 are of course combined with further similarly designed cooling slots, which are generally sectioned over the semiconductor mounting surface 2.

In order to obtain a good vortex formation of the cooling liquid in the cooling slits and thus a good heat transfer from the cooling body 1 to the cooling liquid, the cooling slits 3.5 to 3.8 are provided with ridges or notches 11.1 on the slit edges. ~11.3, and these cutouts are arranged offset from each other. Such a cutout has, for example, a semicircular shape 11.1, or a triangular shape 11.2 or a square shape 11.3.

Swirl formation and cooling effect are further improved by: That is, the vortex forming members 12.1 to 12.6 protrude into the cooling slit 3, and the vortex forming members 12.1 to 12.6 have a crested conical shape, for example.
1, or cylindrical shape 12.2, or conical shape 12.3, or trapezoidal shape 12.4,
Alternatively, it has a prismatic shape 12.5 or a triangular pyramid shape 12.6. In FIG. 3, various shapes of the swirl-forming member are shown schematically. It is also possible to use various swirl-forming elements and cutouts in combination in one cooling body 1.

Of course, the invention is not limited to the illustrated embodiment. Other shapes of cooling slits 3 can also be used. If the heat sink is designed as a heat sink, the heat sink 1 can also have cooling slots only on one side, so that the heat sink cools only one semiconductor component. It is also possible for the cooling body 1 to have another shape.

Effects of the Invention The advantage obtained by the invention is that a well-cooled semiconductor can be electrically highly loaded, ie a high current capacity is obtained.

[Brief explanation of drawings]

1 is a plan view of the cooling body, FIG. 2 is a sectional view of the first cooling body, FIG. 3 is a plan view of the cylindrical cooling body showing four embodiments of cooling slits in four segments, and FIG. FIG. 4 is a plan view of the contact surface of the cooling body of FIGS. 1 and 2. DESCRIPTION OF SYMBOLS 1... Cooling body, 2... Semiconductor mounting surface, 3... Cooling slit, 3.1... Rectangular cross-sectional shape, 3.2
... Triangular cross-sectional shape, 3.3 ... Semicircular cross-sectional shape, 3.4 ... Trapezoidal cross-sectional shape, 3.5 ... Straight line shape, 3.6 ... Enlarged shape, 3.7 ... Meandering shape Line shape, 3.8... Expansion line shape, 4... Connection passage,
5... Centering hole, 6... Hole, 7... Gathering passage, 8
...screw thread, 9 ... cooling member, 9.1 ... cooling rib, 9.2 ... cooling pin, 9.3 ... cooling needle, 10 ... power semiconductor element, 11.1 ... semicircular shape , 11.2... Triangular shape, 11.3... Rectangular shape, 12.1... Framed conical shape, 12.2
... Cylindrical shape, 12.3 ... Conical shape, 12.
4...Prismatic trapezoid, 12.5...Prismatic shape, 1
2.6...Triangular pyramid shape.

Claims (1)

[Claims] 1 Cooling body 1 for liquid cooling of power semiconductor device 10
at least one for supplying cooling liquid;
It has three collecting passages 7 which are connected to a plurality of cooling slits 3 which are formed in at least one flat semiconductor mounting surface and which are further formed on the edge of the cooling body. In the type with liquid outflow holes to release, the cooling body 1 has cooling elements 9, 9.1, 9.2,
9.3 A cooling body for liquid cooling of a power semiconductor device, characterized in that the cooling body has a temperature of 9.3. 2. Cooling body according to claim 1, wherein the cooling elements 9 are designed as cooling ribs 9.1 or cooling pins 9.2 or cooling needles 9.3. 3. The cooling body according to claim 1 or 2, wherein the cooling slits 3 have a rectangular cross-sectional shape, a triangular cross-sectional shape, a semicircular cross-sectional shape, or a trapezoidal cross-sectional shape. 4. Any one of claims 1 to 3, wherein the cooling slit 3 is at least partially formed in a meandering line shape 3.7, an elongated line shape 3.8, or a spiral shape. The cooling body described. 5. Cooling body according to claim 1, wherein the cooling slits 3 have a radially outwardly widening shape 3.6. 6 Angle α at which the cooling liquid flows out from the cooling slit 3
is in the range from 40 degrees to 90 degrees, and the outflow angle α at the outflow part of the cooling liquid from the cooling slit into the chamber surrounding the edge of the cooling body is in the radial direction at the liquid outflow end of the cooling slit 3. Any one of claims 1 to 4 indicating the angle between the axis A of the cooling slit axis B and the cooling slit axis B.
Cooling body described in section. 7. The cooling slit 3 has cutouts 11.1...11.3 at the slit edge in order to form swirls in the cooling liquid in the cooling slit, and/or
Or a swirl forming member 12.1 in the cooling slit 3...
...12.6 is inserted into the cooling body according to any one of claims 1 to 6. 8 Notches 11.1...11.3 are semicircular 1
1.1 or triangular shape 11.2 or rectangular shape 11.3
Cooling body described in section. 9 The spiral forming members 12.1...12.6 have a crested conical shape 12.1, a cylindrical shape 12.2, a conical shape 12.3, a trapezoidal trapezoid shape 12.4, a prismatic shape 12.5, or a triangular pyramid. 8. Cooling body according to claim 7, which is formed in the shape 12.6. 10. The cooling body according to any one of claims 1 to 9, which is formed in a disk shape.