JPH0569182A - Soldering method for electronic parts - Google Patents
Soldering method for electronic partsInfo
- Publication number
- JPH0569182A JPH0569182A JP3217477A JP21747791A JPH0569182A JP H0569182 A JPH0569182 A JP H0569182A JP 3217477 A JP3217477 A JP 3217477A JP 21747791 A JP21747791 A JP 21747791A JP H0569182 A JPH0569182 A JP H0569182A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering
- electronic component
- black paint
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】
【目的】 品質の良い半田付けを短時間で行える電子部
品の半田付け方法を提供する。
【構成】 回路基板１の電極２にクリーム半田をリフロ
ーして、または電解半田めっき等によって半田層３を形
成し、その上に黒色塗料４または黒色塗料４を混入した
フラックスを塗布または印刷し、その上に電子部品５の
電極６をのせ、上記半田層３の表面の部分７にレーザー
光または光ビームを照射して半田層３を溶融して半田付
けを行う。
(57) [Abstract] [Purpose] To provide a soldering method for electronic parts, which enables high quality soldering in a short time. A solder layer 3 is formed by reflowing cream solder on the electrodes 2 of the circuit board 1 or by electrolytic solder plating or the like, and a black paint 4 or a flux mixed with the black paint 4 is applied or printed thereon. The electrode 6 of the electronic component 5 is placed thereon, and the surface portion 7 of the solder layer 3 is irradiated with a laser beam or a light beam to melt the solder layer 3 for soldering.
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子部品を回路基板に半
田付けする半田付け方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering method for soldering an electronic component to a circuit board.
【０００２】[0002]
【従来の技術】従来、電子部品を回路基板に半田付けす
る場合は、回路基板の電極上にクリーム半田をスクリー
ン印刷し、その上に電子部品の電極をのせて回路基板を
リフロー炉に通し、半田を溶融させて半田付けを行って
いた。2. Description of the Related Art Conventionally, when soldering an electronic component to a circuit board, cream solder is screen-printed on the electrode of the circuit board, the electrode of the electronic component is placed thereon, and the circuit board is passed through a reflow furnace. The solder was melted and soldered.
【０００３】[0003]
【発明が解決しようとする課題】最近は製造のタクトタ
イムの面から半田付けに要する時間も短縮の要望が強
い。しかし単にリフローの温度を高くしたりコンベアの
速度を上げたりするのでは製造上のトラブルが発生する
危険がある。Recently, from the aspect of manufacturing tact time, there is a strong demand for shortening the time required for soldering. However, simply raising the reflow temperature or increasing the conveyor speed may cause manufacturing problems.
【０００４】本発明は、上記従来の課題を解決するもの
で、品質の良い半田付けを短時間で行える電子部品の半
田付け方法を提供することを目的とする。The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a soldering method for electronic parts, which enables high-quality soldering in a short time.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に、本発明の電子部品の半田付け方法は、回路基板の電
極上の半田に黒色塗料または黒色塗料を混入したフラッ
クスを塗布または印刷し、その上に電子部品の電極をの
せ、上記半田にレーザー光または光ビームを照射して半
田を溶融する。または回路基板の電極上に黒色塗料を混
入したクリーム半田を塗布または印刷し、その上に電子
部品の電極をのせ、上記クリーム半田にレーザー光また
は光ビームを照射する。または回路基板をリフロー炉に
通して半田を溶融している。In order to achieve the above object, the method of soldering an electronic component of the present invention comprises applying or printing a black paint or a flux mixed with a black paint to the solder on the electrodes of the circuit board. Then, an electrode of an electronic component is placed thereon, and the solder is melted by irradiating the solder with a laser beam or a light beam. Alternatively, cream solder mixed with black paint is applied or printed on the electrode of the circuit board, the electrode of the electronic component is placed thereon, and the cream solder is irradiated with a laser beam or a light beam. Alternatively, the circuit board is passed through a reflow furnace to melt the solder.
【０００６】[0006]
【作用】黒色のため半田の熱吸収効率が高く、それだけ
半田付け時間が短縮される。[Function] Since it is black, the heat absorption efficiency of the solder is high, and the soldering time is shortened accordingly.
【０００７】[0007]
（実施例１）図１において、回路基板１の電極２にクリ
ーム半田をリフローして、または電極半田めっき等によ
って半田層３を形成し、その上に黒色塗料４または黒色
塗料４を混入したフラックスを塗布または印刷し、その
上に電子部品５の電極６をのせ、上記半田層３の表面の
部分７にレーザー光または光ビームを照射して半田層３
を溶融して半田付けを行う。この工程を図２に示してい
る。(Embodiment 1) In FIG. 1, a solder layer 3 is formed by reflowing cream solder on the electrodes 2 of the circuit board 1 or by electrode solder plating or the like, and a black paint 4 or a flux containing the black paint 4 mixed thereon. Is applied or printed, the electrode 6 of the electronic component 5 is placed thereon, and the laser light or the light beam is applied to the surface portion 7 of the solder layer 3 to irradiate the solder layer 3
Melt and solder. This process is shown in FIG.
