JPH0545945B2 - - Google Patents
Info
- Publication number
- JPH0545945B2 JPH0545945B2 JP61118862A JP11886286A JPH0545945B2 JP H0545945 B2 JPH0545945 B2 JP H0545945B2 JP 61118862 A JP61118862 A JP 61118862A JP 11886286 A JP11886286 A JP 11886286A JP H0545945 B2 JPH0545945 B2 JP H0545945B2
- Authority
- JP
- Japan
- Prior art keywords
- reticle
- light
- measurement
- pellicle
- dust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N2021/4704—Angular selective
- G01N2021/4711—Multiangle measurement
- G01N2021/4719—Multiangle measurement using a optical fibre array
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95676—Masks, reticles, shadow masks
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は表面状態測定装置に関し、特に半導体
製造装置で使用される回路パターンが形成されて
いるレチクルやフオトマスク等の基板上及び基板
にペリクル保護膜を装着したときのペリクル保護
膜面上に例えば不透過性のゴミ等の異物が付着し
ていたときに、この異物を精度良く検出する表面
状態測定装置に関するものである。Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a surface condition measuring device, and in particular to a surface condition measuring device used in semiconductor manufacturing equipment, on a substrate such as a reticle or a photomask on which a circuit pattern is formed, and a pellicle protection device on the substrate. The present invention relates to a surface condition measuring device that accurately detects foreign matter such as impermeable dust when it is attached to the surface of a pellicle protective film when the membrane is attached.
(従来の技術)
一般にIC製造工程においてはレチクルやフオ
トマスク等の基板上に形成されている露光用の回
路パターンを半導体焼付け装置(ステツパー又は
マスクアライナー)によりレジストが塗布された
ウエハ面上に転写して製造している。(Prior Art) Generally, in the IC manufacturing process, a circuit pattern for exposure formed on a substrate such as a reticle or photomask is transferred onto a wafer surface coated with resist using a semiconductor printing device (stepper or mask aligner). Manufactured by
このとき基板面上にゴミ等の異物が存在すると
回路パターンをウエハ面上に転写する際、異物も
同時に転写されてしまいIC製造の歩留りを低下
させる原因となつてくる。 At this time, if foreign matter such as dust is present on the substrate surface, when the circuit pattern is transferred onto the wafer surface, the foreign matter will also be transferred at the same time, causing a reduction in the yield of IC manufacturing.
特にステツプアンドリピート方式によりレチク
ル面上の回路パターンをウエハ面上に繰り返して
投影露光する場合にはレチクル面上の1つのゴミ
がウエハ全面に焼付けられてしまい歩留りを大き
く低下させる原因となつてくる。 In particular, when a step-and-repeat method is used to repeatedly project and expose a circuit pattern on the reticle surface onto the wafer surface, a single piece of dust on the reticle surface is printed onto the entire wafer surface, causing a significant decrease in yield. .
この為近年IC製造過程においては基板上の異
物の存在を検出するのが不可欠となつており、従
来より種々の検査方法が提案されている。例えば
第2図Aは異物が等方的に光を散乱する性質を利
用する方法の一例である。 Therefore, in recent years, it has become essential to detect the presence of foreign matter on a substrate in the IC manufacturing process, and various inspection methods have been proposed. For example, FIG. 2A is an example of a method that utilizes the property of foreign matter to scatter light isotropically.
同図においてレーザー20から放射された光束
をf−θレンズ22の入射瞳近傍に配置したポリ
ゴンミラー21で反射させ、f−θレンズ22を
通過させた後、収差補正板23を介してレチクル
24面上を不図示のレチクルステージを矢印27
方向に沿つて移動させながら順次走査している。 In the same figure, a light beam emitted from a laser 20 is reflected by a polygon mirror 21 placed near the entrance pupil of an f-theta lens 22, and after passing through the f-theta lens 22, it is passed through an aberration correction plate 23 to a reticle 20. Arrow 27 points the reticle stage (not shown) on the surface.
It scans sequentially while moving along the direction.
一般にレチクル24面上の回路パターンは殆ど
が規則性を有している為、回路パターンから生ず
る回折光もある規則に従つた方向に射出する。 In general, most of the circuit patterns on the surface of the reticle 24 have regularity, so that the diffracted light generated from the circuit patterns is also emitted in a direction following a certain rule.
