JPH05218511A - Thermoelectric semiconductor element - Google Patents
Thermoelectric semiconductor elementInfo
- Publication number
- JPH05218511A JPH05218511A JP4015888A JP1588892A JPH05218511A JP H05218511 A JPH05218511 A JP H05218511A JP 4015888 A JP4015888 A JP 4015888A JP 1588892 A JP1588892 A JP 1588892A JP H05218511 A JPH05218511 A JP H05218511A
- Authority
- JP
- Japan
- Prior art keywords
- oxide
- powder
- thermoelectric semiconductor
- dried
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、熱電半導体素子に関
し、特に酸化物半導体を用いたものに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric semiconductor device, and more particularly to a device using an oxide semiconductor.
【0002】[0002]
【従来の技術】近年、地球環境問題からのフロン使用規
制や、電子機器等の局所冷却、除湿などの小型冷却装置
などに対する要求からペルチェ効果を利用した電子冷却
用電子部品に対する要求は大きい。2. Description of the Related Art In recent years, there have been great demands for electronic components for electronic cooling utilizing the Peltier effect due to restrictions on the use of CFCs due to global environmental problems and demands for small cooling devices such as local cooling and dehumidification of electronic devices.
【0003】このうち、室温付近で用いる電子冷却用の
電子部品としては、Bi−Te系の単結晶もしくは多結
晶凝固体を熱電半導体物質として使用したものが知られ
ている。熱電半導体素子はn型素子とp型素子を電気的
に直列に接合して用いられるがBi−Te系素子では特
性調整のためn型伝導素子部にはSeを添加して用いら
れている。Among these, as an electronic component for electronic cooling used near room temperature, one using a Bi-Te type single crystal or polycrystalline solidified body as a thermoelectric semiconductor material is known. The thermoelectric semiconductor element is used by electrically connecting an n-type element and a p-type element in series, but in the Bi-Te-based element, Se is added to the n-type conductive element portion to adjust the characteristics.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、これら
の素子において、とくに添加物として加えられるSeは
毒性が大きく、また主成分のBi−Te系組成自体が高
価でありこのため素子の使用範囲が制限されていた。ま
た、一般的に電子冷却用の熱電半導体素子の性能は、ゼ
ーベック係数をs、電気伝導度をσ,熱伝導度をkとす
ると、性能指数Z=s×s×σ/kで表わされ、Zの大
きいものほど冷却時の消費電力当りの吸収熱量や放熱側
との温度差が大きく取れ、各種半導体材料がBi−Te
系を置き換える目的で検討されてきたが、特性的にこれ
を超えるものは現在のところ報告されていない。However, in these devices, Se, which is added as an additive, is highly toxic, and the Bi-Te-based composition itself as the main component is expensive, so that the range of use of the device is limited. It had been. Further, generally, the performance of a thermoelectric semiconductor element for electronic cooling is represented by a performance index Z = s × s × σ / k, where s is the Seebeck coefficient, σ is the electrical conductivity, and k is the thermal conductivity. , Z has a larger amount of absorbed heat per power consumption during cooling and a larger temperature difference from the heat radiating side, and various semiconductor materials are Bi-Te.
Although it has been investigated for the purpose of replacing the system, no more than this characteristic has been reported so far.
【0005】本発明ではかかる課題に鑑み、材料として
毒性が少なく、かつ安価で性能が優れ特性的に安定した
新たな熱電半導体素子を提供することを目的とする。In view of the above problems, it is an object of the present invention to provide a new thermoelectric semiconductor element which is less toxic as a material, inexpensive, excellent in performance and stable in characteristics.
【0006】[0006]
【課題を解決するための手段】前記目的を達成するた
め、本発明の第1番目の熱電半導体素子は、酸化物半導
体がストロンチウム酸化物とチタン酸化物を少なくとも
構成成分とする複合酸化物よりなり、複合酸化物組成に
おけるSrに対するTiのモル比をaとしたとき、1.
005≦a≦1.120の範囲内にあり、かつ素子酸化
物半導体が酸素中で完全に高温酸化した後の重量に対す
る酸素欠損量を重量%で表わした値をbとするとき、
0.06≦b≦0.55の範囲内にあることを特徴とす
る。In order to achieve the above object, in the first thermoelectric semiconductor device of the present invention, the oxide semiconductor comprises a complex oxide containing at least strontium oxide and titanium oxide as constituent components. , Where the molar ratio of Ti to Sr in the composite oxide composition is a.
When the value is in the range of 005 ≦ a ≦ 1.120 and the amount of oxygen deficiency with respect to the weight after the element oxide semiconductor is completely oxidized at high temperature in oxygen is represented by b,
It is characterized in that it is within the range of 0.06 ≦ b ≦ 0.55.
【0007】次に本発明の第2番目の熱電半導体素子
は、酸化物半導体がストロンチウム酸化物、バリウム酸
化物とチタン酸化物を少なくとも構成成分とする複合酸
化物よりなり、複合酸化物組成におけるがSrとBaの
合計モル数に対するSrのモル比をc、SrとBaの合
計モル数に対するTiのモル比をdとしたとき、0.4
5≦c<1.00及び1.005≦d≦1.120の範
囲にあり、かつ素子酸化物半導体が酸素中で完全に高温
酸化した後の重量に対する酸素欠損量を重量%で表わし
た値をeとするとき、0.06≦e≦0.55の範囲内
にあることを特徴とする。Next, in the second thermoelectric semiconductor element of the present invention, the oxide semiconductor is composed of a strontium oxide, a composite oxide containing at least barium oxide and titanium oxide, and has a composite oxide composition. When the molar ratio of Sr to the total number of moles of Sr and Ba is c and the molar ratio of Ti to the total number of moles of Sr and Ba is d, 0.4
Value in the range of 5 ≦ c <1.00 and 1.005 ≦ d ≦ 1.120, and the amount of oxygen deficiency with respect to the weight after the element oxide semiconductor is completely oxidized at high temperature in weight% Is defined as e, the range is 0.06 ≦ e ≦ 0.55.
【0008】[0008]
【作用】前記本発明の第1〜2番目の発明の構成によれ
ば、少なくともストロンチウム酸化物とチタン酸化物、
またはストロンチウム酸化物、バリウム酸化物とチタン
酸化物を構成成分とする特定組成にしたので、強い毒性
を有する元素を含有せず、安全性が高く、安価でもあ
り、また熱電半導体素子としての性能が優れ特性的に安
定で工業的に有用な熱電半導体素子を提供することがで
きる。According to the first and second aspects of the present invention, at least strontium oxide and titanium oxide,
Or strontium oxide, because it has a specific composition with barium oxide and titanium oxide as constituent components, it does not contain elements with strong toxicity, is highly safe, is inexpensive, and has performance as a thermoelectric semiconductor device. It is possible to provide an industrially useful thermoelectric semiconductor device which is excellent in characteristics and stable.
【0009】[0009]
【実施例】以下、実施例を用いて本発明をさらに具体的
に説明する。 実施例1 酸化物半導体セラミック材料として、所定比のストロン
チウムとチタンの複合酸化物を用い熱電半導体素子を作
成した。酸化物半導体セラミックは出発原料としてSr
CO3 とTiO2 を用い、所定比に秤量したのちジルコ
ニア質玉石を混合媒体にして純水とともにボールミルで
混合し、乾燥した。乾燥した粉体はアルミナ坩堝にいれ
電気炉を用い空気中1100℃で12時間仮焼した。EXAMPLES The present invention will be described in more detail below with reference to examples. Example 1 A thermoelectric semiconductor element was prepared using a composite oxide of strontium and titanium in a predetermined ratio as the oxide semiconductor ceramic material. The oxide semiconductor ceramic is Sr as a starting material.
After CO 3 and TiO 2 were weighed to a predetermined ratio, they were mixed with pure water using a zirconia boulder as a mixing medium in a ball mill and dried. The dried powder was put in an alumina crucible and calcined in air at 1100 ° C. for 12 hours using an electric furnace.
