JPH04283986A - Surface-packaging type semiconductor device - Google Patents

Surface-packaging type semiconductor device

Info

Publication number
JPH04283986A
JPH04283986A JP4712191A JP4712191A JPH04283986A JP H04283986 A JPH04283986 A JP H04283986A JP 4712191 A JP4712191 A JP 4712191A JP 4712191 A JP4712191 A JP 4712191A JP H04283986 A JPH04283986 A JP H04283986A
Authority
JP
Japan
Prior art keywords
semiconductor device
main body
package
leads
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4712191A
Other languages
Japanese (ja)
Inventor
Miyuki Kodama
児玉　みゆき
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4712191A priority Critical patent/JPH04283986A/en
Publication of JPH04283986A publication Critical patent/JPH04283986A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To provide a surface-packaging type semiconductor device with an improved reliability of soldering without any danger of deformation of a lead, for a surface-packaged semiconductor device especially whose lead is protected regarding a structure of the semiconductor device. CONSTITUTION:A semiconductor device 4 where nearly Z-shaped leads 7 are aligned on a package side surface 6A, a main body plate portion 11 in square plate shape which is nearly equal to a package bottom surface 6B of the semiconductor device 5, a lead protection plate 10 which is made of synthetic resin consisting of comb teeth 12 which are aligned at each side of the main body plate portion 11 are provided, the main body plate portion 11 is applied to the package bottom surface 6B, and then the respective comb teeth 12 are inserted between the leads 7.

Description

【発明の詳細な説明】[Detailed description of the invention]

【０００１】0001

【産業上の利用分野】本発明は、半導体装置の構造に係
わり、特にリードが保護された表面実装型半導体装置に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of a semiconductor device, and more particularly to a surface-mounted semiconductor device with protected leads.

【０００２】0002

【従来の技術】図３は従来の表面実装型半導体装置の斜
視図である。図において５は、ＬＳＩ等の半導体チップ
を樹脂封止した半導体装置であって、パッケージ６のそ
れぞれのパッケージ側面６Ａに、ほぼＺ形のリード７が
多数等ピッチで配列している。即ち半導体装置５のパッ
ケージ６は、所謂ＱＦＰ（ＱｕａｄＦｌａｔ　ｐａｃｋ
ａｇｅ）型である。2. Description of the Related Art FIG. 3 is a perspective view of a conventional surface-mounted semiconductor device. In the figure, reference numeral 5 denotes a semiconductor device in which a semiconductor chip such as an LSI is sealed with resin, and a large number of approximately Z-shaped leads 7 are arranged at equal pitches on each package side surface 6A of a package 6. That is, the package 6 of the semiconductor device 5 is a so-called QFP (QuadFlat pack).
age) type.

【０００３】一方、回路基板１にはパターン端末に形成
したパッドが枠形に配列するように、多数のパターン２
を形成してある。そして、上述の半導体装置５は、それ
ぞれのリード７のフット部分を対応するパッドに位置合
わせし、リフロー半田付けすることで、回路基板１に表
面実装されている。On the other hand, a large number of patterns 2 are formed on the circuit board 1 so that the pads formed at the pattern terminals are arranged in a frame shape.
has been formed. The above-described semiconductor device 5 is surface-mounted on the circuit board 1 by aligning the foot portion of each lead 7 with the corresponding pad and performing reflow soldering.

【０００４】0004

【発明が解決しようとする課題】ところで、近年の電子
機器に搭載される半導体装置は、多ピン化の要求により
、微細化されたリードが近接して配列されている。例え
ばリード厚が　１５０μｍ　、幅が　２００μｍ　、ピ
ッチが　５００μｍ　である。By the way, in recent years, semiconductor devices mounted on electronic devices have miniaturized leads arranged closely together due to the demand for increased number of pins. For example, the lead thickness is 150 μm, the width is 200 μm, and the pitch is 500 μm.

【０００５】したがって、半導体装置の取扱時にリード
に外力が付与されると、リードが曲がり、隣接したリー
ドに接触するという問題点があった。また他のリードに
接触するまで曲がらなくても、リードのフットがパター
ンのパッドから外れ、半田付けの信頼度が低下するとい
う問題点があった。[0005] Therefore, when an external force is applied to the leads during handling of the semiconductor device, there is a problem in that the leads bend and come into contact with adjacent leads. Furthermore, even if the lead does not bend until it contacts another lead, the foot of the lead comes off the pad of the pattern, reducing the reliability of soldering.

