JPH0512440B2 - - Google Patents

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Publication number
JPH0512440B2
JPH0512440B2 JP21515284A JP21515284A JPH0512440B2 JP H0512440 B2 JPH0512440 B2 JP H0512440B2 JP 21515284 A JP21515284 A JP 21515284A JP 21515284 A JP21515284 A JP 21515284A JP H0512440 B2 JPH0512440 B2 JP H0512440B2
Authority
JP
Japan
Prior art keywords
voltage
anode
stage
ratio
average voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP21515284A
Other languages
Japanese (ja)
Other versions
JPS6194316A (en
Inventor
Hiroshi Sano
Akira Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Light Metal Co Ltd
Original Assignee
Nippon Light Metal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Light Metal Co Ltd filed Critical Nippon Light Metal Co Ltd
Priority to JP21515284A priority Critical patent/JPS6194316A/en
Publication of JPS6194316A publication Critical patent/JPS6194316A/en
Publication of JPH0512440B2 publication Critical patent/JPH0512440B2/ja
Granted legal-status Critical Current

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Description

【発明の詳細な説明】[Detailed description of the invention]

本発明は低圧用アルミニウム電解コンデンサー
の電極に用いるアルミニウム箔の電解エツチング
方法に関するものである。 アルミニウム箔を一方の電極として用いる低圧
用アルミニウム電解コンデンサーにおいては、コ
ンデンサーの静電容量を増大させるために、前記
した一方の極として用いられるアルミニウム箔を
電気化学的にエツチングしてその表面積を拡大処
理することが行われている。この拡大処理された
箔は、更に化学処理した後に、実際にコンデンサ
ーに組付けられるが、この表面積拡大処理によつ
て拡大された箔表面の状態が、たとえエツチング
層が厚くなつても表面の不均一溶解が起らず、且
つ緻密である場合は、単位体積当りの表面積拡大
率が大きく、その結果静電容量の大きいコンデン
サーが得られることから、箔の表面積拡大処理は
低圧用コンデンサーの重要な性能である静電容量
に著しい影響をおよぼすこととなり、その良否は
低圧用コンデンサーの部品として重要なポイント
の1つとなつている。 即ちこのような目的において従来から行われて
いる前記のアルミニウム箔に対する電気化学的エ
ツチング処理方法、いわゆる電解エツチング処理
方法の代表的な方法としては下記のものが提案さ
れている。 つまりその第1は、アルミニウム箔を塩酸水溶
液あるいは該水溶液にリン酸、蟻酸等の酸を添加
した混酸水溶液中で、交流あるいは直流を印加し
て電解エツチングする方法であるが、その交流を
用いた電解エツチング処理ではアルミニウム箔表
面に穿孔されたエツチピツトが連接しあつて緻密
性を失い、見掛け上、これらのエツチピツトが成
長さず、アルミニウム箔の表面積がある値以上に
は増大しないという欠点がある。また、直流を用
いた電解エツチング処理ではエツチング初期に発
生したエツチピツトのみに電流が集中し、エツチ
ピツトの深さは深くエツチングされるけれども一
方ではエツチピツト側壁もエツチングされ、他方
では遅れて発生したエツチピツトが既に大きくエ
ツチングされたエツチピツトと連接することとな
つて、箔表面は不均一にエツチングされ、それら
の結果として十分に高い表面積拡大率が得られ
ず、また前述のエツチピツトが深くエツチングさ
れることと相俟つて、箔の強度低下を招く欠点が
ある。 またその第2として、交流と直流の中間の状態
を狙つた交直重畳法も提案されているが、使用す
る電解液組成との関係もあつて、未だ十分な効果
の得られる組合せ条件を見出し得ていない。 更に他の方法として、電解エツチング処理を前
段と後段とに分け、各段に交流と直流を組合せた
いわゆる2段エツチング法も提案されているが、
本発明者らの研究によると、エツチング処理に直
流を使用した場合は、前述した直流によるエツチ
ングの不均一さが残ることとなつて、単位体積当
りの表面積拡大率に限度があり、かつ箔強度にも
限度のあることが知られ、しかもその前段と後段
に異種の電解液を用いることから前段と後段の中
間に電解液洗浄工程を介装するなど処理操作も煩
雑である。 また、従来よりアルミニウム箔の電解エツチン
グ箔に用いる電解液は塩酸もしくはその塩の水溶
液中に硝酸、燐酸、硫酸、蓚酸またはこれらの塩
を添加した液を使用しているが、エツチング処理
にあたつて既に提案されている種々の電流を印加
しても十分に高い表面積拡大率を得られなかつ
た。 このような実情に鑑み発明者らは鋭意検討を重
ねた結果、塩酸系電解液を使用して電解コンデン
サー用アルミニウム箔の電解エツチング処理を施
すに当り、交番波形電源を用いて前記アルミニウ
ム箔に電圧を印加した場合に、該電圧1周期の電
圧印加時間に対する陽極時時間の占める割合およ
び全平均電圧(陽極時平均電圧と陰極時平均電圧
の和)に対する陽極時平均電圧の占める割合がピ
ツトの密度および大きさ、深さ等のピツトの形状
に大きく影響をおよぼすことを見出し、これをも
とにして印加電圧に対する陽極時時間、および陽
極時平均電圧の比率を精密にコントロールするこ
とにより、特に後工程で付与する約100V以下の
陽極化成電圧の低い用途、すなわち低圧用電解コ
ンデンサー等の使用に適するようなアルミニウム
電解箔、換言すれば、エツチング層が厚くなつて
も表面の不均一溶解が殆んど起らずに、その結
果、単位体積当りの表面積拡大率が大きく、静電
容量の高いアルミニウム箔を得る方法を完成した
ものである。 すなわち、本発明によるものは、重量で5〜25
%の塩酸系電解液中でアルミニウム箔を交番波形
電源を用いて電解エツチングするに際し、前段で
は該前段波形1周期の電圧印加時間に対する陽極
時時間の占める割合が0.3を越え0.8以下で且つ該
前段の全平均電圧に対する陽極時平均電圧の占め
る割合が0.3を越え0.8以下の電圧であり、後段で
は該後段波形1周期の電圧印加時間に対する陽極
時時間の占める割合が0.5を越え1.0以下で且つ該
後段の全平均電圧に対する陽極時平均電圧の占め
る割合が0.5を越え1.0以下の電圧であつて、しか
も前記した前段における波形1周期の電圧印加時
間に対する陽極時時間の占める割合が前記後段に
おける波形1周期の電圧印加時間に対する陽極時
時間の占める割合より小さく、又前記前段におけ
る全平均電圧に対する陽極時平均電圧の占める割
合が前記後段における全平均電圧に対する陽極時
平均電圧の占める割合よりも小さい電圧を印加す
ることを特徴とするアルミニウム箔の電解エツチ
ング処理方法である。 斯かる本発明について更に説明すると、本発明
方法における電解エツチング処理液は、その後の
電解処理においてエツチングの開始する電解初期
エツチピツトを高密度に発生させ、引きつづく電
解処理において該ピツトを好ましい形状にエツチ
ングするために効果のあるもので、塩酸単味の水
溶液のみに限らず、これに燐酸、蟻酸、酢酸、等
のアルミニウムの表面に保護皮膜を生成させる酸
を添加した混酸水溶液を使用することができる。
この電解処理液における塩酸濃度が重量で5%以
下となると、「前段で高密度の電解初期エツチン
グを得ることができないため、後段で引きつづき
電流を印加し、ピツトを深くエツチピツトしても
十分に高い単位体積当りの表面積拡大率を得るこ
とができないし、また後段の電解処理においては
ピツト径の増大を防ぎ、且つ、ピツト深さを増大
する如きエツチング処理ができず、その結果いず
れにしても高い表面積拡大率が得られない。」ま
た、塩酸濃度が重量で25%以上となると、箔表面
の化学的溶解がはげしく、前段の電解処理におい
ては電解初期エツチピツトの形成が不安定とな
り、後段の電解処理においては箔表面の溶解を生
じ、やはり十分に高い表面積拡大率を得ることが
できない。更に、前記した保護皮膜を形成する酸
の添加量は特に限定されるものではないが、重量
では硫酸は0.1〜2.5%、燐酸は0.1〜3%、蟻酸は
0.2〜4%、酢酸は0.5〜4.5%の単独又は複合添加
をなすことは一層好ましい拡大率を示すものであ
る。 然して上記したような高濃度の塩酸を含有する
電解液を使用して、アルミニウム箔に印加する電
流は、公知の交番波形電源を用いることによつて
得られる。ここでいう交番波形電源とは正負の極
性を交互に交換せしめる波形、すなわち、交番波
形を得しめる電源であつて、第1図にその電圧波
形を例示する。第1図においてAは正弦波、Bは
矩形波、Cは台形波を示すものでaは陽極時時
間、bは1周期の電圧印加時間、cは陽極時電
圧、dは陰極時電圧をそれぞれ示しているもので
あるが、本発明に用いられる交番波形は上記した
波形のものに限るものではない。かくして該交番
波形電源を用いて前段で印加する交番波形電圧は
箔に電解初期ピツトを高密度に発生させるための
もので、この高密度の初期ピツトを得ることので
きる印加電圧の条件は、該電圧1周期の電圧印加
時間に対する陽極時時間の占める割合が0.3を越
え0.8以下で、かつ該電流の全平均電圧に対する
陽極時平均電圧の占める割合が0.3を越え0.8以下
となる電圧であつて、それらの上限および下限を
外れた電圧を印加した場合は、後段で印加する交
番波形電圧の条件を最適のものにしたとしても、
十分に高い表面積拡大率を得ることができない。 また、この前段で印加する電圧は、この種の電
解処理に用いる一般的な電圧であつて、この電圧
が陽極時平均電圧として1Vより低くなるとピツ
ト密度が低下する傾向があり、また10Vより高く
なるとピツトが連接しはじめ、後段における電解
処理条件を選んでも所期の効果の得られない場合
が生ずる。 またその後段で印加する交番波形の電圧は、前
段で箔にあらかじめ穿たれた電解初期エツチピツ
トを、拡径量少なく、しかもさらに深くエツチン
グするたものもので、この目的のために印加する
電圧の条件としては、該電圧1周期の電圧印加時
間に対する陽極時時間の占める割合が0.5を越え
1.0以下で、かつ該電圧の全平均電圧に対する陽
極時平均電圧の占める割合が0.5を越え1.0以下と
なる電圧であつて、それらの上限および下限を外
れる電圧を印加した場合は、前段で高密度の電解
初期エツチピツトを穿孔したとしても、これらの
初期ピツトは好ましいエツチングをなさず、それ
故に十分に高い表面積拡大率を得ることができな
い。 また、この後段で印加する電圧は、前段の場合
と同程度の範囲のものであつて、それが1Vより
低くなると前段で発生したピツトを十分に深く穿
孔できなくなる傾向があり、また10Vより高くな
ると該ピツトの径を拡大しはじめ、いずれにして
も所期の効果が得られない場合が生ずる。 また、交番波形電源を用いて前段で印加する電
圧と後段で印加する電圧は、前段における電圧1
周期の電圧印加時間に対する陽極時時間の占める
割合が後段における電圧1周期の電圧印加時間に
対する陽極時時間の占める割合より小さく、かつ
前段における全平均電圧に対する陽極時平均電圧
の占める割合が後段における全平均電圧に対する
陽極時平均電圧の占める割合よりも小さい電圧を
印加する必要がある。 更に、本発明方法において使用する交番波形の
周波数は特に限定するものではないが、前段にお
ける好ましい周波数範囲は1〜200Hzで、1Hzよ
り小さいとピツト密度が小さく、また200Hzより
大きいとピツトが連接してしまう傾向があり、所
期の効果が得にくい。また後段における好ましい
周波数範囲は10〜200Hzで、10Hzより小さいと前
段において形成したピツトを深く穿孔できず、ま
た200Hzより大きい該ピツトの径を大きくしてし
まう傾向があり、いずれにしても所期の効果が得
にくい。 本発明方法を実施するにあたつて、前段と後段
に相当する電解処理槽を2槽設ける場合には、ア
ルミニウム箔を連続して処理することができる
し、また一槽のみの場合は該槽で前段の処理条件
でアルミニウム箔を処理した後、同槽で後段の処
理条件で処理することができる。また電解処理液
の組成は本発明方法の範囲のものであれば前段、
後段ともに同一のものであつても、異組成のもの
であつても所期の効果を得ることができるもので
ある。 本発明によるものの具体的な実施例およびその
比較例について説明すると以下の如くである。 純度が99.98%で厚さが70μmである硬質材のア
ルミニウム箔を用い、塩酸が13wt%硫酸が0.5wt
%の電解液を用い該電解液温度を55℃として60Hz
および120Hzの交番波形電源により電圧を印加し
てエツチング処理した。なおこの印加電圧の条件
は60Hzの場合が次の第1表に示す通りであつて、
前段および後段共に制御矩形波、又120Hzの場合
は第2表に示す通りであつて、前段および後段と
もに制御正弦波交流であり、夫々前段条件で処理
したものと、後段条件で処理したもの、及び前段
と後段で処理したものを得た。
The present invention relates to a method for electrolytically etching aluminum foil used for electrodes of low-voltage aluminum electrolytic capacitors. In low-voltage aluminum electrolytic capacitors that use aluminum foil as one electrode, in order to increase the capacitance of the capacitor, the aluminum foil used as one electrode is electrochemically etched to enlarge its surface area. things are being done. This enlarged foil is actually assembled into a capacitor after further chemical treatment, but the condition of the foil surface enlarged by this surface area enlargement treatment is such that even if the etched layer becomes thicker, there will be no surface defects. If uniform dissolution does not occur and the foil is dense, the surface area expansion rate per unit volume is large, and as a result, a capacitor with a large capacitance can be obtained. Therefore, the surface area expansion treatment of the foil is important for low voltage capacitors. It has a significant effect on capacitance, which is performance, and its quality is one of the important points for low-voltage capacitor components. That is, the following methods have been proposed as typical electrochemical etching methods, so-called electrolytic etching methods, for the aluminum foil that have been conventionally performed for this purpose. In other words, the first method is to electrolytically etch aluminum foil by applying alternating current or direct current in an aqueous solution of hydrochloric acid or a mixed acid solution in which an acid such as phosphoric acid or formic acid is added to the aqueous solution. Electrolytic etching has the drawback that the etch pits drilled on the surface of the aluminum foil connect with each other and lose density, and these etch pits do not appear to grow and the surface area of the aluminum foil does not increase beyond a certain value. Furthermore, in the electrolytic etching process using direct current, the current concentrates only on the etch pits generated in the early stage of etching, and although the etch pits are etched deep, the side walls of the etch pits are also etched, and on the other hand, the etch pits that occur late are already etched. The foil surface is etched non-uniformly due to the connection with the etched pits which are largely etched, and as a result, a sufficiently high surface area expansion rate cannot be obtained, and this is combined with the fact that the etched pits are deeply etched. However, this method has the drawback of reducing the strength of the foil. As a second method, an AC/DC superposition method has been proposed that aims to achieve a state intermediate between AC and DC, but due to the relationship with the electrolyte composition used, it has not yet been possible to find combination conditions that provide sufficient effects. Not yet. As another method, a so-called two-stage etching method has been proposed, in which the electrolytic etching process is divided into a first stage and a second stage, and each stage combines alternating current and direct current.
According to the research conducted by the present inventors, when direct current is used for etching processing, the non-uniformity of etching due to direct current remains as described above, there is a limit to the surface area expansion rate per unit volume, and there is a limit to the foil strength. Furthermore, since different types of electrolytes are used in the front and rear stages, processing operations are complicated, such as interposing an electrolyte cleaning step between the front and rear stages. Conventionally, the electrolytic solution used for electrolytic etching of aluminum foil has been an aqueous solution of hydrochloric acid or its salts to which nitric acid, phosphoric acid, sulfuric acid, oxalic acid, or salts thereof have been added; Even when applying various currents that have already been proposed, a sufficiently high surface area expansion rate could not be obtained. In view of these circumstances, the inventors have conducted extensive studies and found that when performing electrolytic etching treatment on aluminum foil for electrolytic capacitors using a hydrochloric acid-based electrolyte, a voltage is applied to the aluminum foil using an alternating waveform power source. is applied, the ratio of the anode time to the voltage application time of one cycle of the voltage and the ratio of the anode average voltage to the total average voltage (the sum of the anode average voltage and the cathode average voltage) are the pit density. We found that the shape of the pit, such as size and depth, greatly affects the shape of the pit, and based on this, we can precisely control the ratio of the anode time and the average voltage during the anode to the applied voltage. Aluminum electrolytic foil is suitable for applications where the anodization voltage applied in the process is low, approximately 100V or less, i.e., for use in low-voltage electrolytic capacitors, etc.In other words, even if the etching layer becomes thick, uneven dissolution on the surface will hardly occur. As a result, we have completed a method for obtaining aluminum foil with a large surface area expansion rate per unit volume and high capacitance without any problems occurring. That is, the product according to the present invention has a weight of 5 to 25
When aluminum foil is electrolytically etched using an alternating waveform power source in a hydrochloric acid-based electrolytic solution of The ratio of the average voltage at the anode to the total average voltage of The ratio of the average voltage at the anode to the total average voltage in the subsequent stage is more than 0.5 and 1.0 or less, and the ratio of the time at the anode to the voltage application time of one cycle of the waveform in the previous stage is the waveform 1 in the latter stage. A voltage that is smaller than the ratio of the anode time to the voltage application time of the cycle, and the ratio of the anode average voltage to the total average voltage in the preceding stage is smaller than the ratio of the anode average voltage to the total average voltage in the latter stage. This is an electrolytic etching method for aluminum foil, characterized by applying an electric current to the aluminum foil. To further explain the present invention, the electrolytic etching solution used in the method of the present invention generates a high density of initial electrolytic etch pits where etching starts in the subsequent electrolytic treatment, and etches the pits into a desired shape in the subsequent electrolytic treatment. In addition to a simple aqueous solution of hydrochloric acid, it is also possible to use a mixed acid aqueous solution containing an acid that forms a protective film on the surface of aluminum, such as phosphoric acid, formic acid, acetic acid, etc. .
When the hydrochloric acid concentration in this electrolytic treatment solution becomes 5% or less by weight, it is not possible to obtain a high-density electrolytic initial etching in the first stage, so even if the current is continuously applied in the second stage and the pits are etched deeply, the pits are not etched sufficiently. It is not possible to obtain a high surface area expansion rate per unit volume, and in the subsequent electrolytic treatment, it is not possible to perform an etching process that prevents the pit diameter from increasing and increases the pit depth. In addition, if the hydrochloric acid concentration exceeds 25% by weight, the chemical dissolution of the foil surface will be severe, and the formation of the initial electrolytic etching pit will become unstable in the first stage of electrolytic treatment, which will cause the subsequent stage of electrolytic treatment to become unstable. In the electrolytic treatment, the surface of the foil is dissolved, and a sufficiently high surface area expansion rate cannot be obtained. Further, the amount of acid added to form the above-mentioned protective film is not particularly limited, but in terms of weight, sulfuric acid is 0.1 to 2.5%, phosphoric acid is 0.1 to 3%, and formic acid is 0.1 to 2.5% by weight.
Addition of 0.2 to 4% and acetic acid of 0.5 to 4.5% alone or in combination shows a more preferable expansion ratio. However, the current applied to the aluminum foil using the electrolytic solution containing a high concentration of hydrochloric acid as described above can be obtained by using a known alternating waveform power source. The alternating waveform power source referred to herein is a power source that produces a waveform in which positive and negative polarities are alternately exchanged, that is, an alternating waveform, and the voltage waveform is illustrated in FIG. In Figure 1, A is a sine wave, B is a rectangular wave, and C is a trapezoidal wave, where a is the anode time, b is the voltage application time of one cycle, c is the anode voltage, and d is the cathode voltage. Although shown, the alternating waveform used in the present invention is not limited to the waveform described above. Thus, the alternating waveform voltage applied in the previous stage using the alternating waveform power source is for generating electrolytic initial pits in the foil at a high density, and the conditions of the applied voltage that can obtain this high density of initial pits are as follows. A voltage at which the ratio of the anode time to the voltage application time of one cycle of the voltage is more than 0.3 and 0.8 or less, and the ratio of the anode time average voltage to the total average voltage of the current is more than 0.3 and 0.8 or less, If a voltage outside these upper and lower limits is applied, even if the conditions of the alternating waveform voltage applied in the subsequent stage are optimized,
It is not possible to obtain a sufficiently high surface area expansion rate. In addition, the voltage applied in the first stage is a general voltage used in this type of electrolytic treatment, and if this voltage is lower than 1V as the average voltage at the anode, the pit density tends to decrease, and if it is higher than 10V, the pit density tends to decrease. Then, the pits begin to connect, and even if the electrolytic treatment conditions in the latter stage are selected, the desired effect may not be obtained in some cases. In addition, the alternating waveform voltage applied in the subsequent stage is used to etch the electrolytic initial etching pit, which has been pre-drilled into the foil in the previous stage, to a smaller diameter and more deeply, and the voltage applied for this purpose is , the ratio of the anode time to the voltage application time of one cycle of the voltage exceeds 0.5.
1.0 or less, and the ratio of the average voltage at the anode to the total average voltage exceeds 0.5 and is 1.0 or less, and if a voltage outside the upper and lower limits is applied, high density Even if the initial electrolytic etching pits are drilled, these initial pits do not undergo favorable etching and therefore a sufficiently high surface area expansion ratio cannot be obtained. In addition, the voltage applied in the latter stage is in the same range as in the previous stage; if it is lower than 1V, it tends to be difficult to drill the pits that occurred in the previous stage sufficiently, and if it is higher than 10V If this happens, the diameter of the pit will begin to increase, and in any case, the desired effect may not be obtained. Also, using an alternating waveform power supply, the voltage applied at the front stage and the voltage applied at the rear stage are equal to the voltage at the front stage.
The ratio of the anode time to the voltage application time of a cycle is smaller than the ratio of the anode time to the voltage application time of one cycle in the subsequent stage, and the ratio of the anode average voltage to the total average voltage in the previous stage is smaller than the ratio of the anode time to the total voltage application time in the latter stage. It is necessary to apply a voltage smaller than the ratio of the average voltage at the anode to the average voltage. Further, the frequency of the alternating waveform used in the method of the present invention is not particularly limited, but the preferable frequency range in the first stage is 1 to 200 Hz. If it is smaller than 1 Hz, the pit density will be small, and if it is larger than 200 Hz, the pits will be connected. This tends to make it difficult to obtain the desired effect. In addition, the preferred frequency range for the latter stage is 10 to 200 Hz; if it is lower than 10 Hz, the pit formed in the earlier stage cannot be drilled deeply, and if it is higher than 200 Hz, the diameter of the pit will tend to be increased. It is difficult to obtain the effect of When carrying out the method of the present invention, if two electrolytic treatment tanks are provided corresponding to the first and second stages, the aluminum foil can be processed continuously, or if only one tank is used, the tank After the aluminum foil is treated under the first-stage treatment conditions in the tank, it can be treated under the second-stage treatment conditions in the same tank. In addition, if the composition of the electrolytic treatment solution is within the range of the method of the present invention,
Even if the latter stages are the same or have different compositions, the desired effect can be obtained. Specific examples according to the present invention and comparative examples thereof are described below. Using hard aluminum foil with a purity of 99.98% and a thickness of 70 μm, 13 wt% hydrochloric acid and 0.5 wt sulfuric acid were used.
% electrolyte and the temperature of the electrolyte was 55℃ at 60Hz.
Then, a voltage was applied using a 120 Hz alternating waveform power source for etching. The conditions for this applied voltage are as shown in Table 1 below when the voltage is 60Hz.
Both the front and rear stages are controlled by square waves, and in the case of 120 Hz, as shown in Table 2, both the front and rear stages are controlled by sine wave alternating current; one processed under the first stage conditions and the other processed under the latter conditions, respectively. and those treated in the first and second stages were obtained.

【表】【table】

【表】【table】

【表】 註:第1表および第2表ともに全圧
は全平均電圧、陽圧は陽極
時平均電圧である。
又、これらとは別に比較例として純度99.99%
の軟質材による厚さ70μmのアルミニウム箔を塩
酸2wt%で燐酸が0.5wt%の電解液により電解液
温度としては55℃で60Hzの交流3Vに直流2Vを重
畳して印加し、エツチング処理した。 然して上記のように電解処理された各アルミニ
ウム箔はそれぞれ15V化成し、この化成処理され
た箔についての静電容量をそのエツチング処理時
間との関係において要約して示すと添付図面第
2,3図の通りである。 即ち第2図は前記60Hzの場合、第3図は前記
120Hzの場合であつて、それぞれ点線は前段条件
での処理、破線は後段条件での処理を示し、比較
的太い実線はそれら前後段を連続して行つたも
の、細線は比較例の場合を示したものであるが、
後段処理のみによつてでさえも比較例より優れた
結果が得られることは各図に示す通りであり、前
後段を併せて実施することにより何れの場合にお
いても更に優れた処理結果を得しめることができ
る。 以上説明したような本発明によるときは均一且
つ緻密で単位体積当りの表面積拡大率が大きく、
すなわち静電容量が大きい低圧用電解コンデンサ
ー用アルミニウム箔のエツチング処理を的確に実
施し得るものであり、しかも同一系の電解液によ
つて前後段を通じた処理が可能であるから処理操
作が簡易であり、加うるに処理されたアルミニウ
ム箔の強度が大で利用上有利であると共に比較的
薄層の素材アルミニウム箔に対しても好ましいエ
ツチング処理がなされ、上記のように優れた表面
積拡大率を倍増せしめ静電容量の更に大きい製品
を得しめるなどの作用効果を有しており、工業的
にその効果の大きい発明である。
[Table] Note: In both Tables 1 and 2, total pressure is the total average voltage, and positive pressure is the anode.
It is the hourly average voltage.
In addition, as a comparative example, purity 99.99%
An aluminum foil with a thickness of 70 μm made of a soft material was etched using an electrolytic solution containing 2 wt% hydrochloric acid and 0.5 wt% phosphoric acid at an electrolyte temperature of 55°C by applying a superimposition of 3 V AC and 2 V DC at 60 Hz. However, each of the aluminum foils electrolytically treated as described above has a 15V chemical conversion, and the capacitance of the chemically treated foils is summarized in relation to the etching time as shown in Figures 2 and 3 of the attached drawings. It is as follows. That is, Fig. 2 shows the case of 60Hz, and Fig. 3 shows the case of 60Hz.
In the case of 120Hz, the dotted line indicates processing under the first stage condition, the broken line indicates processing under the second stage condition, the relatively thick solid line indicates processing in the preceding and subsequent stages, and the thin line indicates processing in the comparative example. However,
As shown in each figure, results superior to those of the comparative example can be obtained even with post-processing alone, and even better processing results can be obtained in any case by performing both pre- and post-processing. be able to. According to the present invention as explained above, the surface area is uniform and dense, and the surface area expansion rate per unit volume is large.
In other words, it is possible to accurately perform the etching treatment of aluminum foil for low-voltage electrolytic capacitors, which has a large capacitance, and the treatment operation is simple because the same electrolytic solution can be used for both the front and rear stages. In addition, the strength of the treated aluminum foil is high and it is advantageous for use, and the etching process is also suitable for relatively thin layer material aluminum foil, doubling the excellent surface area expansion rate as mentioned above. This invention has the effect of making it possible to obtain a product with even higher capacitance, and is an invention that has great industrial effects.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明の技術的内容を示すものであつ
て、第1図は交番波形電流の時間−電圧の関係を
示す代表的な実施例、第2図と第3図はそれぞれ
本発明の実施例およびその比較例によるエツチン
グ処理アルミニウム箔のエツチング時間とそれに
よる静電容量の関係を要約して示した図表であ
る。
The drawings show the technical contents of the present invention, and FIG. 1 shows a typical example showing the time-voltage relationship of an alternating waveform current, and FIGS. 2 and 3 show examples of the present invention, respectively. 2 is a diagram summarizing the relationship between etching time and capacitance of etched aluminum foils according to comparative examples.

Claims (1)

【特許請求の範囲】[Claims] 1 重量で5〜25%の塩酸系電解液中でアルミニ
ウム箔を交番波形電源を用いて電解エツチングす
るに際し、前段で該前段波形1周期の電圧印加時
間に対する陽極時時間の占める割合が0.3を越え
0.8以下で且つ該前段の全平均電圧に対する陽極
時平均電圧の占める割合が0.3を越え0.8以下の電
圧であり、後段では該後段波形1周期の電圧印加
時間に対する陽極時時間の占める割合が0.5を越
え1.0以下で且つ該後段の全平均電圧に対する陽
極時平均電圧の占める割合が0.5を越え1.0以下の
電圧であつて、しかも前記した前段における波形
1周期の電圧印加時間に対する陽極時時間の占め
る割合が前記後段における波形1周期の電圧印加
時間に対する陽極時時間の占める割合より小さ
く、又前記前段における全平均電圧に対する陽極
時平均電圧の占める割合が前記後段における全平
均電圧に対する陽極時平均電圧の占める割合より
も小さい電圧を印加することを特徴とするアルミ
ニウム箔の電解エツチング処理方法。
1. When electrolytically etching aluminum foil in a hydrochloric acid electrolyte containing 5 to 25% by weight using an alternating waveform power supply, the ratio of the anode time to the voltage application time of one cycle of the first waveform in the first stage exceeds 0.3.
0.8 or less, and the ratio of the average voltage at the anode to the total average voltage in the previous stage is more than 0.3 and 0.8 or less, and in the latter stage, the ratio of the time at the anode to the voltage application time of one cycle of the waveform in the latter stage is 0.5. 1.0 or less, and the ratio of the average voltage at the anode to the total average voltage in the subsequent stage is more than 0.5 and 1.0 or less, and the ratio of the time at the anode to the voltage application time of one cycle of the waveform in the preceding stage. is smaller than the ratio of the anode time to the voltage application time of one cycle of the waveform in the latter stage, and the ratio of the anode average voltage to the total average voltage in the previous stage is smaller than the ratio of the anode average voltage to the total average voltage in the latter stage. A method for electrolytic etching of aluminum foil, characterized by applying a voltage smaller than the ratio.
JP21515284A 1984-10-16 1984-10-16 Electrolytic etching method for aluminum foil Granted JPS6194316A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21515284A JPS6194316A (en) 1984-10-16 1984-10-16 Electrolytic etching method for aluminum foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21515284A JPS6194316A (en) 1984-10-16 1984-10-16 Electrolytic etching method for aluminum foil

Publications (2)

Publication Number Publication Date
JPS6194316A JPS6194316A (en) 1986-05-13
JPH0512440B2 true JPH0512440B2 (en) 1993-02-18

Family

ID=16667528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21515284A Granted JPS6194316A (en) 1984-10-16 1984-10-16 Electrolytic etching method for aluminum foil

Country Status (1)

Country Link
JP (1) JPS6194316A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105006367B (en) * 2015-05-25 2017-05-31 厦门大学 Electrolytic capacitor low voltage anode aluminum foil ladder non-sinusoidal waveform frequency-conversion eroding method

Also Published As

Publication number Publication date
JPS6194316A (en) 1986-05-13

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