JPH0521673B2 - - Google Patents
Info
- Publication number
- JPH0521673B2 JPH0521673B2 JP59200646A JP20064684A JPH0521673B2 JP H0521673 B2 JPH0521673 B2 JP H0521673B2 JP 59200646 A JP59200646 A JP 59200646A JP 20064684 A JP20064684 A JP 20064684A JP H0521673 B2 JPH0521673 B2 JP H0521673B2
- Authority
- JP
- Japan
- Prior art keywords
- aperture
- light
- spot
- laser
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001105 regulatory effect Effects 0.000 claims 1
- 238000001514 detection method Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明はレーザ加工装置に係り、特に加工間隔
を検出して加工する装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a laser processing device, and more particularly to a device that performs processing by detecting processing intervals.
レーザ加工において第5図に示すように底板1
と部材2とを溶接する場合、レーザ光3を集光レ
ンズ4で集光し、その加工スポツト5を部材2上
に照射して溶接を行つている。このとき、部材2
の幅Wは加工スポツト5の直径dの寸法より大か
もしくはほぼ同一であることが好ましい。また、
加工スポツトは底板1の面を傷つけないように部
材2からはみ出さないように加工スポツト5と部
材2とを位置決めする必要がある。このような位
置決めのために光学的に行うものとして例えばエ
ツジ位置検出方式のものがある。すなわち光ビー
ムを物体に対し斜めから入射させ、上方から物体
上の特にエツジ部における輝点を観測しエツジ部
からの輝点を測定し、この測定で得られた領域内
に加工スポツトを収めるようにコントロールして
いた。しかし、エツジ部の丸みの具合により測定
誤差が生じやすい問題があつた。
In laser processing, the bottom plate 1 is
When welding the member 2 and the member 2, the laser beam 3 is focused by a condenser lens 4, and the processing spot 5 is irradiated onto the member 2 to perform welding. At this time, member 2
It is preferable that the width W is larger than or approximately the same as the diameter d of the processing spot 5. Also,
It is necessary to position the processing spot 5 and the member 2 so that the processing spot does not protrude from the member 2 so as not to damage the surface of the bottom plate 1. For example, an edge position detection method is available as an optical method for such positioning. In other words, a light beam is incident on the object obliquely, bright spots on the object are observed from above, especially at the edges, the bright spots from the edges are measured, and the processing spot is placed within the area obtained by this measurement. was under control. However, there was a problem in that measurement errors were likely to occur due to the roundness of the edges.
本発明は加工領域内のみにレーザ光照射を行う
ための位置決めを行う検出装置を備えた加工装置
の提供を目的とする。
An object of the present invention is to provide a processing apparatus equipped with a detection device that performs positioning for irradiating a laser beam only within a processing area.
加工領域における限界点間の両端に集光スポツ
トを結像させる投光姿勢に設けられた二以上の投
光手段を設け、上記集光スポツトを反射光を結像
しその位置にアパーチヤを配置して検出するよう
にし、アパーチヤの開口の全てから検出された状
態を加工用レーザ光による照射のための位置とし
て決定するようにしたものである。
Two or more light projecting means are provided in a light projecting posture to form a light condensing spot at both ends between the limit points in the processing area, and the reflected light is imaged at the light condensing spot, and an aperture is arranged at that position. The state detected from all the openings of the aperture is determined as the position for irradiation with the processing laser beam.
第1図は本発明の一実施例で、第5図に示すも
のと同一な部分には同一符号を付して説明する。
なお、図中において光ビームは便宜上中心軸線で
示してある。すなわち測定用の一対の投光装置1
0,11を有し、これらの装置はそれらの集束ビ
ーム12,13の集光スポツト12a,13aが
部材2の加工面における限界点14a,14bに
斜めから入射して結像するように配置されてい
る。部材2の上方には集束ビーム12,13に狭
まれる状態で集光レンズ15がおよび45度の角度
に保持された半透鏡16順次設けられ上記集光ス
ポツトによる反射光12c,12dを所定位置に
結像させるようになつている。17はアパーチヤ
で、このアパーチヤに形成された複数の開口18
が集光レンズ15による結像位置に一致する箇所
に設けられている。19はアパーチヤ17の背後
に設けられ、開口18を通過した光を検出する光
検出器である。20はレーザ発振装置で、放出さ
れるレーザ光21は部材2の上方に45度に傾斜し
て設置された反射鏡22および集光レンズ15と
同軸上に設けられた集光レンズ23を介し部材2
に入光するようになつている。光検出器19の出
力信号はレーザ発振装置20内の制御部(図示せ
ず)に入力するようになつている。この場合、上
記出力信号は開口18の全てからの光を検出した
時点で出力するようになつている。なお、投光装
置10,11、集光レンズ15、半透鏡16、ア
パーチヤ17、光検出器19、反射鏡22および
集光レンズ23の関係位置は常に一定になつてい
る。
FIG. 1 shows one embodiment of the present invention, and the same parts as those shown in FIG. 5 will be described with the same reference numerals.
In addition, in the figure, the light beam is shown by the central axis line for convenience. That is, a pair of light projecting devices 1 for measurement.
0, 11, and these devices are arranged so that the converging spots 12a, 13a of the focused beams 12, 13 obliquely enter and image the limit points 14a, 14b on the processing surface of the member 2. ing. Above the member 2, a condensing lens 15 narrowed by convergent beams 12 and 13 and a semi-transparent mirror 16 held at an angle of 45 degrees are sequentially provided to direct the reflected light 12c and 12d from the condensing spot to a predetermined position. It is designed to form an image. 17 is an aperture, and a plurality of openings 18 formed in this aperture
is provided at a location that corresponds to the image formation position by the condenser lens 15. A photodetector 19 is provided behind the aperture 17 and detects the light that has passed through the aperture 18. Reference numeral 20 denotes a laser oscillation device, and the emitted laser beam 21 passes through a reflecting mirror 22 installed above the member 2 at an angle of 45 degrees and a condensing lens 23 disposed coaxially with the condensing lens 15. 2
The light is starting to enter the sky. The output signal of the photodetector 19 is input to a control section (not shown) within the laser oscillation device 20. In this case, the output signal is output when light from all of the apertures 18 is detected. Note that the relative positions of the light projecting devices 10, 11, the condensing lens 15, the semi-transparent mirror 16, the aperture 17, the photodetector 19, the reflecting mirror 22, and the condensing lens 23 are always constant.
上記の構成の作用について次に述べる。集光ス
ポツト12a,13aが部材2の限界点14a,
14bに照射されている場合、第2図aに示すよ
うに反射光16a,16bの各スポツト像24
a,24bは開口18を通過した光検出器19に
入光する。また、部材2が第1図に示す位置より
大幅にずれた場合、集束ビーム12,13の底板
1の面における点25a,25bの位置を照射す
ることになる。この場合、第2図bに示すように
点25a,25bの間隔は限界点14a,14b
のそれより狭いため、点25a,25bからの反
射光によるスポツト像26a,26bは開口18
間に結像する。一方、部材2が例えばその幅Wの
半分程度図中右側にずれた場合には第2図Cに示
すように部材2に照射されたスポツトは反射して
開口18を通過するスポツト像27aとなり、ず
れたために底板1の面に照射されたスポツトは反
射してアパーチヤ17上に形成されるスポツト像
27bとなり開口18を通過しない。 The operation of the above configuration will be described next. The condensing spots 12a and 13a are the limit points 14a and 14a of the member 2, respectively.
14b, each spot image 24 of the reflected light 16a, 16b is irradiated as shown in FIG.
The light beams a and 24b pass through the aperture 18 and enter the photodetector 19. If the member 2 is significantly shifted from the position shown in FIG. 1, the focused beams 12 and 13 will illuminate the points 25a and 25b on the surface of the bottom plate 1. In this case, as shown in Figure 2b, the distance between points 25a and 25b is the limit point 14a and 14b.
The spot images 26a and 26b formed by the reflected light from the points 25a and 25b are narrower than that of the aperture 18.
An image is formed in between. On the other hand, if the member 2 is shifted to the right in the figure by about half its width W, the spot irradiated onto the member 2 will be reflected and become a spot image 27a passing through the aperture 18, as shown in FIG. 2C. The spot irradiated onto the surface of the bottom plate 1 due to the misalignment is reflected and becomes a spot image 27b formed on the aperture 17 and does not pass through the opening 18.
上記作用における光検出器19により得られる
光強度信号を第3図に示す。すなわち、底板1と
部材2とが一体になつて横移動した場合、図中A
およびBの領域は第2図bに対応し、同じくB,
Dの領域は同図Cに対応し、同じくCの領域は同
図aに対応する。また、B,Dの領域の長さは集
光スポツト12a,13aの間隔に等しく、Cの
領域の長さはこの間隔を部材2の幅Wから引いた
ものに等しい。このことからCの領域の間にレー
ザ装置を発振させるゲード信号を出すようにして
レーザ光3を放出し部材2上に照射すれば、部材
2上から加工スポツト5がはみ出すことなく位置
決めされることになる。 FIG. 3 shows a light intensity signal obtained by the photodetector 19 in the above operation. In other words, when the bottom plate 1 and the member 2 move laterally as one, A in the figure
The areas B and B correspond to FIG. 2b, and the areas B,
Area D corresponds to C in the figure, and area C corresponds to a in the same figure. Further, the length of the regions B and D is equal to the interval between the condensing spots 12a and 13a, and the length of the region C is equal to the width W of the member 2 minus this interval. From this, if the laser beam 3 is emitted by emitting a gate signal that causes the laser device to oscillate between the region C and irradiates it onto the member 2, the processing spot 5 can be positioned without protruding from above the member 2. become.
