JPH04294602A - Microwave circuit board - Google Patents
Microwave circuit boardInfo
- Publication number
- JPH04294602A JPH04294602A JP3083440A JP8344091A JPH04294602A JP H04294602 A JPH04294602 A JP H04294602A JP 3083440 A JP3083440 A JP 3083440A JP 8344091 A JP8344091 A JP 8344091A JP H04294602 A JPH04294602 A JP H04294602A
- Authority
- JP
- Japan
- Prior art keywords
- transmission lines
- circuit board
- microwave circuit
- coupling
- dielectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
Landscapes
- Waveguides (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明はマイクロ波回路基板に関
し、特にマイクロストリップ線路を有する回路基板に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave circuit board, and more particularly to a circuit board having microstrip lines.
【０００２】0002
【従来の技術】従来のマイクロ波回路基板は、図２に示
すように誘電体基板１の片面に接地導体５を設け、誘電
体基板１の他方の面にマイクロストリップ型伝送線路２
，３を設けている。伝送線路２，３が近接していると両
者間での静電容量が大きくなって結合が生じ、マイクロ
波回路に影響を与えるため、両伝送線路２，３の間隔は
広くする必要があった。2. Description of the Related Art As shown in FIG. 2, a conventional microwave circuit board has a ground conductor 5 on one side of a dielectric substrate 1, and a microstrip type transmission line 2 on the other side of the dielectric substrate 1.
, 3 are provided. If the transmission lines 2 and 3 are close to each other, the capacitance between them increases and coupling occurs, which affects the microwave circuit, so it was necessary to widen the distance between the two transmission lines 2 and 3. .
【０００３】0003
【発明が解決しようとする課題】この従来のマイクロ波
回路基板では、平行に配設された伝送線路２，３間の結
合による影響を避けるため、伝送線路２，３の間隔を広
くとる必要がある。このため、マイクロ波回路基板全体
の平面寸法を小さくすることが困難であるという問題が
ある。本発明の目的は平面寸法の低減を可能としたマイ
クロ波回路基板を提供することにある。[Problems to be Solved by the Invention] In this conventional microwave circuit board, in order to avoid the influence of coupling between the transmission lines 2 and 3 arranged in parallel, it is necessary to provide a wide interval between the transmission lines 2 and 3. be. Therefore, there is a problem in that it is difficult to reduce the planar dimensions of the entire microwave circuit board. An object of the present invention is to provide a microwave circuit board whose planar dimensions can be reduced.
【０００４】0004
【課題を解決するための手段】本発明のマイクロ波回路
基板は、誘電体基板の表面に形成した複数本の伝送線路
のうち、隣接する２本の伝送線路の間の誘電体基板に溝
を設けている。この場合、誘電体基板に高誘電率の材料
を用いることが好ましい。[Means for Solving the Problems] The microwave circuit board of the present invention has a groove formed in the dielectric substrate between two adjacent transmission lines among a plurality of transmission lines formed on the surface of the dielectric substrate. It is set up. In this case, it is preferable to use a material with a high dielectric constant for the dielectric substrate.
【０００５】[0005]
【作用】本発明によれば、誘電体基板に設けた溝によっ
て伝送線路間の静電容量を低減して両伝送線路間の結合
を小さくし、両伝送線路の間隔を低減することを可能と
する。[Operation] According to the present invention, it is possible to reduce the capacitance between the transmission lines by using the grooves provided in the dielectric substrate, thereby reducing the coupling between the two transmission lines and reducing the distance between the two transmission lines. do.
【０００６】[0006]
【実施例】次に、本発明を図面を参照して説明する。図
１は本発明の一実施例のマイクロ波回路基板の斜視図で
ある。誘電体基板１の下面に接地導体５を設け、上面に
複数本、ここでは２本のマイクロストリップ型伝送線路
２，３を設けている。そして、これら伝送線路２，３の
間において、前記誘電体基板１の表面に溝４を形成し、
両伝送線路２，３がこの溝４を挟んで対向されるように
構成している。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings. FIG. 1 is a perspective view of a microwave circuit board according to an embodiment of the present invention. A ground conductor 5 is provided on the lower surface of the dielectric substrate 1, and a plurality of microstrip type transmission lines 2, 3, here two, are provided on the upper surface. Then, a groove 4 is formed on the surface of the dielectric substrate 1 between these transmission lines 2 and 3,
Both transmission lines 2 and 3 are configured to face each other with this groove 4 in between.
【０００７】したがって、この溝４により、伝送線路２
，３間の誘電体基板１の表面に沿う距離が長くなって両
者間での静電容量が低減され、両伝送線路２，３の結合
も弱くなる。これにより、両伝送線路２，３の間隔を大
きくしなくとも、両伝送線路２，３間の結合を小さくで
き、マイクロ波回路基板の平面寸法の低減が実現できる
。Therefore, this groove 4 allows the transmission line 2 to
, 3 along the surface of the dielectric substrate 1 becomes longer, the capacitance between them is reduced, and the coupling between both transmission lines 2 and 3 is also weakened. As a result, the coupling between the transmission lines 2 and 3 can be reduced without increasing the interval between the transmission lines 2 and 3, and the planar dimensions of the microwave circuit board can be reduced.
