JPH0426669U - - Google Patents
Info
- Publication number
- JPH0426669U JPH0426669U JP6963590U JP6963590U JPH0426669U JP H0426669 U JPH0426669 U JP H0426669U JP 6963590 U JP6963590 U JP 6963590U JP 6963590 U JP6963590 U JP 6963590U JP H0426669 U JPH0426669 U JP H0426669U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- component
- heating device
- temperature
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims 3
- 230000008018 melting Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Description
第１図は本考案に係る半田付け用加熱装置をア
キシヤルリード型セラミツクコンデンサの製造組
立ラインに適用した一実施例を示す構成図であつ
て、同図のａは斜視図、同図のｂはａの−線
矢視方向の断面図、第２図はセラミツクコンデン
サの説明図、第３図は従来の半田付け用加熱装置
の説明図である。
図中、Ａ……アキシヤルリード型セラミツクコ
ンデンサ、１……コンデンサ本体、５ａ，５ｂ…
…金属キヤツプ、２０……搬送装置、１００……
半田付け用加熱装置、１０１……ケース体、１０
１ａ……上面、１０２……予備加熱部、１０３…
…加熱部、１１０……加熱装置移動機構部。
FIG. 1 is a configuration diagram showing an embodiment in which a soldering heating device according to the present invention is applied to a manufacturing assembly line for axial lead type ceramic capacitors, in which a is a perspective view and b is a perspective view. 2 is an explanatory diagram of a ceramic capacitor, and FIG. 3 is an explanatory diagram of a conventional soldering heating device. In the figure, A...Axial lead type ceramic capacitor, 1...Capacitor body, 5a, 5b...
...Metal cap, 20...Transfer device, 100...
Heating device for soldering, 101...Case body, 10
1a...Top surface, 102...Preheating section, 103...
...Heating section, 110... Heating device moving mechanism section.
Claims (1)
合すべく、これら部品を半田溶融温度以上に加熱
する加熱部を備えた半田付け用加熱装置において
、 前記加熱部の前段に、被加熱部品を半田溶融温
度まで徐々に昇温させる予備加熱部を設けた ことを特徴とする半田付け用加熱装置。[Scope of Claim for Utility Model Registration] In order to join a mounted component to a component provided with a solder layer by soldering, a heating device for soldering is provided with a heating section that heats the component to a temperature higher than the solder melting temperature, comprising: A heating device for soldering, characterized in that a preheating section is provided in front of the preheating section to gradually raise the temperature of the heated component to the solder melting temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069635U JPH0756123Y2 (en) | 1990-06-29 | 1990-06-29 | Heating device for soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069635U JPH0756123Y2 (en) | 1990-06-29 | 1990-06-29 | Heating device for soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0426669U true JPH0426669U (en) | 1992-03-03 |
| JPH0756123Y2 JPH0756123Y2 (en) | 1995-12-25 |
Family
ID=31605114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990069635U Expired - Fee Related JPH0756123Y2 (en) | 1990-06-29 | 1990-06-29 | Heating device for soldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0756123Y2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6149269A (en) | 1997-04-18 | 2000-11-21 | Madison; Julie B. | Eyeglasses having magnetically held auxiliary lenses |
| US7140727B2 (en) | 2002-07-10 | 2006-11-28 | Isl Technologies, Llc | Eyeglass frame assembly |
| US7249843B2 (en) | 2004-05-14 | 2007-07-31 | Isl Technologies, Llc | Adjustable tensioning system for rimless eyewear |
| US7063420B2 (en) | 2004-05-14 | 2006-06-20 | Isl Technologies, Llc | Adjustable tensioning system for rimless eyewear |
| US7537337B2 (en) | 2006-05-04 | 2009-05-26 | Lerner Ira S | Eyewear with eyewire tensioning assembly |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS522277A (en) * | 1975-06-24 | 1977-01-08 | Hitachi Ltd | Soldering device |
| JPH01118369A (en) * | 1987-10-30 | 1989-05-10 | Fujitsu Ltd | Soldering reflow furnace |
| JPH01150465A (en) * | 1987-12-07 | 1989-06-13 | Tamura Seisakusho Co Ltd | Vapor phase soldering device |
-
1990
- 1990-06-29 JP JP1990069635U patent/JPH0756123Y2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS522277A (en) * | 1975-06-24 | 1977-01-08 | Hitachi Ltd | Soldering device |
| JPH01118369A (en) * | 1987-10-30 | 1989-05-10 | Fujitsu Ltd | Soldering reflow furnace |
| JPH01150465A (en) * | 1987-12-07 | 1989-06-13 | Tamura Seisakusho Co Ltd | Vapor phase soldering device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0756123Y2 (en) | 1995-12-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |