JPH0472642U - - Google Patents
Info
- Publication number
- JPH0472642U JPH0472642U JP1990116610U JP11661090U JPH0472642U JP H0472642 U JPH0472642 U JP H0472642U JP 1990116610 U JP1990116610 U JP 1990116610U JP 11661090 U JP11661090 U JP 11661090U JP H0472642 U JPH0472642 U JP H0472642U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- fin
- base side
- tower shape
- fin structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図は本考案の一実施例を適用した放熱フイ
ン付ＩＣパツケージの斜視図、第２図は第１図の
−線に沿う概略拡大断面図、第３図は従来の
放熱フイン付ＩＣパツケージの一例を示す斜視図
、第４図はＩＣパツケージの熱抵抗を放熱フイン
の枚数との関係で示した図である。
１１……ＩＣパツケージ（発熱体）、１７……
放熱フイン構体、１９……基端側のフイン部、２
０……先端側のフイン部。
Fig. 1 is a perspective view of an IC package with heat dissipation fins to which an embodiment of the present invention is applied, Fig. 2 is a schematic enlarged sectional view taken along the - line in Fig. 1, and Fig. 3 is a conventional IC package with heat dissipation fins. FIG. 4 is a perspective view showing an example of the present invention, and is a diagram showing the thermal resistance of the IC package in relation to the number of heat dissipation fins. 11...IC package (heating element), 17...
Heat dissipation fin structure, 19...Fin portion on base end side, 2
0...Fin part on the tip side.
Claims (1)
形成され、発熱体に基部側が取り付けられる放熱
フイン構体において、 塔状の高さ方向で少なくとも２つ以上のフイン
部に分割し、各フイン部をそれぞれ異なる材料で
形成するとともに、 基部側よりも先端側に配置されたフイン部に行
くに従つて熱伝導率の高い材料で形成したことを
特徴とする放熱フイン構体。[Scope of Claim for Utility Model Registration] In a heat dissipation fin structure formed by stacking a plurality of fins to form a tower shape, the base side of which is attached to a heating element, at least two or more fin parts in the height direction of the tower shape. A heat dissipation fin structure characterized in that each fin part is formed of a different material, and the fin part disposed on the tip side is made of a material with higher thermal conductivity than the base side. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990116610U JPH0472642U (en) | 1990-11-06 | 1990-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990116610U JPH0472642U (en) | 1990-11-06 | 1990-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472642U true JPH0472642U (en) | 1992-06-26 |
Family
ID=31864446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990116610U Pending JPH0472642U (en) | 1990-11-06 | 1990-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472642U (en) |
-
1990
- 1990-11-06 JP JP1990116610U patent/JPH0472642U/ja active Pending