JPH0572104B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a bump attachment method for bonding bumps to leads provided on a carrier tape.

[Prior Art] Conventionally, as a method of attaching bumps to leads provided on a carrier tape, for example,
Publication No. 31819, Japanese Patent Publication No. 62-34142, Japanese Patent Publication No. 1983
-139635 publication etc. are known.

In this bump attaching method, the leads of the carrier tape are positioned above the substrate on which the bumps are formed, and the leads are brought into pressure contact with the bumps for bonding.

[Problems to be Solved by the Invention] The above-mentioned prior art does not disclose anything about detecting whether the bumping is good or bad. Because the bumps are smaller than the width of the leads, it has been difficult to detect whether all the plurality of bumps have been bonded to each lead or whether the bonding is good or bad immediately after the bumps are attached.

Conventionally, therefore, after all of the carrier tape wound around a supply reel has been bonded and wound onto a take-up reel, the take-up reel is set in an inspection device to detect the quality of the bonding.

As described above, since the inspection has to be performed again, the number of work steps increases, and there is a problem in that it is not possible to quickly deal with cases where bonding defects occur continuously.

An object of the present invention is to provide a bumping method that can detect the quality of bonding in the bonding process.

[Means for Solving the Problems] The above object is solved by detecting the presence or absence of bumps on the bonded bump portion of the substrate after bonding with a camera, thereby detecting the quality of the bonding.

[Function] Conventionally, the carrier tape to which the bumps were bonded was detected, so it could not be detected at the time of bonding, but in the present invention, the bumps were moved to a position away from the bonding position, and the bumps were removed from the board and bonded. Since the quality of the bonding is detected by using a camera to detect whether or not the bump remains on the substrate, the quality of the bonding can be detected in the bonding process.

[Example] An example of the present invention will be described below with reference to FIGS. 1 to 3. The apparatus used in the method of the present invention is substantially similar to the inner lead bonding apparatus disclosed in Japanese Patent Publication No. 62-27735 and Japanese Patent Publication No. 62-55298.

As shown in FIGS. 1 and 2, a carrier tape 1 made of polyimide film or the like is sequentially provided with a large number of leads 2, and this carrier tape 1 is supplied to a tape clamper 3, bond guide 4, etc. from a supply reel (not shown). , a tape clamper 5, a punching means 6 consisting of a punch 6a and a die 6b, and then wound onto a take-up reel (not shown). A bond tool 7 is disposed above the bond guide 4 and is moved in the vertical (Z) direction and horizontal (X, Y) direction by a driving means (not shown). It is designed to be inserted into a bond window 4a provided in the.

Further, above the bond window 4a of the bond guide 4, as shown in FIG. 3, a lead detection camera 10 for detecting the position of the lead 2 of the carrier tape 1 is disposed. Further, in front of the lead detection camera 10, that is, above the bond guide 4 at a certain distance from the front, a bump detection camera 11 for detecting bumps, which will be described later, is disposed. Half mirrors 12 and 13 are attached to the lower ends of these cameras 10 and 11, respectively, and epi-illumination lights 14 and
15 is installed.

A bond stage 20 is disposed below the bond guide 4, and this bond stage 20
is reciprocated between the lower part of the bond window 4a of the bond guide 4 and the lower part of the bump detection camera 11 by a driving means (not shown), and is also moved in the horizontal (X, Y) direction, vertical (Z) direction, and rotation (θ). It is designed so that it can be moved in any direction. The bonding stage 20 has a vacuum chuck 21 at its upper end, and a substrate 23 made of glass or the like on which bumps 22 are formed is held by the vacuum chuck 21.

Next, a method for applying bumps using such an apparatus will be explained. Note that in FIGS. 1 and 3, the leads 2 provided on the carrier tape 1 are omitted, so please refer to FIG. 2 for the description of the leads 2 below. When the carrier tape 1 is fed with the tape clampers 3 and 5 open and the lead 2 to be bonded is positioned in the bond window 4a, the tape clampers 3 and 5 close to clamp the carrier tape 1. Then, the position of the lead 2 is detected by the lead detection camera 10,
The position of the lead 2 is stored in an arithmetic device (not shown). The position of lead 2 stored in the arithmetic unit is processed by one of the following two methods. 1st
In this method, the tape clampers 3 and 5 and the bond guide 4 are moved in the X and Y directions according to the positional deviation of the lead 2 to correct the positional deviation of the lead 2. In the second method, the bonding stage 20 is moved as will be described later, taking into account the positional deviation of the leads 2.

On the other hand, as shown in FIG. 3a, the bonding stage 20 is located below the bump detection camera 11, and the bump 22a to be bonded is detected by the bump detection camera 11,
The position of 2a is stored in an arithmetic device (not shown).
Thereafter, the bond stage 20 is moved toward the bond guide 4, as shown in FIG. 3b.
In this case, if the misalignment of the lead 2 is handled by the first method as described above, the bump 2
The bonding stage 20 is moved so that the bump 22a is located at a predetermined position below the bonding window 4a, taking into consideration the positional deviation of the bump 22a. When the misalignment of lead 2 is handled by the second method,
The bonding stage 20 is moved so that the bump 22a is located at a position corresponding to the actual lead 2, taking into consideration the positional deviation of the bump 22a and the positional deviation of the lead 2.

Next, the bond tool 7 moves and descends in the XY direction to press the lead 2 against the bump 22a, and
Bond 2a to lead 2. After that, the bonding tool 7 rises and moves in the XY directions.

Next, as shown in FIG. 3c, the bonding stage 20 is moved so that the portion of the bump 22a that has been bonded and removed is positioned below the bump detection camera 11 again. Then, the presence or absence of the bump 22a is detected by the bump detection camera 11. If there is a bump, bump 22
Since all of a is not bonded to the lead 2 and is defective in bonding, it is stored in an arithmetic unit (not shown). Therefore, when the lead 2 to which the bump 22a is bonded is positioned on the punching means 6, it is punched out by the punch 6a and the die 6b.
Marked as defective. In addition, the defect mark is
Ink or the like may be applied instead of punching. Further, if such a bonding failure occurs several times in a row, some kind of abnormality is recognized in the device, and in such a case, the device may be stopped and an alarm may be issued.

After the bond stage 20 moves in the direction of the bump detection camera 11 as described above, the carrier tape 1
is fed by a certain pitch, and the next lead 2 to be bonded is positioned below the bond window 4a.
After detecting the presence or absence of the bump 22a, the bump 22b to be bonded next is detected by the bump detection camera 11.
sent below. Thereafter, the bumps 22b are bonded to the leads 2 by performing the operations described above.

[Effects of the Invention] As is clear from the above description, according to the present invention, the substrate is moved to a position away from the bonding position, and a camera is used to check whether the bonded bumps that have been removed from the substrate remain on the substrate. Since the quality of the bonding is detected by detection, the quality of the bonding can be detected in the bonding process.

[Brief explanation of the drawing]

FIG. 1 is a schematic front view showing an embodiment of the present invention;
2 is an enlarged front view of the bonding portion of FIG. 1, and FIGS. 3a to 3c are right side views of FIG. 1. 1: Carrier tape, 2: Lead, 7: Bond tool, 11: Bump detection camera, 20: Bond stage, 22: Bump, 23: Substrate.

Claims (1)

[Claims] 1 In a bump attachment method in which a lead provided on a carrier tape is brought into pressure contact with a bump formed on a substrate to bond the bump to the lead, the presence or absence of a bump is detected using a camera on the bonded bump portion of the substrate after bonding. A bump attaching method characterized by detecting whether bonding is good or bad.