なお部材が上記実施例のような長尺体でなく、
矩形状の場合には第4図に示すように矩形部材3
0に対し四つの集光スポツト31a〜31dを照
射するように投光装置を設け、かつこれら集光ス
ポツト31a〜31dに対応した開口を有するア
パーチヤを設けて検出する構成にすればよい。 Note that the member is not a long body as in the above embodiment, but
In the case of a rectangular member, a rectangular member 3 is used as shown in FIG.
Detection may be performed by providing a light projecting device so as to illuminate the four condensing spots 31a to 31d with respect to zero, and by providing apertures having openings corresponding to these converging spots 31a to 31d.
加工領域における限界点間隔に対応してアパー
チヤの開口を設け、全ての開口を通過した反射光
を検出しない限りレーザ光を放出しないように構
成したので、レーザ光が加工領域外からはみ出す
ことなく照射できるようになつたため、傷をつけ
たくない面にカバーなどの余分な手を加えること
なく的確にレーザ加工が行なえるようになつた。
The aperture openings are set in accordance with the spacing between the critical points in the processing area, and the laser beam is not emitted unless the reflected light that has passed through all the openings is detected, so the laser beam can be irradiated without protruding from outside the processing area. As a result, it is now possible to accurately perform laser processing on surfaces that do not want to be damaged, without having to add covers or other extra measures.
第1図は本発明の一実施例を示す構成図、第2
図はアパーチヤにおけるスポツトの結像状態を示
す図、第3図は部材の移動と光検出器による受光
強度との関係図、第4図は本発明の他の実施例を
示す原理図、第5図は一般のレーザ溶接加工例を
示す斜視図である。
1……底板、2……部材、10,11……投光
装置、14a,14b……限界点、15……集光
レンズ、17……アパーチヤ、18……開口、1
9……光検出器、20……レーザ発振器、21…
…レーザ光。
FIG. 1 is a configuration diagram showing one embodiment of the present invention, and FIG.
3 shows the relationship between the movement of the member and the intensity of light received by the photodetector. FIG. 4 shows the principle of another embodiment of the present invention. The figure is a perspective view showing an example of a general laser welding process. DESCRIPTION OF SYMBOLS 1... Bottom plate, 2... Member, 10, 11... Light projector, 14a, 14b... Limit point, 15... Condensing lens, 17... Aperture, 18... Opening, 1
9...Photodetector, 20...Laser oscillator, 21...
...laser light.
Claims (1)
スポツトを結像させる二以上の投光装置と、上記
限界点間で規制される範囲内のスポツト径になる
レーザ光を照射するレーザ照射装置と、上記集光
スポツトによる反射光を再結像する集光レンズ
と、上記限界点間の距離に対応する距離をもつて
形成された複数の開口を有し、これら開口を上記
集光レンズによつて結像される位置に配されるア
パーチヤと、上記開口を通過した光を検出する光
検出器と、この光検出器において上記開口の全て
を通過した光を検出した時点で上記レーザ照射装
置に開始信号を出力する制御部とを備えたことを
特徴とするレーザ加工装置。1. Two or more light projection devices that obliquely irradiate limit points in the processing area to form a focused spot, and a laser irradiation device that irradiates a laser beam with a spot diameter within a range regulated between the limit points. , a condenser lens that reimages the light reflected by the condensing spot, and a plurality of apertures formed at distances corresponding to the distance between the limit points, and these apertures are formed by the condenser lens. an aperture arranged at a position where the image is formed; a photodetector for detecting the light passing through the aperture; and a photodetector for detecting the light passing through the aperture; A laser processing device comprising: a control section that outputs a start signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59200646A JPS6178586A (en) | 1984-09-27 | 1984-09-27 | Laser working device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59200646A JPS6178586A (en) | 1984-09-27 | 1984-09-27 | Laser working device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6178586A JPS6178586A (en) | 1986-04-22 |
| JPH0521673B2 true JPH0521673B2 (en) | 1993-03-25 |
Family
ID=16427856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59200646A Granted JPS6178586A (en) | 1984-09-27 | 1984-09-27 | Laser working device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6178586A (en) |
-
1984
- 1984-09-27 JP JP59200646A patent/JPS6178586A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6178586A (en) | 1986-04-22 |
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