【0010】仮焼した粉体は、粉末X線解析によりSr
TiO3 のペロブスカイト相が主相として観測され、一
部の組成のものにはSr2 TiO4 、Sr3 Ti2 O7
相およびTiO2 相が観測される。SrCO3 相の残存
は確認されなかった。The calcined powder was subjected to Sr by powder X-ray analysis.
A perovskite phase of TiO 3 is observed as a main phase, and Sr 2 TiO 4 and Sr 3 Ti 2 O 7 are contained in some compositions.
Phase and TiO 2 phase are observed. No residual SrCO 3 phase was confirmed.
【0011】仮焼粉はふたたびジルコニア質玉石を混合
媒体とし純水とともにボールミルで湿式粉砕し平均粒径
0.8μmの粉末とし、300℃で乾燥した。仮焼粉末
は5wt%の水を加えたのち造粒し、長さ30mm幅1
0mmの金型に2.5gの粉末を加え、700kg/c
m2 でプレスし圧粉体とした。The calcined powder was again wet-milled with pure water in a ball mill using zirconia cobblestone as a mixed medium to obtain a powder having an average particle size of 0.8 μm, and dried at 300 ° C. The calcined powder is granulated after adding 5 wt% of water, length 30 mm width 1
Add 2.5g powder to 0mm mold, 700kg / c
It was pressed at m 2 to obtain a green compact.
【0012】圧粉体はスポンジチタン粒子中に埋め込む
ように磁器製さやに入れ、管状炉に挿入し、20%水素
−アルゴンガスを流しながら1500℃で2〜24時
間、焼成時間を変えて焼成した。The green compact is placed in a porcelain sheath so as to be embedded in titanium sponge particles, inserted into a tubular furnace, and fired at 1500 ° C. for 2 to 24 hours while changing the firing time while flowing a 20% hydrogen-argon gas. did.
【0013】焼成体は両端に金電極を蒸着し、これより
リード線を取り出し、両端を別の熱板にはさみ温度差を
つけ、両端の温度と熱起電力からゼーベック係数Sを求
めた。熱起電力を測定した焼成体は、さらに中間部に2
点の電極を形成し、4端子法で試料に直流10mAを流
し初期電位差より試料の電気伝導度σを求めた。Gold electrodes were vapor-deposited on both ends of the fired body, lead wires were taken out from the ends, and both ends were sandwiched by different heating plates to give a temperature difference, and the Seebeck coefficient S was obtained from the temperature at both ends and the thermoelectromotive force. The fired body, whose thermoelectromotive force was measured, had 2
An electrode at a point was formed, a direct current of 10 mA was applied to the sample by the 4-terminal method, and the electrical conductivity σ of the sample was determined from the initial potential difference.
【0014】評価したゼーベック係数の両端の温度平均
と、電気伝導度の測定時の試料温度は35℃を検討し
た。さらに試料はリード線を外し、一端にニッケルメッ
キを施し、銅熱板にハンダ付けし、10-2Pa程度の真
空容器中にいれ、オングストローム法により熱板温度を
周期的に変動させ試料両端の温度変化をもとめ、これと
は別に行ったDSC測定より比熱を求め、これにより熱
伝導度kを求めた。The temperature average at both ends of the evaluated Seebeck coefficient and the sample temperature at the time of measuring the electric conductivity were set to 35 ° C. Furthermore, the lead wire of the sample was removed, one end was nickel-plated, soldered to a copper hot plate, placed in a vacuum container of about 10 -2 Pa, and the hot plate temperature was periodically changed by the Angstrom method to make both ends of the sample. The specific heat was obtained from the DSC measurement performed separately from the temperature change, and the thermal conductivity k was obtained.
【0015】これらの測定で得られたゼーベック係数
S、電気伝導度σと熱伝導度kより性能指数Zを求め
た。試料中の酸素欠損量は、測定後の試料のセラミック
部のみを100μm程度の粒径に粉砕した物を1500
℃酸素中で加熱しその重量変化を求め、重量増加が止ま
った加熱時間の重量変化よりもとめた。The figure of merit Z was obtained from the Seebeck coefficient S, electric conductivity σ and thermal conductivity k obtained by these measurements. The amount of oxygen deficiency in the sample is 1500 after crushing only the ceramic part of the sample after measurement to a particle size of about 100 μm.
The weight change was determined by heating in oxygen at 0 ° C, and the weight change was determined from the weight change during the heating time when the weight increase stopped.
【0016】すべての試料で合計の1500℃酸素中で
の処理時間が72時間に達すると重量増加がとまり、完
全に再酸化が終了する。試料中のSrとTiのモル比は
蛍光X線分析法により測定した。In all the samples, when the total treatment time in 1500 ° C. oxygen reached 72 hours, the weight increase stopped and the reoxidation was completely completed. The molar ratio of Sr and Ti in the sample was measured by a fluorescent X-ray analysis method.
【0017】全ての試料でSrとTiのモル比は配合組
成と焼成後の試料で変化はなく、スポンジチタンからの
Tiの拡散や、蒸発などの影響は無視できることが確認
された。表1にSrに対するTiのモル比a,酸素欠損
量b、ゼーベック係数S、電気伝導度σ、熱伝導度k、
性能指数Zを示す。It was confirmed that the molar ratios of Sr and Ti in all the samples did not change between the compounding composition and the samples after firing, and that the effects of diffusion and evaporation of Ti from titanium sponge can be ignored. In Table 1, the molar ratio a of Ti to Sr, the oxygen deficiency b, the Seebeck coefficient S, the electrical conductivity σ, the thermal conductivity k,
A performance index Z is shown.
【0018】[0018]
【表1】 [Table 1]
【0019】表1から明らかな通り、複合酸化物組成に
おけるSrに対するTiのモル比をaとしたとき1.0
05≦a≦1.120の範囲内にあり、かつ素子酸化物
半導体が酸素中で完全に高温酸化した後の重量に対する
酸素欠損量を重量%で表わした値をbとするとき、0.
06≦b≦0.55の範囲内にある熱電半導体素子は、
大きな性能指数を示すのに対し、aの値が1.005よ
り小さいものは焼結性が悪いため電気伝導度が小さく性
能指数も小さく、aの値が1.120より大きいものは
ゼーベック係数が小さくなり、性能指数も大きくならな
い。As is clear from Table 1, when the molar ratio of Ti to Sr in the composite oxide composition is a, it is 1.0.
When the value is in the range of 05 ≦ a ≦ 1.120, and the value of oxygen deficiency with respect to the weight after the element oxide semiconductor is completely oxidized in oxygen at high temperature is expressed as% by weight, b is 0.
The thermoelectric semiconductor element in the range of 06 ≦ b ≦ 0.55 is
While a large figure of merit is shown, a value of a less than 1.005 has poor sinterability and thus a low electric conductivity and a small figure of merit, and a value of more than 1.120 has a Seebeck coefficient. It becomes smaller and the figure of merit does not increase.
【0020】酸素欠損量が0.06wt%より小さいも
のは電気伝導度が小さくなり性能指数も大きくならず、
0.55wt%より大きいものはゼーベック係数が低下
し、性能指数が大きくならない。また、本発明の範囲内
の熱電半導体素子はBi−Teとほぼ同等の性能を有
し、安価でかつ安全性が高い。強い毒性を有する元素を
含有していないからである。When the oxygen deficiency is less than 0.06 wt%, the electric conductivity becomes small and the figure of merit does not become large.
If it is more than 0.55 wt%, the Seebeck coefficient is lowered and the figure of merit is not increased. Further, the thermoelectric semiconductor element within the scope of the present invention has substantially the same performance as Bi-Te, is inexpensive and has high safety. This is because it does not contain a highly toxic element.