一方レチクル24面のゴミからは等方向に散乱
光が生ずる。従つてこのとき集光レンズ26−1
と受光器26−2から成る検出系26を回路パタ
ーンから生ずる回折光の射出方向と異つた方向に
配置することによりゴミから生ずる散乱光のみを
検出するようにしている。 On the other hand, dust on the surface of the reticle 24 generates scattered light in the same direction. Therefore, at this time, the condenser lens 26-1
By arranging the detection system 26, which includes a detector 26-2 and a light receiver 26-2, in a direction different from the emission direction of the diffracted light generated from the circuit pattern, only the scattered light generated from dust is detected.
しかしながらこの方法はレチクル24の表面と
裏面を各々光束で走査し、測定する必要があり、
多くの時間を要し、又機構的に大変面倒であつ
た。 However, with this method, it is necessary to scan and measure the front and back surfaces of the reticle 24 with a beam of light.
It took a lot of time and was mechanically very troublesome.
又第2図Bに示すようにレチクル24の上下に
ペリクル保護膜28a,28bを装着したときは
ペリクル面にもゴミが付着してくる場合もある。
この場合検出系26によりどの面にゴミが付着し
ているのかも判別しなければならなく、この判別
を精度良く行うのは大変難しく又機構的にも大変
複雑になつてくる傾向があつた。 Furthermore, when pellicle protective films 28a and 28b are attached to the top and bottom of the reticle 24 as shown in FIG. 2B, dust may also adhere to the pellicle surface.
In this case, it is necessary to use the detection system 26 to determine which surface the dust is attached to, and it is very difficult to accurately perform this determination, and the mechanism tends to become very complicated.
(発明が解決しようとする問題点)
本発明はレチクルやフオトマスク等の基板面上
のゴミや欠陥等の異物の存在及び大きさ更には基
板にペリクル保護膜を装着し被測定面の数が増加
した場合でもどの面に異物が存在しているのかを
高精度にしかも短時間に容易に測定することので
きる、特に半導体製造装置に好適な表面状態測定
装置の提供を目的とする。(Problems to be Solved by the Invention) The present invention solves the problem of the presence and size of foreign objects such as dust and defects on the surface of a substrate such as a reticle or photomask, and also increases the number of surfaces to be measured by attaching a pellicle protective film to the substrate. It is an object of the present invention to provide a surface condition measuring device which is particularly suitable for semiconductor manufacturing equipment and can easily measure on which surface a foreign substance is present even when a foreign substance is present with high precision and in a short time.
(問題点を解決する為の手段)
積層している複数の測定面の表面状態を測定す
るために利用される第1及び第2光束を異なる方
向から前記測定面に入射させながら前記測定面を
前記第1及び第2光束で同時に走査すると共に、
前記第1光束の入射方向と走査方向により定義さ
れる第1平面と前記第2光束の入射方向と走査方
向により定義される第2平面の交線が前記測定面
と交差しないように前記第1及び第2光束の関係
が設定されていることである。(Means for Solving the Problem) The measurement surface is measured while the first and second light beams used for measuring the surface condition of a plurality of laminated measurement surfaces are incident on the measurement surface from different directions. Scanning simultaneously with the first and second beams,
The first plane is arranged such that the intersection line of the first plane defined by the incident direction and scanning direction of the first luminous flux and the second plane defined by the incident direction and scanning direction of the second luminous flux does not intersect the measurement surface. and the relationship between the second luminous flux is set.
この他本発明の特徴は実施例において記載され
ている。 Other features of the invention are described in the Examples.
(実施例)
第1図Aは本発明の一実施例の光学系の概略図
である。(Embodiment) FIG. 1A is a schematic diagram of an optical system according to an embodiment of the present invention.
同図において1はレチクル、1a,1bは各々
レチクル表面とレチクル裏面、2a,2bは各々
レチクル1面上にゴミが付着するのを防止する為
のペリクル上面とペリクル下面、3,4は各々不
図示の光源、例えばレーザーからの光束であり、
同じく不図示のポリゴンミラー等の走査手段によ
り光束3はペリクル上面2aとレチクル裏面1b
を、光束4はペリクル下面2bとレチクル上面1
aを各々紙面と垂直方向に走査している。5a〜
5dは各々複数のセルフオツクレンズを一次元方
向に配置した光学部材であり、各々の光学部材5
a〜5dは各々測定面2a,1b,1a,2bに
焦点を合わしている。6a〜6dは各々光学部材
5a〜6dを介した各測定面と共役な位置近傍に
配置した視野絞り、7a〜7dは各々の視野絞り
6a〜6dを通過した光束を受光器8a〜8dに
導光する為のライトガイドである。 In the figure, 1 is the reticle, 1a and 1b are the front and back surfaces of the reticle, 2a and 2b are the upper and lower surfaces of the pellicle to prevent dust from adhering to the reticle 1, respectively, and 3 and 4 are the non-reticle surfaces. a light beam from the illustrated light source, e.g. a laser;
Similarly, by a scanning means such as a polygon mirror (not shown), the light beam 3 is directed to the pellicle top surface 2a and the reticle back surface 1b.
, the light beam 4 is between the pellicle lower surface 2b and the reticle upper surface 1.
a is scanned in a direction perpendicular to the plane of the paper. 5a~
Each optical member 5d has a plurality of self-cleaning lenses arranged in a one-dimensional direction.
a to 5d focus on measurement surfaces 2a, 1b, 1a, 2b, respectively. Reference numerals 6a to 6d refer to field stops disposed near positions conjugate with the respective measurement surfaces through the optical members 5a to 6d, and 7a to 7d guide the light beams that have passed through the respective field stops 6a to 6d to light receivers 8a to 8d. It is a light guide for shining light.
本実施例における光学部材5a、視野絞り6
a、ライトガイド7aそして受光器8aは検出手
段9aの一部を構成している。他の光学部材5b
〜5d、視野絞り6b〜6d、ライトガイド7b
〜7d、受光器8b〜8dについても同様に各々
検出手段9b,9c,9dの一部を構成してい
る。 Optical member 5a and field stop 6 in this embodiment
a, the light guide 7a, and the light receiver 8a constitute a part of the detection means 9a. Other optical member 5b
~5d, field diaphragm 6b~6d, light guide 7b
7d and the light receivers 8b to 8d also constitute a part of the detection means 9b, 9c, and 9d, respectively.
本実施例ではレチクル上面1a、レチクル下面
1b、ペリクル上面2aそしてペリクル下面2b
は各々測定面となつている。 In this embodiment, the reticle upper surface 1a, the reticle lower surface 1b, the pellicle upper surface 2a, and the pellicle lower surface 2b.
are each a measurement plane.
尚本実施例において4つの光束を用い各々の測
定面を光束を入射させ走査しても良い。 In this embodiment, four light beams may be used to make the light beams incident on each measurement surface and scan them.
第1図Bは第1図Aの一部分の斜視図であり、
同図は第1図Aの光束3と光束4とが測定面を走
査する状態を示している。 FIG. 1B is a perspective view of a portion of FIG. 1A;
This figure shows a state in which the light beams 3 and 4 of FIG. 1A scan the measurement surface.
又第1図Cは第1図Bの矢印10方向から見た
ときの概略図である。 Further, FIG. 1C is a schematic diagram when viewed from the direction of arrow 10 in FIG. 1B.
本実施例では第1図B,Cに示すように、各々
の測定面を走査する光束によつて形成される複数
の平面のうち任意の2つの平面を選択したとき、
これらの2つの平面より形成される交線lが各々
の測定面のいずれとも交差しないように光束を測
定面上に入射させ走査するようにしている。 In this embodiment, as shown in FIGS. 1B and 1C, when any two planes are selected from among the plurality of planes formed by the light beams scanning each measurement surface,
The light beam is made incident on the measurement surface and scanned so that the intersection line l formed by these two planes does not intersect any of the measurement surfaces.
第1図Aに示す実施例では光束3はペリクル上
面2aとレチクル下面1bを走査している為、ペ
リクル上面2aとレチクル下面1bを走査する光
束によつて形成される平面は同一となる。 In the embodiment shown in FIG. 1A, since the light beam 3 scans the pellicle upper surface 2a and the reticle lower surface 1b, the planes formed by the light beams scanning the pellicle upper surface 2a and the reticle lower surface 1b are the same.