【０００６】本発明はこのような点に鑑みて創作された
もので、リードが変形する恐れがなくて、半田付けの信
頼度が高い表面実装型半導体装置を提供することを目的
としている。The present invention was created in view of the above points, and an object of the present invention is to provide a surface-mounted semiconductor device in which there is no risk of lead deformation and the reliability of soldering is high.

【０００７】[0007]

【課題を解決するための手段】上記の目的を達成するた
めに本発明は、図１に例示したように半導体装置５のパ
ッケージ底面６Ｂ形状にほぼ等しい角板状の本体板部１
１と、本体板部１１のそれぞれの辺から外側に突出し配
列した櫛歯１２とよりなる合成樹脂製のリード保護板１
０を設ける。[Means for Solving the Problems] In order to achieve the above object, the present invention provides a main body plate portion 1 having a rectangular plate shape approximately equal to the shape of the package bottom surface 6B of a semiconductor device 5, as illustrated in FIG.
1 and comb teeth 12 arranged outwardly from each side of the main body plate portion 11.
Set 0.

【０００８】そして、パッケージ側面６ＡにほぼＺ形の
リード７が配列した半導体装置５のパッケージ底面６Ｂ
に、本体板部１１を貼着して、それぞれの櫛歯１２をリ
ード７間に挿入した構成とする。The bottom surface 6B of the package of the semiconductor device 5 has approximately Z-shaped leads 7 arranged on the side surface 6A of the package.
The main body plate part 11 is attached to the main body plate part 11, and each comb tooth 12 is inserted between the leads 7.

【０００９】また図２に例示したように、パッケージ６
の上部が嵌入する凹部を有する角板状枠形の本体部２１
と、本体部２１の枠縁から下方に突出して配列した櫛歯
２２とよりなる合成樹脂製のリード保護体２０を設ける
。Furthermore, as illustrated in FIG. 2, the package 6
A main body portion 21 having a rectangular plate-like frame shape and having a recess into which the upper portion of the main body portion 21 is fitted.
A lead protector 20 made of synthetic resin is provided, which includes comb teeth 22 arranged to protrude downward from the frame edge of the main body 21.

【００１０】そして、パッケージ側面６ＡにほぼＺ形の
リード７が配列した半導体装置５のパッケージ６に、本
体部２１を冠着してそれぞれの櫛歯２２をリード７間に
挿入した構成とする。The main body 21 is attached to the package 6 of the semiconductor device 5 in which approximately Z-shaped leads 7 are arranged on the side surface 6A of the package, and each comb tooth 22 is inserted between the leads 7.

【００１１】[0011]

【作用】本発明によれば上述のように、パッケージ側面
に並列した半導体装置のリード間には、それぞれ絶縁体
よりなる櫛歯が挿入されている。したがって、半導体装
置の取扱時にリードに外力が付与されることがあっても
、リードが変形する恐れが少ない。According to the present invention, as described above, comb teeth made of an insulator are inserted between the leads of the semiconductor devices arranged in parallel on the side surface of the package. Therefore, even if an external force is applied to the leads during handling of the semiconductor device, there is little risk of the leads deforming.

【００１２】よって、隣接したリードと短絡することが
ない。またリードのフットと回路基板のパッドとの位置
ずれが防止される。[0012] Therefore, there is no possibility of short-circuiting with adjacent leads. Also, misalignment between the foot of the lead and the pad of the circuit board is prevented.

【００１３】[0013]

【実施例】以下図を参照しながら、本発明を具体的に説
明する。なお、全図を通じて同一符号は同一対象物を示
す。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be explained in detail below with reference to the drawings. Note that the same reference numerals indicate the same objects throughout the figures.

【００１４】図１は本発明の実施例の斜視図、図２は本
発明の他の実施例の図で、（Ａ）はリード保護体の斜視
図、（Ｂ）は断面図である。図１において、ＬＳＩ等の
半導体チップを樹脂封止した半導体装置５には、パッケ
ージ側面６ＡにほぼＺ形のリード７が多数等ピッチで配
列されている。FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a diagram of another embodiment of the present invention, in which (A) is a perspective view of a lead protector, and (B) is a sectional view. In FIG. 1, a semiconductor device 5 in which a semiconductor chip such as an LSI is sealed with resin has a large number of approximately Z-shaped leads 7 arranged at equal pitches on a side surface 6A of the package.