【0021】実施例2 酸化物半導体セラミック材料として、所定比のストロン
チウムとバリウムとチタンの複合酸化物を用い熱電半導
体素子を作成した。Example 2 A thermoelectric semiconductor element was prepared by using a complex oxide of strontium, barium and titanium in a predetermined ratio as the oxide semiconductor ceramic material.
【0022】酸化物半導体セラミックは出発原料として
SrCO3 、BaCO3 とTiO2を用い、所定比に秤
量したのちジルコニア質玉石を混合媒体にして純水とと
もにボールミルで混合し、乾燥した。乾燥した粉体はア
ルミナ坩堝に入れ電気炉を用い空気中1100℃で12
時間仮焼した。仮焼粉はふたたびジルコニア質玉石を混
合媒体とし純水とともにボールミルで湿式粉砕し平均粒
径0.8μmの粉末とし、300℃で乾燥した。The oxide semiconductor ceramics were prepared by using SrCO 3 , BaCO 3 and TiO 2 as starting materials, weighing them to a predetermined ratio, mixing them with pure water using a zirconia boulder as a mixing medium in a ball mill, and then drying. The dried powder is put in an alumina crucible and heated in air at 1100 ° C for 12 hours using an electric furnace.
I calcined for an hour. The calcined powder was again wet-milled with pure water in a ball mill using zirconia cobblestone as a mixed medium to obtain a powder having an average particle size of 0.8 μm, and dried at 300 ° C.
【0023】仮焼粉末は5wt%の水を加えたのち造粒
し長さ30mm幅10mmの金型に2.5gの粉末を加
え700kg/cm2 でプレスし圧粉体とした。圧粉体
はスポンジチタン粒子中に埋め込むように磁器製さやに
いれ管状炉に挿入し20%水素−アルゴンガスを流しな
がら1500℃で2〜24時間、焼成時間を変えて焼成
した。The calcined powder was granulated after adding 5 wt% of water, 2.5 g of the powder was added to a mold having a length of 30 mm and a width of 10 mm, and pressed at 700 kg / cm 2 to obtain a green compact. The green compact was put in a porcelain sheath so as to be embedded in titanium sponge particles, inserted into a tubular furnace, and fired at 1500 ° C. for 2 to 24 hours while changing the firing time while flowing a 20% hydrogen-argon gas.
【0024】焼成体は両端に金電極を蒸着しこれよりリ
ード線を取り出し、両端を別の熱板にはさみ温度差をつ
け、両端の温度と熱起電力からゼーベック係数Sをもと
めた。熱起電力を測定した焼成体はさらに中間部に2点
の電極を形成し、4端子法で試料に直流10mAを流し
初期電位差より試料の電気伝導度σをもとめた。Gold electrodes were vapor-deposited on both ends of the fired body, lead wires were taken out from the both ends, both ends were sandwiched by different heating plates to make a temperature difference, and the Seebeck coefficient S was obtained from the temperatures at both ends and the thermoelectromotive force. In the fired body whose thermoelectromotive force was measured, two electrodes were further formed in the middle portion, a direct current of 10 mA was applied to the sample by the 4-terminal method, and the electrical conductivity σ of the sample was determined from the initial potential difference.
【0025】評価したゼーベック係数の両端の温度平均
と、電気伝導度の測定時の試料温度は実施例同様の35
℃を検討した。さらに試料はリード線を外し、一端にニ
ッケルメッキを施し、銅熱板にハンダ付けし、10-2P
a程度の真空容器中にいれ、オングストローム法により
熱板温度を周期的に変動させ試料両端の温度変化をもと
め、これとは別に行ったDSC測定より比熱をもとめ、
これにより熱伝導度kをもとめた。これらの測定で得ら
れたゼーベック係数S、電気伝導度σと熱伝導度kより
性能指数Zを求めた。The temperature average at both ends of the evaluated Seebeck coefficient and the sample temperature at the time of measuring the electric conductivity are the same as those in the example.