又光束4も光束3と同様であり、ペリクル下面
2bとレチクル上面1aを走査している為、ペリ
クル下面2bとレチクル上面1aを走査する光束
によつて形成される平面は同一となる。 Also, the light beam 4 is similar to the light beam 3, and since it scans the pellicle lower surface 2b and the reticle upper surface 1a, the planes formed by the light beams scanning the pellicle lower surface 2b and the reticle upper surface 1a are the same.
従つて本実施例では平面は全体として2つ存在
することになり(4つの光束を用いたときは4つ
の平面が存在することになる。)これら2つの平
面が形成する交線lが第1図Cに示すようにいず
れの測定面とも交差しないようにしている。 Therefore, in this example, there are two planes in total (when four light beams are used, there are four planes).The intersection line l formed by these two planes is the first plane. As shown in Figure C, it is made so that it does not intersect with any measurement plane.
次に本実施例の動作について第1図A,B,C
を用いて説明する。 Next, regarding the operation of this embodiment, Fig. 1 A, B, and C.
Explain using.
今、仮りに測定面2a上の位置にゴミ等の異物
Pが存在しているとする。そうすると光束3が異
物Pに当たると異物からは等方的に散乱光が生じ
る。このとき検出手段9aは測定面2aに焦点が
合わされている為に光学部材5aは散乱光束を効
率的に集光する。この結果受光器8aからの出力
は増大する。 Now, suppose that a foreign object P such as dust exists at a position on the measurement surface 2a. Then, when the light beam 3 hits the foreign object P, the foreign object generates isotropically scattered light. At this time, since the detection means 9a is focused on the measurement surface 2a, the optical member 5a efficiently condenses the scattered light flux. As a result, the output from the light receiver 8a increases.
一方、他の検出手段9b,9c,9dは各々の
測定面1b,1a,2bと共役の位置近傍には視
野絞り6b,6c,6dが配置されているので測
定面2a上の異物Pからの散乱光束は視野絞り6
b,6c,6dによつて遮光される。この結果受
光器8b,8c,8dからの出力は変化しない。 On the other hand, the other detection means 9b, 9c, and 9d have field stops 6b, 6c, and 6d arranged near the conjugate positions of the respective measurement surfaces 1b, 1a, and 2b, so that the detection means 9b, 9c, and 9d are free from the foreign matter P on the measurement surface 2a. The scattered light flux is field aperture 6
b, 6c, and 6d. As a result, the outputs from the light receivers 8b, 8c, and 8d do not change.
本実施例では、このときの4つの受光器8a〜
8dからの出力信号を利用して測定面上の異物の
存在の検出及び受光器8a〜8dからの出力信号
の大小を測定することにより異物の大小も同時に
判別している。 In this embodiment, the four light receivers 8a to 8a at this time are
The presence of foreign matter on the measurement surface is detected using the output signal from 8d, and the size of the foreign matter is determined at the same time by measuring the magnitude of the output signals from the light receivers 8a to 8d.
又複数の検出手段を用いることにより高速に異
物の存在を検出している。 Furthermore, by using a plurality of detection means, the presence of foreign matter can be detected at high speed.
これに対して第3図Aは第1図Cに示す実施例
と同様に光束3でペリクル上面2aとレチクル裏
面1bを走査し、光束4でペリクル下面2bとレ
チクル表面1aを走査し、検出手段31aがペリ
クル上面2aからの散乱光を検出する為に配置さ
れている場合であるが複数の光束を測定面に入射
させるとき本実施例と異なるのはペリクル上面2
aを走査する光束によつて形成される平面とレチ
クル表面1aを走査する光束によつて形成される
平面の2つの平面が形成する交線lが測定面の1
つであるペリクル上面2aと交差してしまつてい
ることである。 On the other hand, in FIG. 3A, similarly to the embodiment shown in FIG. 1C, the light beam 3 scans the pellicle top surface 2a and the reticle back surface 1b, the light beam 4 scans the pellicle bottom surface 2b and the reticle surface 1a, and the detection means 31a is arranged to detect scattered light from the pellicle top surface 2a, but when a plurality of light beams are incident on the measurement surface, the difference from this embodiment is that the pellicle top surface 2
The intersection line l formed by two planes, the plane formed by the light beam scanning a and the plane formed by the light beam scanning the reticle surface 1a, is 1 of the measurement surface.
The problem is that it intersects with the upper surface 2a of the pellicle.
この場合は第3図Aに示すように光束4がペリ
クル上面2aに入射する場合と第3図Bに示すよ
うにCr或いはCrO2等から成る回路パターンに入
射しペリクル上面2aに到達しない場合とが生
じ、これら2つの場合によつてペリクル上面2a
に照度ムラが生じている。 In this case, as shown in FIG. 3A, the light beam 4 is incident on the pellicle top surface 2a , and as shown in FIG. occurs, and depending on these two cases, the pellicle top surface 2a
There is uneven illumination.
一般に測定面上に存在するゴミより生ずる散乱
光の強さはゴミの大きさに比例する。この為多く
の場合、検出手段からの出力信号の大きさを測定
すれば、ゴミの大きさもある程度判別できる。 Generally, the intensity of scattered light generated by dust present on a measurement surface is proportional to the size of the dust. Therefore, in many cases, the size of dust can be determined to some extent by measuring the size of the output signal from the detection means.
しかしながら前述のように測定面上に照度ムラ
があるとゴミの大きさが同じであつても、その存
在位置によつて検出手段からの出力信号が変化し
てしまいゴミの大きさを精度良く判別するのが困
難になつてくる。 However, as mentioned above, if there is uneven illumination on the measurement surface, even if the size of the dust is the same, the output signal from the detection means will change depending on its location, making it difficult to accurately determine the size of the dust. It becomes difficult to do so.
この為本実施例では第1図Cに示すように各々
の測定面を走査する光束によつて形成される複数
の平面のうち、任意の2つの平面を選択したと
き、それら2つの平面によつて形成される交線が
いずれの測定面とも交差しないように光束を測定
面上に入射させ走査している。 Therefore, in this embodiment, when any two planes are selected from among the plurality of planes formed by the light beams scanning each measurement surface as shown in FIG. The light beam is incident on the measurement surface and scanned so that the line of intersection formed by the measurement surface does not intersect with any measurement surface.
これにより検出手段9aで検出する測定面2a
上の位置の照度ムラの発生を防止し、ゴミ等の異
物の存在している面を検出すると共に検出手段か
らの出力信号の大小により異物の大きさも同時に
判別するのを容易にしている。 As a result, the measurement surface 2a detected by the detection means 9a
This prevents the occurrence of uneven illuminance at the upper position, detects the surface where foreign matter such as dust is present, and makes it easy to simultaneously determine the size of the foreign matter based on the magnitude of the output signal from the detection means.
第4図〜第7図は各々本発明の他の一実施例の
一部分の概略図であり、各々第1図Cと同様のも
のである。 4 to 7 are schematic diagrams of portions of other embodiments of the present invention, each of which is similar to FIG. 1C.
第4図では測定面2a,1bを走査する光束3
によつて形成される平面と測定面2b,1aを走
査する光束4によつて形成される平面の2つの平
面が形成する交線lがペリクル上面2aとレチク
ル下面1bとの間にある場合である。 In FIG. 4, the light beam 3 scanning the measurement surfaces 2a and 1b
When the intersection line l formed by two planes, the plane formed by be.
第5図は光束3がレチクル1に垂直入射する場
合、第6図は光束4により走査されるレクチル表
面1aからの散乱光を検出手段9cにより垂直に
受光する場合、第7図は2つの光束3,4をペリ
クル上面2aとペリクル下面2bより互いに平行
となるように入射し走査する場合である。 5 shows the case where the light beam 3 is vertically incident on the reticle 1, FIG. 6 shows the case where the detection means 9c vertically receives the scattered light from the reticle surface 1a scanned by the light beam 4, and FIG. 7 shows the case where the two light beams are incident on the reticle 1. 3 and 4 are incident on the pellicle upper surface 2a and the pellicle lower surface 2b so as to be parallel to each other and are scanned.
いずれの実施例においても前述の交線lがいず
れの測定面とも交差しないように各要素を構成し
ている。 In each embodiment, each element is constructed so that the above-mentioned intersection line l does not intersect with any measurement surface.
尚本実施例では前述の交線lが測定面上と交差
しなければ、どこに存在していても良い。 In this embodiment, the above-mentioned intersection line l may exist anywhere as long as it does not intersect with the measurement surface.
(発明の効果)
本発明によれば各々の測定面を走査する光束に
よつて形成される複数の平面のうち、任意の2つ
の平面を選択したとき、それら2つの平面により
形成される交線がいずれの測定面とも交差しない
ように各要素を構成することにより、異物の存在
する測定面を精度良く、短時間で検出することが
でき、かつ異物の大きさも同時に高精度に判別す
ることのできる表面状態測定装置を達成すること
ができる。(Effects of the Invention) According to the present invention, when any two planes are selected from among the plurality of planes formed by the light beams scanning each measurement surface, the intersection line formed by these two planes. By configuring each element so that the surface does not intersect with any measurement surface, it is possible to detect the measurement surface where a foreign object is present with high accuracy and in a short time, and the size of the foreign object can also be determined with high precision at the same time. It is possible to achieve a surface condition measuring device that can
第1図Aは本発明の一実施例の光学系の概略
図、第1図B,Cは各々第1図の一部分の説明
図、第2図A,Bは各々従来の一実施例の説明
図、第3図A,Bは本発明の構成を比較する為の
説明図、第4図から第7図は各々本発明の他の一
実施例の一部分の説明図である。図中1はレチク
ル、2a,2bは各ペリクル上面とペリクル下
面、3,4は光束、9a,9b,9c,9dは
各々検出手段、lは交線、Pはゴミである。
FIG. 1A is a schematic diagram of an optical system according to an embodiment of the present invention, FIGS. 1B and C are each an explanatory diagram of a part of FIG. 1, and FIGS. 2A and B are each an illustration of a conventional embodiment. 3A and 3B are explanatory diagrams for comparing the configurations of the present invention, and FIGS. 4 to 7 are explanatory diagrams of parts of other embodiments of the present invention, respectively. In the figure, 1 is a reticle, 2a and 2b are the upper and lower surfaces of each pellicle, 3 and 4 are luminous fluxes, 9a, 9b, 9c, and 9d are detection means, 1 is an intersection line, and P is dust.
Claims (1)
するために利用される第1及び第2光束を異なる
方向から前記測定面に入射させながら前記測定面
を前記第1及び第2光束で同時に走査すると共
に、前記第1光束の入射方向と走査方向により定
義される第1平面と前記第2光束の入射方向と走
査方向により定義される第2平面の交線が前記測
定面と交差しないように前記第1及び第2光束の
関係が設定されていることを特徴とする表面状態
測定装置。1. Simultaneously illuminate the measurement surface with the first and second light beams, which are used to measure the surface condition of a plurality of laminated measurement surfaces, while making them incident on the measurement surface from different directions. While scanning, a line of intersection between a first plane defined by the incident direction of the first beam and the scanning direction and a second plane defined by the incident direction and the scanning direction of the second beam does not intersect the measurement surface. A surface condition measuring device characterized in that the relationship between the first and second light beams is set to .
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61118862A JPS62274247A (en) | 1986-05-23 | 1986-05-23 | Surface stage measuring instrument |
| US07/348,177 US4886975A (en) | 1986-02-14 | 1989-05-02 | Surface examining apparatus for detecting the presence of foreign particles on two or more surfaces |
| US07/406,090 US5017798A (en) | 1986-02-14 | 1989-09-12 | Surface examining apparatus for detecting the presence of foreign particles on two or more surfaces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61118862A JPS62274247A (en) | 1986-05-23 | 1986-05-23 | Surface stage measuring instrument |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62274247A JPS62274247A (en) | 1987-11-28 |
| JPH0545945B2 true JPH0545945B2 (en) | 1993-07-12 |
Family
ID=14746973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61118862A Granted JPS62274247A (en) | 1986-02-14 | 1986-05-23 | Surface stage measuring instrument |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62274247A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3101290B2 (en) * | 1989-03-15 | 2000-10-23 | キヤノン株式会社 | Surface condition inspection device, exposure apparatus, and surface condition inspection method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61260632A (en) * | 1985-05-15 | 1986-11-18 | Hitachi Ltd | Foreign matter detector |
-
1986
- 1986-05-23 JP JP61118862A patent/JPS62274247A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62274247A (en) | 1987-11-28 |
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