【００１５】１０は、合成樹脂よりなるリード保護板で
ある。リード保護板１０は、半導体装置５のパッケージ
底面６Ｂ形状にほぼ等しい角板状の本体板部１１と、本
体板部１１のそれぞれの辺から、外側に突出し配列した
多数の櫛歯１２とで構成されている。Reference numeral 10 denotes a lead protection plate made of synthetic resin. The lead protection plate 10 is composed of a rectangular main body plate portion 11 that is approximately the same shape as the package bottom surface 6B of the semiconductor device 5, and a large number of comb teeth 12 that are arranged and protrude outward from each side of the main body plate portion 11. has been done.

【００１６】櫛歯１２の配列ピッチは、リード７の配列
ピッチに等しく、本体板部１１の一辺に並列した櫛歯１
２の数量は、対応するリード７の数量よりも一個だけ多
い。また、この櫛歯１２の幅は、半導体装置５のリード
７の配列間隔よりもわずかに小さくしてある。The arrangement pitch of the comb teeth 12 is equal to the arrangement pitch of the leads 7, and the comb teeth 1 are arranged in parallel on one side of the main body plate portion 11.
The quantity of 2 is one more than the corresponding quantity of lead 7. Further, the width of the comb teeth 12 is made slightly smaller than the arrangement interval of the leads 7 of the semiconductor device 5.

【００１７】そして、櫛歯１２をそれぞれのリード７の
間に差し込むように、リード保護板１０を半導体装置５
の下面に合わせ、接着剤を用いて本体板部１１をパッケ
ージ底面６Ｂに貼着している。Then, the lead protection plate 10 is attached to the semiconductor device 5 so that the comb teeth 12 are inserted between the respective leads 7.
The main body plate portion 11 is attached to the bottom surface 6B of the package using an adhesive.

【００１８】したがって、半導体装置の取扱時にリード
７が他の物品に衝突しても、リード７が曲がる恐れが少
ない。図２において、２０は、合成樹脂よりなるリード
保護体である。リード保護体２０は、パッケージ６の上
部が嵌入する凹部を有する角板状の本体部２１と、本体
部２１の枠縁から下方に突出して配列した多数の櫛歯２
２とで構成されている。Therefore, even if the leads 7 collide with other objects during handling of the semiconductor device, there is little risk of the leads 7 being bent. In FIG. 2, 20 is a lead protector made of synthetic resin. The lead protector 20 includes a rectangular plate-shaped main body 21 having a recess into which the upper part of the package 6 fits, and a large number of comb teeth 2 arranged to protrude downward from the frame edge of the main body 21.
It is composed of 2.

【００１９】櫛歯２２の配列ピッチは、半導体装置５の
リード７の配列ピッチに等しく、本体部２１の一枠縁に
並列した櫛歯２２の数量は、対応するリード７の数量よ
りも一個だけ多い。The arrangement pitch of the comb teeth 22 is equal to the arrangement pitch of the leads 7 of the semiconductor device 5, and the number of comb teeth 22 arranged in parallel on one frame edge of the main body portion 21 is one less than the number of corresponding leads 7. many.

【００２０】また、この櫛歯２２の正面視の幅は、半導
体装置５のリード７の配列間隔よりもわずかに小さく、
側面視の幅はリード７の水平方向の突出長よりも大きい
。 そして、櫛歯２２をリード７の間に差し込むようにして
、リード保護体２０を半導体装置５に冠着している。Further, the width of the comb teeth 22 in front view is slightly smaller than the arrangement interval of the leads 7 of the semiconductor device 5.
The width in side view is larger than the horizontal protrusion length of the lead 7. Then, the lead protector 20 is attached to the semiconductor device 5 by inserting the comb teeth 22 between the leads 7.

【００２１】上述のようにリード保護体２０と半導体装
置５を組み合わせてあるので、半導体装置５のそれぞれ
のリード７は、パターンに半田付するフット部分を残し
て他の部分は、櫛歯２２により保護されている。Since the lead protector 20 and the semiconductor device 5 are combined as described above, each lead 7 of the semiconductor device 5 has a foot portion soldered to the pattern, and the other portions are soldered by the comb teeth 22. protected.

【００２２】したがって、半導体装置の取扱時にリード
７が他の物品に突き当たることが阻止される。[0022] Therefore, the leads 7 are prevented from hitting other objects when handling the semiconductor device.

【００２３】[0023]

【発明の効果】以上説明したように本発明は、半導体装
置のリード間に絶縁体の櫛歯を挿入した表面実装型半導
体装置であって、外力により半導体装置のリードが変形
する恐れがないので、隣接したリードと短絡することが
ない。また、リードのフットと回路基板のパッドとの位
置ずれ防止されるので、半田付けの信頼度が向上すると
いう実用上で優れた効果を奏する。As explained above, the present invention is a surface-mounted semiconductor device in which insulating comb teeth are inserted between the leads of a semiconductor device, and there is no fear that the leads of the semiconductor device will be deformed by external force. , there will be no short circuit with adjacent leads. Furthermore, since positional deviation between the foot of the lead and the pad of the circuit board is prevented, the reliability of soldering is improved, which is an excellent practical effect.

【図面の簡単な説明】[Brief explanation of the drawing]

【図１】　　本発明の実施例の斜視図[Fig. 1] Perspective view of an embodiment of the present invention

【図２】　　本発明の他の実施例の図で、（Ａ）はリー
ド保護体の斜視図 （Ｂ）は断面図FIG. 2 is a diagram of another embodiment of the present invention, in which (A) is a perspective view of a lead protector and (B) is a cross-sectional view.

【図３】　　従来例の斜視図[Figure 3] Perspective view of conventional example

【符号の説明】[Explanation of symbols]

１　　回路基板、 ２　　パターン、 ５　　半導体装置、 ６　　パッケージ、 ６Ａ　　パッケージ側面、 ６Ｂ　　パッケージ底面、 ７　　リード、 １０　　リード保護板、 １１　　本体板部、 １２，２２　　　櫛歯、 ２０　　リード保護体、 ２１　　本体部、 1 circuit board, 2. Pattern, 5 Semiconductor device, 6. Package, 6A　Package side, 6B Bottom of package, 7. Lead, 10 Lead protection plate, 11 Main body plate part, 12, 22 Comb teeth, 20 Lead protector, 21 Main body part,

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】　　パッケージ側面（６Ａ）にほぼＺ形の
リード（７）　が配列した半導体装置（５）　と、該半
導体装置（５）　のパッケージ底面（６Ｂ）形状にほぼ
等しい角板状の本体板部（１１）、及び該本体板部（１
１）のそれぞれの辺に配列した櫛歯（１２）よりなる合
成樹脂製のリード保護板（１０）とを備え、該本体板部
（１１）が該パッケージ底面（６Ｂ）に貼着され、それ
ぞれの該櫛歯（１２）が該リード（７）　間に挿入され
たことを特徴とする表面実装型半導体装置。Claim 1: A semiconductor device (5) with approximately Z-shaped leads (7) arranged on the side surface (6A) of the package, and a rectangular plate-shaped main body approximately equal to the shape of the bottom surface (6B) of the package of the semiconductor device (5). A plate part (11), and the main body plate part (1
1), the main body plate (11) is attached to the bottom surface (6B) of the package, and each A surface-mounted semiconductor device characterized in that the comb teeth (12) are inserted between the leads (7). 【請求項２】　　パッケージ側面（６Ａ）にほぼＺ形の
リード（７）　が配列した半導体装置（５）　と、パッ
ケージ（６）　の上部が嵌入する凹部を有する角板状の
本体部（２１）、及び該本体部（２１）の枠縁から下方
に突出して配列した櫛歯（２２）よりなる合成樹脂製の
リード保護体（２０）とを備え、該本体部２１がパッケ
ージ６に冠着され、それぞれの該櫛歯２２が該リード７
間に挿入されたことを特徴とする表面実装型半導体装置
。2. A semiconductor device (5) with substantially Z-shaped leads (7) arranged on the package side surface (6A), and a rectangular plate-shaped main body (21) having a recess into which the upper part of the package (6) fits. , and a synthetic resin lead protector (20) consisting of comb teeth (22) arranged to protrude downward from the frame edge of the main body (21), and the main body 21 is attached to the package 6. , each of the comb teeth 22 is connected to the lead 7
A surface-mounted semiconductor device characterized by being inserted between.
JP4712191A 1991-03-13 1991-03-13 Surface-packaging type semiconductor device Withdrawn JPH04283986A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4712191A JPH04283986A (en) 1991-03-13 1991-03-13 Surface-packaging type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4712191A JPH04283986A (en) 1991-03-13 1991-03-13 Surface-packaging type semiconductor device

Publications (1)

Publication Number Publication Date
JPH04283986A true JPH04283986A (en) 1992-10-08

Family

ID=12766329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4712191A Withdrawn JPH04283986A (en) 1991-03-13 1991-03-13 Surface-packaging type semiconductor device

Country Status (1)

Country Link
JP (1) JPH04283986A (en)

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Effective date: 19980514