℃ was examined. Furthermore, for the sample, remove the lead wire, apply nickel plating to one end, solder to a copper hot plate, and apply 10 -2 P
Put in a vacuum container of about a, and periodically change the temperature of the hot plate by the Angstrom method to determine the temperature change at both ends of the sample. Determine the specific heat from the DSC measurement separately performed.
With this, the thermal conductivity k was obtained. The figure of merit Z was obtained from the Seebeck coefficient S, electric conductivity σ, and thermal conductivity k obtained by these measurements.
【0026】試料中の酸素欠損量は実施例1と同様の方
法で求めた。The amount of oxygen deficiency in the sample was determined by the same method as in Example 1.
【0027】[0027]
【表2】 [Table 2]
【0028】表2にSrとBaの合計モル数に対するS
rのモル比c、SrとBaの合計モル数に対するTiの
モル比d、および,酸素欠損量e、と35℃におけるゼ
ーベック係数S、電気伝導度σ、熱伝導度k、性能指数
Zを示す。Table 2 shows S relative to the total number of moles of Sr and Ba.
The molar ratio c of r, the molar ratio d of Ti to the total number of moles of Sr and Ba, and the oxygen deficiency e, and the Seebeck coefficient S at 35 ° C., the electrical conductivity σ, the thermal conductivity k, and the figure of merit Z are shown. ..
【0029】表2から明らかな通り、ストロンチウム酸
化物、バリウム酸化物とチタン酸化物からなる複合酸化
物よりなり、複合酸化物組成におけるがSrとBaの合
計モル数に対するSrのモル比をc、SrとBaの合計
モル数に対するチタンのモル比をdとしたとき0.45
≦c<1.00、及び1.005≦d≦1.120の範
囲にあり、かつ素子酸化物半導体が酸素中で完全に高温
酸化した後の重量に対する酸素欠損量を重量%で表わし
た値をeとするとき0.06≦e≦0.55の範囲内に
ある熱電半導体素子は、大きな性能指数を示すのに対
し、cの値が0.45より小さいものは電気伝導度が小
さく性能指数も大きくならない。As is clear from Table 2, a composite oxide composed of strontium oxide, barium oxide and titanium oxide is used. In the composite oxide composition, the molar ratio of Sr to the total number of moles of Sr and Ba is c, When the molar ratio of titanium to the total number of moles of Sr and Ba is d, 0.45
Value in the range of ≦ c <1.00 and 1.005 ≦ d ≦ 1.120, and the amount of oxygen deficiency relative to the weight after the element oxide semiconductor is completely oxidized in oxygen at high temperature, expressed as a weight percentage. Where e is a thermoelectric semiconductor element having a large figure of merit in the range of 0.06 ≦ e ≦ 0.55, a value of c smaller than 0.45 has a low electric conductivity and a low performance. The index also does not increase.
【0030】dの値が1.005より小さいものは焼結
性が悪いため電気伝導度が小さく性能指数も小さく、d
の値が1.120より大きいものはゼーベック係数が小
さくなり、性能指数も大きくならない。If the value of d is less than 1.005, the sinterability is poor, so the electrical conductivity is small and the figure of merit is also small.
If the value of is larger than 1.120, the Seebeck coefficient becomes small and the figure of merit does not become large.
【0031】酸素欠損量eの値がが0.06wt%より
小さいものは電気伝導度が小さくなり性能指数も大きく
ならず、0.55wt%より大きいものはゼーベック係
数が低下し、性能指数が大きくならない。When the oxygen deficiency amount e is less than 0.06 wt%, the electrical conductivity is small and the figure of merit does not increase. When it is more than 0.55 wt%, the Seebeck coefficient is low and the figure of merit is large. I won't.
【0032】本発明の範囲内の熱電半導体素子は、Bi
−Teとほぼ同等の性能を有し、安価でかつ強い毒性を
有する元素を含有していないので安全性が高く、工業的
に有用な新たな熱電半導体素子を提供することができ
る。特に電子冷却用電子部品などに有用である。Thermoelectric semiconductor elements within the scope of the present invention include Bi
It is possible to provide a new thermoelectric semiconductor element which has substantially the same performance as that of -Te, is inexpensive, does not contain an element having strong toxicity, is highly safe, and is industrially useful. It is particularly useful for electronic components for electronic cooling.
