JPH0489176A - Solder jetting nozzle - Google Patents

Abstract

PURPOSE:To diminish a peel back area and to increase a speed so as to prevent the generation of solder bridges and icicles by constituting the above nozzle in such a manner that the static flow state can be variably adjusted and that the solder in a static flow tank is allowed to flow downward by holes provided on an expansion plate. CONSTITUTION:The molten solder gushes from the solder jetting nozzle 1. The solder flowing out in the direction where a printed circuit board flows toward the nozzle is admitted again into the solder tank by an inside guide 8. The solder flowing out in the flow direction of the printed circuit board can be varied in the static flow state by freely adjusting the height of a weir plate 2. The solder dammed up by the weir plate 2 through the holes 4a to 4h provided on the expansion plate 3 of the static flow part falls into the solder tank. The velocity at which the solder flows downward at the point B2 where the printed circuit board parts from the jet solder is increased by this phenomenon, by which the peel back area is decreased and the generation of the solder bridge and the icicles is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a solder jet nozzle for a flow soldering device.

Conventional technology When electronic components are inserted into a printed circuit board, etc. and automatically soldered using a flow soldering device, a solder jet nozzle is installed in a solder tank in which solder is melted, and a solder jet fan is installed inside the solder tank. The solder was rotated by a motor and molten solder was jetted out from a solder jet nozzle, and the printed circuit board with electronic components inserted therein was flowed through it for automatic soldering.

Problem to be Solved by the Invention In such a configuration, in order to remove solder bridges and icicles at the soldering part, the soldered printed circuit board is separated from the solder jet wave to minimize the beer back area. In order to make the solder wave that flows in the direction of the printed circuit board being flowed extremely smaller than the solder wave that flows in the opposite direction, and to maintain a static flow state, the nozzle is shaped like a weir. This solder jet nozzle was able to prevent the occurrence of solder bridges and icicles by controlling the nozzle weir and the speed of the solder jet if the pitch (2.5 mm) of the corresponding component was automatically inserted. As mounting progresses and the pitch of components becomes narrower, it becomes impossible to prevent solder bridges and icicles from occurring.

The present invention solves the above-mentioned problems in flow soldering on printed circuit boards from conventional mounting and insertion to high-density mounting and insertion. Prevent the occurrence of icicles. (2) The downward force (velocity) of the solder trying to separate from the printed circuit board surface after the components mounted and inserted on the printed circuit board create a minimum beer pack area and after the printed circuit board is flow soldered. and prevent solder bridges and icicles from occurring. (3) Only the nozzle part can be replaced with a single touch in order to variably produce six pairs of solder jets in one solder tank for mounting and inserting various types of solder.

(4) It is an object of the present invention to provide a solder jet nozzle that can reduce oxidation residue.

Means for Solving the Problems In order to achieve the above object, the first means of the present invention is to cut grooves on both sides of the plate in the part that will serve as a weir, and attach this to the rectifying end of the solder jet nozzle. It is installed so that it meshes with the variable guide roller, and by inserting and rotating the shaft drive into the rotating shaft, the weir plate is raised and lowered, and a static flow state can be created arbitrarily depending on the shape and density of the parts mounted and inserted on the printed circuit board. It is configured to do this.

The second means is to minimize the beer pack area and reduce t1 to B2 in the beer pack area (regions B and B2 shown in FIG. 3) to remove solder bridges and icicles. That is the point. Therefore, the greater the downward velocity v5 of the solder at the point B2 where the solder jet separates from the printed circuit board, the more the generation of solder bridges and icicles can be prevented. By making the solder larger as it approaches the weir plate and increasing the amount of solder that flows directly below the static flow part, the civil back area is reduced and at the same time, the downward velocity v3 of the solder at the point B2 where the flint circuit board and jet solder separate is increased. The structure is such that it is possible to prevent solder bridges and icicles from occurring.

The third method is to attach the jet nozzle to the solder tank body, aligning the fitting part with the jet guide, and at the same time fixing the jet guide and the jet nozzle with a stopper pin so that the jet nozzle does not float up due to the force of the solder jet. . With this structure, if it is not possible to change the static flow state depending on the shape and density of the parts mounted or inserted on the printed circuit board to be soldered, it is possible to individually The structure is such that only the jet nozzle prepared for the installation can be replaced with a single touch.

Furthermore, the fourth means is to provide a solder flow guide in order to reduce the generation of oxidized residue by contacting the air when the jetted solder flows down, and to reduce the space when the solder flows down and allow air (oxygen) to enter. The structure is such that oxidation of the solder is prevented by reducing the amount of solder.

Function: The solder jet nozzle of the present invention is capable of arbitrarily varying the static flow portion in the flow direction of the printed circuit board, and increases the downward flow speed of the solder at the point where the solder jet separates from the printed circuit board. By reducing the size of beer roses, it is possible to prevent solder bridges and icicles from forming.

With this in mind, by providing a guide for the flow of the jet solder, the portion of the solder that comes into contact with the air can be reduced, thereby reducing the generation of oxidized scum.

Further, the jet nozzle of the present invention has the advantage that it can be fixed to the jet guide with a single stopper pin, can be easily attached and removed, the jet nozzle can be changed for each glint circuit board, and maintenance can be easily performed.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 3.

As shown in the figure, the solder jet nozzle 1 has a downward flow velocity V5 (
3), the holes 4 through which the solder flows down into the expansion plate 3 are made larger toward the weir plate 2 side so that the holes 4a to 4. It forms h. Further, a solder flow guide 6 is provided to surround the hole 4 in order to prevent the solder from coming into direct contact with the air and oxidizing and generating oxidized scum when the solder flows down from the expansion plate 3.

The solder jet nozzle /l/1 can be installed with a single touch by fitting the fitting part 6 into the solder jet guide (not shown) installed in the solder bath body, and the stopper pin 7 Solder jet guide and solder jet nozzle/L
By locking the solder jet nozzle /I/1, the solder jet nozzle /I/1 becomes integrated with the solder jet guide.

Further, by rotating the solder jet under the solder jet guide by a motor, the molten solder in the solder tank is jetted out from the solder jet nozzle 1. The solder flowing out in the direction of flow of the printed circuit board flows into the solder tank again by the inside guide 8, and the solder flowing out in the direction of flow of the printed circuit board flows into the weir plate 2.
The static flow state can be varied by freely adjusting the height. This weir plate 2 can be changed arbitrarily by grooves 2a provided on both sides.
Optional variable guide roller 9 attached to the end of the solder flow
This is possible by inserting the shaft drive 11 into the rotating shaft 10 and rotating it. Further, the weir plate 2 can be arbitrarily changed at any time, and the operation can be performed while checking the soldering condition of the printed circuit board. 12 is a guide for the weir plate 2.

Next, pass through the holes 41 to 4h provided in the expansion plate 3 of the static flow section,
The solder dammed by the dam plate 2 falls into the solder tank. As a result of this phenomenon, as shown in Figure 3, the downward flow velocity v3 of the solder at the point B2 where the printed circuit board separates from the jet solder increases, the beer back area becomes smaller, and the generation of solder bridges and icicles is prevented. be done. Furthermore, by providing a solder flow guide 5 to prevent the jet solder from coming into contact with the air when it falls into the solder tank through the holes 4a to 4h provided in the expansion plate 3 of the static flow section, it is possible to reduce the generation of oxidized solder scum. It has a function. Further, the jet nozzle 1 is a removable solder jet nozzle 1 that can integrate the solder jet guide and the jet nozzle 1 with a single touch by fitting the fitting part 6 into the solder jet guide with a stopper bottle 7, and is a printed circuit board. implementation,
The solder jet nozzle 1 can be easily replaced depending on the shape and density of the inserted parts, and maintenance can be performed much more easily than in the past.

Effects of the Invention As is clear from the above embodiments, according to the present invention, the static flow state can be adjusted arbitrarily depending on the mounting of the printed circuit board, the shape and density of inserted parts, and the static flow state can be adjusted by the holes provided in the expansion plate. Since the solder in the tank flows downward, the generation of solder bridges and icicles can be prevented by reducing the beer back area where the solder leaves the printed circuit board and by increasing the speed.

Further, by providing a solder flow guide between the holes provided in the expansion plate, the area where the solder comes into contact with the air is reduced, thereby reducing the generation of solder oxidation scum. Furthermore, since the solder jet nozzle can be attached to and removed from the solder jet guide with a single touch, the solder jet nozzle can be replaced as desired depending on the condition of the printed circuit board, and maintenance can be easily performed.

Furthermore, as the number of mounted components increases, a tilted flow solder dip tank has been used individually, but it is possible to provide a solder jet nozzle that can utilize a conventional horizontal flow solder dip tank.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a solder jet nozzle according to an embodiment of the present invention, Fig. 2 is a sectional view of the same solder jet nozzle, and Fig. 3 is a diagram of the beer back area when the printed circuit board and the jet nozzle are separated. It is. 1...-Solder jet nozzle, 2...Weir plate, 3
...Diffusion plate, 4,4a-4h...hole,
6... Solder flow guide, 6... Fitting part, γ... Stopper pin, 9... Guide roller, 1o... Rotation shaft. Name of agent: Patent attorney Shigetaka Awano and one other person

Claims (4)

[Claims] (1) A dam plate that dams the solder that is jetted from the solder jet port and flows into the diffusion plate in the flow direction of the soldered object;
A height adjusting means for adjusting the height of the weir plate and a hole provided in the diffusion plate through which the solder flows are provided, and by adjusting the height of the weir plate, a static flow tank is formed according to the object to be soldered. A solder jet nozzle. (2) The solder jet nozzle according to claim 1, wherein holes through which the solder flows are formed in the diffusion plate so that the diameter increases toward the weir plate. (3) The solder jet nozzle according to claim 1 or 2, wherein a solder flow guide is provided to surround the hole formed in the diffusion plate through which the solder flows. (4) The solder jet nozzle according to claim 1, further comprising a fitting portion which is detachably fitted to the solder jet guide.