【０００８】尚、両伝送線路２，３間の結合を小さくす
る効果は、誘電体基板１の誘電率が高いほど大きく、例
えば誘電体基板１の材料にアルミナセラミック（εｒ
≒１０）を用いれば、伝送線路間容量を最大１／５まで
減らすことができる。又、前記実施例は２本の伝送線路
について例示したが、３本以上の伝送線路が平行に配設
されている場合でも、各伝送線路間に溝を形成すること
で、各伝送線路間での結合を小さくすることができる。
更に、溝の深さや底面形状を適宜変更することで、伝送
線路間の結合を更に小さくすることもできる。The effect of reducing the coupling between both transmission lines 2 and 3 is greater as the dielectric constant of the dielectric substrate 1 increases. For example, the material of the dielectric substrate 1 is alumina ceramic (εr
≒10), it is possible to reduce the capacitance between transmission lines by up to 1/5. Furthermore, although the above embodiments have been exemplified using two transmission lines, even when three or more transmission lines are arranged in parallel, forming a groove between each transmission line will allow the transmission lines to The coupling of can be reduced. Furthermore, by appropriately changing the depth and bottom shape of the groove, the coupling between the transmission lines can be further reduced.
【０００９】[0009]
【発明の効果】以上説明したように本発明は、伝送線路
間の誘電体基板に溝を形成しているので、溝によって両
伝送線路間の静電容量を低減して両伝送線路間の結合を
小さくし、結果として両伝送線路の間隔を低減すること
を可能とし、マイクロ波回路基板の平面寸法を小さくす
ることができる効果がある。Effects of the Invention As explained above, in the present invention, since grooves are formed in the dielectric substrate between the transmission lines, the grooves reduce the capacitance between the two transmission lines, thereby improving the coupling between the two transmission lines. As a result, it is possible to reduce the distance between both transmission lines, and the planar dimensions of the microwave circuit board can be reduced.
【図１】本発明のマイクロ波回路基板の一実施例の斜視
図である。FIG. 1 is a perspective view of an embodiment of a microwave circuit board of the present invention.
【図２】従来のマイクロ波回路基板の斜視図である。FIG. 2 is a perspective view of a conventional microwave circuit board.
１ 誘電体基板 ２，３ 伝送線路 ４ 溝 ５ 接地導体 1 Dielectric substrate 2,3 Transmission line 4 groove 5 Ground conductor
Claims (2)
する複数本の伝送線路を平行に配設したマイクロ波回路
基板において、隣接する２本の伝送線路の間の誘電体基
板に溝を設けたことを特徴とするマイクロ波回路基板。Claim 1: In a microwave circuit board in which a plurality of transmission lines for transmitting microwaves are arranged in parallel on the surface of a dielectric substrate, a groove is provided in the dielectric substrate between two adjacent transmission lines. A microwave circuit board characterized by:
なる請求項１のマイクロ波回路基板。2. The microwave circuit board according to claim 1, wherein the dielectric substrate is made of a material with a high dielectric constant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3083440A JPH04294602A (en) | 1991-03-23 | 1991-03-23 | Microwave circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3083440A JPH04294602A (en) | 1991-03-23 | 1991-03-23 | Microwave circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04294602A true JPH04294602A (en) | 1992-10-19 |
Family
ID=13802488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3083440A Pending JPH04294602A (en) | 1991-03-23 | 1991-03-23 | Microwave circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04294602A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5426399A (en) * | 1993-02-04 | 1995-06-20 | Mitsubishi Electric Corp | Film carrier signal transmission line having separating grooves |
| EP0811257A4 (en) * | 1995-02-23 | 1998-04-29 | Superconductor Tech | Method and apparatus for increasing power handling capabilities of high temperature superconducting devices |
| EP0921715A1 (en) * | 1997-11-06 | 1999-06-09 | Samsung Electronics Co., Ltd. | PCB for mounting RF band pass filter and method of manufacture |
| US7411279B2 (en) | 2004-06-30 | 2008-08-12 | Endwave Corporation | Component interconnect with substrate shielding |
| US7588966B2 (en) | 2004-06-30 | 2009-09-15 | Endwave Corporation | Chip mounting with flowable layer |
| JP5182517B2 (en) * | 2007-01-26 | 2013-04-17 | 日本電気株式会社 | Coupling circuit and manufacturing method thereof |
-
1991
- 1991-03-23 JP JP3083440A patent/JPH04294602A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5426399A (en) * | 1993-02-04 | 1995-06-20 | Mitsubishi Electric Corp | Film carrier signal transmission line having separating grooves |
| EP0811257A4 (en) * | 1995-02-23 | 1998-04-29 | Superconductor Tech | Method and apparatus for increasing power handling capabilities of high temperature superconducting devices |
| EP0921715A1 (en) * | 1997-11-06 | 1999-06-09 | Samsung Electronics Co., Ltd. | PCB for mounting RF band pass filter and method of manufacture |
| US7411279B2 (en) | 2004-06-30 | 2008-08-12 | Endwave Corporation | Component interconnect with substrate shielding |
| US7588966B2 (en) | 2004-06-30 | 2009-09-15 | Endwave Corporation | Chip mounting with flowable layer |
| JP5182517B2 (en) * | 2007-01-26 | 2013-04-17 | 日本電気株式会社 | Coupling circuit and manufacturing method thereof |
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