【０００８】（実施例２）図３において、回路基板１の
電極２に黒色塗料を混入したクリーム半田８をスクリー
ン印刷やディスペンサにより塗布する。その上に電子部
品５の電極６をのせ、上記クリーム半田８の表面の部分
７にレーザー光または光ビームを照射して、またはリフ
ロー炉に通してクリーム半田８を溶融して半田付けを行
う。この工程を図４に示している。黒色塗料は主成分が
黒鉛のような導電性の物質であるのが望ましい。(Embodiment 2) In FIG. 3, cream solder 8 mixed with black paint is applied to the electrode 2 of the circuit board 1 by screen printing or a dispenser. The electrode 6 of the electronic component 5 is placed thereon, and the surface portion 7 of the cream solder 8 is irradiated with a laser beam or a light beam, or is passed through a reflow furnace to melt and solder the cream solder 8. This process is shown in FIG. It is desirable that the main component of the black paint is a conductive substance such as graphite.
【０００９】[0009]
【発明の効果】以上の説明で明らかなように、本発明の
電子部品の半田付け方法は、黒色のため半田の熱吸収効
率が高く、それだけ半田付け時間が短縮され生産性が向
上するとともに回路基板の焼けも少なく品質の良い半田
付けを提供するものである。As is apparent from the above description, the soldering method for electronic parts of the present invention is black, so that the heat absorption efficiency of the solder is high, the soldering time is shortened accordingly, and the productivity is improved and the circuit is improved. It provides high quality soldering with little board burning.
【図１】本発明の電子部品の半田付け方法の第１実施例
を説明する図FIG. 1 is a diagram illustrating a first embodiment of a method for soldering an electronic component of the present invention.
【図２】本発明の電子部品の半田付け方法の第１実施例
の工程図FIG. 2 is a process chart of a first embodiment of a method for soldering an electronic component of the present invention.
【図３】本発明の電子部品の半田付け方法の第２実施例
を説明する図FIG. 3 is a diagram for explaining the second embodiment of the electronic component soldering method of the invention.
【図４】本発明の電子部品の半田付け方法の第２実施例
の工程図FIG. 4 is a process chart of a second embodiment of the electronic component soldering method of the invention.
１ 回路基板 ２ 回路基板の電極 ３ 半田層 ４ 黒色塗料（黒色塗料または黒色塗料を混入したフ
ラックス） ５ 電子部品 ６ 電子部品の電極 ７ レーザー光を照射する部分 ８ クリーム半田DESCRIPTION OF SYMBOLS 1 Circuit board 2 Circuit board electrode 3 Solder layer 4 Black paint (black paint or flux mixed with black paint) 5 Electronic component 6 Electronic component electrode 7 Laser light irradiation part 8 Cream solder
Claims (4)
は黒色塗料を混入したフラックスを塗布または印刷し、
その上に電子部品の電極をのせ、上記半田にレーザー光
または光ビームを照射して半田を溶融する電子部品の半
田付け方法。1. A black paint or a flux mixed with a black paint is applied to or printed on solder on an electrode of a circuit board,
A method for soldering an electronic component, in which an electrode of an electronic component is placed thereon and the solder is irradiated with a laser beam or a light beam to melt the solder.
クリーム半田を塗布または印刷し、その上に電子部品の
電極をのせ、上記クリーム半田にレーザー光または光ビ
ームを照射して、または回路基板をリフロー炉に通して
半田を溶融する電子部品の半田付け方法。2. A circuit board electrode is coated or printed with a cream solder mixed with a black paint, an electrode of an electronic component is placed thereon, and the cream solder is irradiated with a laser beam or a light beam, or a circuit. A method for soldering electronic components in which a board is passed through a reflow furnace to melt the solder.
たは２記載の電子部品の半田付け方法。3. The method for soldering an electronic component according to claim 1, wherein the black paint is a conductive substance.
または２記載の電子部品の半田付け方法。4. The main component of the black paint is graphite.
Alternatively, the method of soldering the electronic component according to the item 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3217477A JPH0569182A (en) | 1991-08-28 | 1991-08-28 | Soldering method for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3217477A JPH0569182A (en) | 1991-08-28 | 1991-08-28 | Soldering method for electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0569182A true JPH0569182A (en) | 1993-03-23 |
Family
ID=16704850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3217477A Pending JPH0569182A (en) | 1991-08-28 | 1991-08-28 | Soldering method for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0569182A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7199329B2 (en) | 2003-08-11 | 2007-04-03 | Niigata Seimitsu Co., Ltd. | Method of soldering semiconductor part and mounted structure of semiconductor part |
| JP2013132673A (en) * | 2011-12-27 | 2013-07-08 | Nihon Superior Co Ltd | Joint material used for joining utilizing near-infrared ray, and joining method |
| CN114551925A (en) * | 2020-11-25 | 2022-05-27 | 中国科学院大连化学物理研究所 | A laser-welded flow battery electrode frame structure and flow battery stack |
-
1991
- 1991-08-28 JP JP3217477A patent/JPH0569182A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7199329B2 (en) | 2003-08-11 | 2007-04-03 | Niigata Seimitsu Co., Ltd. | Method of soldering semiconductor part and mounted structure of semiconductor part |
| JP2013132673A (en) * | 2011-12-27 | 2013-07-08 | Nihon Superior Co Ltd | Joint material used for joining utilizing near-infrared ray, and joining method |
| CN114551925A (en) * | 2020-11-25 | 2022-05-27 | 中国科学院大连化学物理研究所 | A laser-welded flow battery electrode frame structure and flow battery stack |
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