JPH0565078B2 - - Google Patents

Description

[Detailed description of the invention] 【Technical field】

The present invention relates to a method for manufacturing a multilayer circuit board having recesses for semiconductor mounting and which is publicly adopted as a board for packages such as chip carriers and pin grid arrays.

[Background technology]

The present inventors have already formed an etching resist layer 3 on the exposed portion 1a of the semiconductor packaging circuit pattern 1 of the semiconductor packaging matrix circuit board 2, as shown in FIGS. 3a and 3b, and etched the semiconductor packaging circuit pattern. A method for producing a multilayer circuit board, in which after providing an insulating layer 13 for absorbing unevenness between circuits on a forming surface 2a, a circuit board 5 having a through portion 4 is placed and integrated under heat and pressure to form a recess 10 for semiconductor mounting. However, since heating and pressurization is applied, the insulating layer 13 for absorbing irregularities between circuits melts and flows into the semiconductor mounting recess 10 and adheres to the bonding part 10a and die part 10b, causing wire bonding and die There was a problem in that it had a negative effect on bonding.

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and its object is to provide a multilayer circuit board having recesses for semiconductor mounting and suitable for use as substrates for packages such as chip carriers and pin grid arrays. In the manufacturing method, the purpose is to prevent the resin component of the insulating layer for absorbing unevenness between circuits from flowing and adhering to the bonding part and the die part, and thereby preventing the wire bonding and die bonding from being adversely affected.

[Disclosure of the invention]

The method for manufacturing a multilayer circuit board of the present invention is a method for manufacturing a multilayer circuit board in which a circuit board 5 having a through portion 4 is laminated and integrated on a semiconductor mounting circuit pattern forming surface 2a of a matrix circuit board 2 for semiconductor mounting. The bonding part 10a and the die part 10b of the recess 10 for semiconductor mounting are etched with the etching resist layer 3.
An insulating layer 13 for absorbing unevenness between circuits is provided on the semiconductor mounting circuit pattern forming surface 2a of the matrix circuit board 2 or the inner layer circuit pattern forming surface 5a of the circuit board 5, except for the portion where the etching resist layer 3 is formed. After smoothing the surface of the insulating layer 13 for absorbing unevenness, it is laminated and integrated with an adhesive, and then, after drilling holes, through hole plating 12 is performed to provide through holes 6, and after forming the outermost layer circuit pattern 7. This structure is characterized in that the etching resist layer 3 of the semiconductor mounting recess 10 is removed, and with this structure, the above object is achieved. The present invention will be explained below based on the accompanying drawings. The matrix circuit board 2 for semiconductor mounting is made of ceramic such as alumina, silicon carbide, etc.
Conventional methods such as photo-etching using photosensitive resin or screen printing conductive paste on inorganic or organic substrates such as glass epoxy resin substrates, glass polyimide resin substrates, paper epoxy resin substrates, and glass triazine resin substrates. A circuit pattern 1 for semiconductor mounting is thus formed. An etching resist layer 3 is formed on the circuit pattern portion 1a of the matrix circuit board 2 that is exposed after the semiconductor mounting circuit pattern 1 is laminated. The etching resist layer 3 is made of metal such as gold, nickel, or solder, or a resin that can be electrodeposited. Further, in this embodiment, no circuit pattern is formed on one side of the matrix circuit board 2, but a metal foil 9 is pasted thereon. Incidentally, the matrix circuit board 2 may be formed of a plurality of printed wiring boards. On the semiconductor mounting circuit pattern forming surface 2a of this matrix circuit board 2, an insulating layer layer 1 for absorbing unevenness between circuits is formed.
3 is provided. As this insulating layer 13 for absorbing unevenness between circuits, a plating resist made of an organic insulator is employed. For example, a liquid solder resist with a liquid-like plating resistance, a liquid solder resist with a film-like plating resistance, or a combination thereof can be used. The surface of this insulating layer 13 for absorbing unevenness between circuits is pressed and smoothed as shown in FIG. Heating may be applied when pressurizing. Further, it is preferable that the smoothed surface of the insulating layer 13 for absorbing unevenness between circuits is roughened by physical means such as sandblasting or chemical treatment to improve adhesion. The roughening may be achieved by placing a metal foil on the rough surface side of the insulating layer for absorbing inter-circuit irregularities and applying pressure. The circuit board 5 to be laminated and integrated with the matrix circuit board 2 is a printed wiring board, and the inner layer circuit pattern 8 is formed on one side, and the other side is a metal foil 9 such as copper foil on which no circuit is formed 5b. A through hole 4 for forming a recess 10 for semiconductor mounting is bored (see FIG. 1a). An adhesive is applied to the surface of the insulating layer 13 for absorbing unevenness between circuits formed on the circuit pattern forming surface 2a for semiconductor mounting of the matrix circuit board 2, so that the circuit board 5 is arranged so that the circuit pattern-free surface 5b is the outermost surface. They are laminated and integrated (see Figure 1b).
As the adhesive, a liquid adhesive such as epoxy or polyimide, an adhesive film such as epoxy, or a prepreg impregnated with glass 2 such as epoxy or polyimide is used. This adhesive is used to bond the matrix circuit board 2 and the circuit board 5. It is provided on almost the entire surface of the adhesive surface. Next, after drilling according to the inner layer circuit pattern 8, through hole plating 12 is performed to form the through holes 6 and the outermost layer circuit pattern 7, and the etching resist layer 3 of the resin contaminants and semiconductor mounting recess 10 is removed. By removing and exposing the bonding part 10a and the die part 10b, a multilayer circuit A having a semiconductor mounting recess 10 is manufactured. The resin of the insulating layer 13 for absorbing unevenness between circuits is not attached to the bonding 10a of the recess 10 for semiconductor mounting and the die part 10b of this multilayer circuit board A, so that wire bonding and die bonding are not adversely affected. was implemented and put into practical use as a chip carrier and pin grid array.