【0033】[0033]
【発明の効果】以上説明した通り、本発明の第1〜2番
目の発明によれば、少なくともストロンチウム酸化物と
チタン酸化物、またはストロンチウム酸化物、バリウム
酸化物とチタン酸化物を構成成分とする特定組成にした
ので、強い毒性を有する元素を含有せず、安全性が高
く、安価でもあり、また熱電半導体素子としての性能が
優れ特性的に安定で工業的に有用な熱電半導体素子を提
供することができる。As described above, according to the first and second aspects of the present invention, at least strontium oxide and titanium oxide, or strontium oxide, barium oxide and titanium oxide are used as constituent components. Since it has a specific composition, it does not contain a highly toxic element, is highly safe, is also inexpensive, and has excellent performance as a thermoelectric semiconductor element, which is characteristically stable and industrially useful. be able to.
【0034】のまた本発明の熱電半導体素子は、従来の
Bi−Te系材料にほぼ匹敵する特性が得られ、かつ材
料として毒性が問題なく、従来のセラミックプロセスを
用いて簡単に製造でき、また原料自体が安価であるため
総合的なコストダウンがはかれるなどの利点を有してお
り工業的に有用である。Further, the thermoelectric semiconductor device of the present invention has characteristics almost comparable to those of the conventional Bi-Te-based material, has no toxicity as a material, and can be easily manufactured by using the conventional ceramic process. Since the raw material itself is inexpensive, it has advantages such as comprehensive cost reduction, and is industrially useful.
Claims (2)
おいて、酸化物半導体がストロンチウム酸化物とチタン
酸化物を少なくとも構成成分とする複合酸化物よりな
り、複合酸化物組成におけるSrに対するTiのモル比
をaとしたとき、1.005≦a≦1.120の範囲内
にあり、かつ素子酸化物半導体が酸素中で完全に高温酸
化した後の重量に対する酸素欠損量を重量%で表わした
値をbとするとき、0.06≦b≦0.55の範囲内に
あることを特徴とする熱電半導体素子。1. A thermoelectric semiconductor device using an oxide semiconductor, wherein the oxide semiconductor is a composite oxide containing strontium oxide and titanium oxide as at least constituents, and the molar ratio of Ti to Sr in the composite oxide composition. Where a is in the range of 1.005 ≦ a ≦ 1.120, and the oxygen deficiency amount with respect to the weight after the element oxide semiconductor is completely oxidized at high temperature in oxygen is expressed as a weight percentage. A thermoelectric semiconductor element having a range of 0.06 ≦ b ≦ 0.55 when b.
おいて、酸化物半導体がストロンチウム酸化物、バリウ
ム酸化物とチタン酸化物を少なくとも構成成分とする複
合酸化物よりなり、複合酸化物組成におけるがSrとB
aの合計モル数に対するSrのモル比をc、SrとBa
の合計モル数に対するTiのモル比をdとしたとき、
0.45≦c<1.00及び1.005≦d≦1.12
0の範囲にあり、かつ素子酸化物半導体が酸素中で完全
に高温酸化した後の重量に対する酸素欠損量を重量%で
表わした値をeとするとき、0.06≦e≦0.55の
範囲内にあることを特徴とする熱電半導体素子。2. A thermoelectric semiconductor device using an oxide semiconductor, wherein the oxide semiconductor is composed of strontium oxide, a composite oxide containing at least barium oxide and titanium oxide, and Sr in the composite oxide composition is Sr. And B
The molar ratio of Sr to the total number of moles of a is c, Sr and Ba
When the molar ratio of Ti to the total number of moles of is d,
0.45 ≦ c <1.00 and 1.005 ≦ d ≦ 1.12
In the range of 0, and when the value of oxygen deficiency with respect to the weight after the element oxide semiconductor is completely oxidized at high temperature in oxygen is expressed as weight%, e is 0.06 ≦ e ≦ 0.55. A thermoelectric semiconductor device characterized by being within the range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04015888A JP3088039B2 (en) | 1992-01-31 | 1992-01-31 | Thermoelectric semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04015888A JP3088039B2 (en) | 1992-01-31 | 1992-01-31 | Thermoelectric semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05218511A true JPH05218511A (en) | 1993-08-27 |
| JP3088039B2 JP3088039B2 (en) | 2000-09-18 |
Family