【Effect of the invention】

In the present invention, not only can a highly reliable multilayer circuit board having a recess for semiconductor mounting be manufactured at low cost, but also the bonding part and the die part of the recess for semiconductor mounting can be covered with an etching resist layer to form a matrix circuit. An insulating layer for absorbing unevenness between circuits is provided on a surface of the board on which a circuit pattern for semiconductor mounting is formed or an inner layer circuit pattern is formed on the surface of the circuit board other than the area where the etching resist layer is formed, and the surface of the insulating layer for absorbing unevenness between circuits is smoothed. After that, they are laminated and integrated with an adhesive, and then, after drilling holes, through hole plating is applied to provide through holes, and after forming the outermost layer circuit pattern, the etching resist layer in the recess for semiconductor mounting is removed. Can be laminated and integrated with
Therefore, the resin of the insulating layer for absorbing unevenness between circuits does not adhere to the bonding and die parts of the recess for semiconductor mounting, which adversely affects wire bonding and die bonding. Semiconductors can be mounted without any problems.

[Brief explanation of drawings]

Figures 1 a, b, c, and d are explanatory diagrams showing each process of an embodiment of the present invention, and Figures 2 a and b are explanatory diagrams showing a smoothing process of the insulating layer for absorbing unevenness between circuits in the same process. Figures 3a and 3b are explanatory diagrams showing a method for manufacturing a multilayer circuit board that the present inventors have already developed, in which A is a multilayer circuit board, 2 is a matrix circuit board, and 2a is for semiconductor mounting. A circuit pattern forming surface, 3 an etching resist layer, 4 a penetration part,
5 is a circuit board, 5a is an inner layer circuit pattern forming surface,
10 is a concave portion for semiconductor mounting, 10a is a bonding portion, 10b is a die portion, and 13 is an insulating layer for absorbing unevenness between circuits.

Claims (1)

[Claims] 1. In a method for manufacturing a multilayer circuit board in which circuit boards having through-holes are laminated and integrated on the semiconductor mounting circuit pattern forming surface of a matrix circuit board for semiconductor mounting, the bonding part and the die part of the recess for semiconductor mounting are formed using an etching resist layer. An insulating layer for absorbing unevenness between circuits is provided on the surface of the matrix circuit board on which the circuit pattern for semiconductor mounting is formed, or on the inner layer circuit pattern forming surface of the circuit board, in addition to the portion where the etching resist layer is formed. After smoothing the surface, they are laminated and integrated with adhesive, and then holes are formed and through-hole plating is applied to form through holes.After forming the outermost layer circuit pattern, the etching resist layer of the recess for semiconductor mounting is formed. A method for manufacturing a multilayer circuit board, characterized by removing the multilayer circuit board.