ID=11901334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04015888A Expired - Fee Related JP3088039B2 (en) | 1992-01-31 | 1992-01-31 | Thermoelectric semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3088039B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004363576A (en) * | 2003-05-15 | 2004-12-24 | Toyota Central Res & Dev Lab Inc | Thermoelectric material |
| JP2015170707A (en) * | 2014-03-06 | 2015-09-28 | 富士通株式会社 | Thermoelectric conversion element and method of manufacturing the same |
-
1992
- 1992-01-31 JP JP04015888A patent/JP3088039B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004363576A (en) * | 2003-05-15 | 2004-12-24 | Toyota Central Res & Dev Lab Inc | Thermoelectric material |
| JP2015170707A (en) * | 2014-03-06 | 2015-09-28 | 富士通株式会社 | Thermoelectric conversion element and method of manufacturing the same |
| US10347810B2 (en) | 2014-03-06 | 2019-07-09 | Fujitsu Limited | Thermoelectric conversion element and method for producing the same |
| US10672965B2 (en) | 2014-03-06 | 2020-06-02 | Fujitsu Limited | Method for producing thermoelectric conversion element |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3088039B2 (en) | 2000-09-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5275001A (en) | Thermoelectric cooling device | |
| EP4099411A1 (en) | Thermoelectric conversion module | |
| FR2613118A1 (en) | CONDUCTIVE OXYAZOTE PEROVSKITES, THEIR PREPARATION AND THEIR USE ESPECIALLY AS ELECTRODE MATERIAL | |
| JP2000012915A (en) | Thermoelectric conversion material | |
| JP3088039B2 (en) | Thermoelectric semiconductor element | |
| JP4078414B2 (en) | Lanthanum sulfide sintered body and manufacturing method thereof | |
| JP2777508B2 (en) | Electronic cooling element | |
| CN101156256A (en) | Thermoelectric conversion material, method for producing same, and thermoelectric conversion element | |
| JPH08231223A (en) | Thermoelectric conversing material | |
| JPH05129667A (en) | Thermoelectric semiconductor element and manufacture thereof | |
| JPH07231122A (en) | Oxide thermoelectric conversion material | |
| JP2808580B2 (en) | Thermoelectric semiconductor materials | |
| NISHIYAMA et al. | Electrical Conductivity and Thermoelectricity of ZnSb2O6 and (Zn1-xMx) Sb2O6 (M= Co, Ni, Cu) Ceramics | |
| JPH0196055A (en) | Superconductive ceramic composition | |
| JPWO2020090489A1 (en) | Thermistor sintered body and temperature sensor element | |
| JPH08242021A (en) | Manufacturing method for thermoelectricity converting material | |
| JP2001127350A (en) | Thermoelectric conversion material and thermoelectric conversion element | |
| JPS63260853A (en) | Superconductive material | |
| JPH06135723A (en) | Electrically conductive material made of lead / palladium oxide compound having orthorhombic structure represented by general formula PbPdO2 | |
| JP2000012914A (en) | Thermoelectric conversion material and thermoelectric conversion element | |
| JP4070110B2 (en) | Thermoelectric conversion material comprising Ln2S3 sintered body and method for producing the same | |
| JPH11340519A (en) | Oxide members for thermoelectric conversion elements | |
| JP2003282968A (en) | Oxide thermoelectric conversion material | |
| JPH11266038A (en) | Thermoelectric conversion material and thermoelectric conversion element | |
| JPS62296401A (en) | Barium titanate system semiconductor and manufacture of the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |