JPH0798361A - Storage device for inspected object and probe device - Google Patents

Abstract

(57) [Abstract] [Purpose] A plurality of inspected objects as semi-finished products such as MCMs on which bare chips are mounted are housed, and each inspected object can be continuously and smoothly supplied to electrical inspection. Provide a storage device for an inspection body. [Structure] The storage tray 10 for the object to be inspected includes an object to be inspected 2
Storage section 11 partitioned and formed to store 0 individually
And the suction hole 12 used when sucking the object 20 to be inspected on the bottom surface of the housing portion 11.
When performing an electrical inspection of 0, a plurality of inspected objects 20 can be simultaneously supplied to the mounting table 34 of the inspection unit 33 of the probe device 30.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a storage tool for an object to be inspected and a probe processing apparatus.

[0002]

2. Description of the Related Art A semiconductor device is assembled through various inspection steps in its manufacturing process, and after assembly, defective products are removed by performing an electrical inspection such as dynamic burn-in in order to see its basic operating characteristics. After that, only non-defective products that have passed the electrical inspection are put on the market, and various semiconductor devices are mounted on a printed circuit board according to a predetermined purpose.

As a mounting form of a semiconductor device on a printed circuit board, conventionally, an IC package in which an IC chip such as an LSI is packaged with resin or ceramic is generally mounted on the printed circuit board, but recently, an IC chip is mounted. A bare IC chip (hereinafter referred to as "Bare
It is called "chip". ) Is directly attracted to a laminated substrate having a wiring layer by a TAB mounting method, a flip chip mounting method, or the like. This bare chip mounting method has the advantages that it can be mounted at a high density because of the absence of packages and can be downsized, and that it can speed up arithmetic processing by shortening the wiring length. It is becoming popular as a module (hereinafter, simply referred to as “MCM”).

Since MCM has the above-mentioned advantages, C
It may be applied to workstations such as AD and spread rapidly. However, since the MCM is modularized as a system that collects a plurality of IC chips (bare chips) having various functions and exerts a new arithmetic processing function, a bare chip having various functions is provided. There is a need for electrical inspection as a chip and electrical inspection as a system that combines bare chips to exhibit new functions. However, since the MCM itself is a new product, there is currently no practice to trade the bare chip itself, and the bare chip itself is not ready to be inspected. Electrical inspection is performed individually for each product using, and after mounting good chips of bare chips selected by this inspection on the board,
Packaged to make MCM, M after this package
With respect to CM finished products as well, a special inspection device is used to individually carry out electrical inspection as finished products.

[0005]

However, in the case of the conventional inspection device for electrically inspecting the MCM as the finished product, as described above, the finished products of the MCM after packaging are individually inspected individually. It is necessary to supply and perform electrical inspection. At that time, it is necessary to carry in and out the individual MCMs at the inspection unit. Therefore, it takes a lot of time to perform electrical inspections on many MCMs. In the case where MCM rapidly spreads and enters the market in large quantities, there is a problem that the inspection demand cannot be fully met. Moreover, in the case of the conventional inspection device, since the electrical inspection is performed on the finished product, the bare
If even one bare chip has a mounting failure at the chip mounting stage, the finished product appears as a connection failure in the electrical inspection, and the finished product has to be discarded as a defective product.

The present invention has been made in order to solve the above problems, and accommodates a plurality of inspected objects as semi-finished products such as MCMs on which bare chips or the like are mounted, and continuously inspects each inspected object. In addition to providing a storage device for the device under test that can be smoothly supplied to the electrical inspection, it is possible to continuously and smoothly test the device under test including semi-finished products such as an element or MCM before packaging with bare chips. It is an object of the present invention to provide a probe device capable of performing an electrical inspection and improving the yield of products.

[0007]

A storage device for an object to be inspected according to claim 1 of the present invention is configured such that a plurality of objects to be inspected are simultaneously placed on a mounting table of an inspection part when an electrical inspection of the object is performed. A container for supplying an object to be inspected, which is compartmented and formed so as to individually house the object to be inspected, and is formed on the bottom surface of the container and used when sucking the object to be inspected. And a suction hole.

Further, according to a second aspect of the present invention, there is provided a storage device for an object to be inspected according to the first aspect, wherein a plurality of the suction holes are provided in the storage portion and a plurality of suction holes are provided on a back surface of the storage portion. A groove passing through the suction hole is provided as an air passage.

According to a third aspect of the present invention, there is provided a device for storing an object to be inspected according to claim 1 or 2, wherein the object to be inspected is a substrate and is mounted on the substrate. It has a plurality of bare chips and is configured as a semi-finished product before packaging.

A probe device according to a fourth aspect of the present invention is a storage device for individually storing a plurality of objects to be inspected,
A transporting device for transporting and mounting the storage tool from the storage section to the mounting table of the inspection section, and driving the mounting table in the X, Y, Z and θ directions to inspect each of the storage tools. A probe apparatus for sequentially and electrically positioning each body with respect to a probe needle of a probing card to individually and electrically inspect each inspected body, wherein the storage device stores the inspected body individually. And a suction hole formed on the bottom surface of the storage section and used when sucking the object to be inspected.

The probe device according to a fifth aspect of the present invention is the probe device according to the fourth aspect, further comprising a cassette for accommodating a plurality of the accommodating tools, and the accommodating tools for each of the accommodating sections. To be stored in.

[0012]

According to the first aspect of the present invention, a plurality of objects to be inspected can be individually housed in the respective storage portions when the object to be inspected is electrically inspected. After storing, the plurality of objects to be inspected can be simultaneously supplied to the placing table of the inspecting section by supplying to the placing table of the inspecting section. It can be fixed to the bottom by suction.

According to a second aspect of the present invention, in the first aspect of the invention, a plurality of the suction holes are provided in the storage section and a plurality of suction holes are provided on the back surface of the storage section. Since the groove passing therethrough is provided as the air passage, the object to be inspected can be sucked to the bottom surface of the storage portion at a plurality of locations through the plurality of suction holes and the air passages, and the fixation of the object to be inspected in the storage portion can be stabilized.

According to the invention of claim 3 of the present invention, in the invention of claim 1 or 2,
The inspected body includes a substrate and a plurality of bare chips mounted on the substrate and is configured as a semi-finished product before packaging. It can be used for electrical inspection of products.

According to the fourth aspect of the present invention, the storage device, in which the plurality of inspection objects are individually stored, is transferred from the storage unit to the mounting table of the inspection unit by the transfer device and mounted. After placing and fixing the object to be inspected in each of the storage parts by suction through the suction holes of the storage device by the mounting table, the mounting table is set to X,
When performing electrical inspection of the object to be inspected housed in each housing by driving in the Y, Z and θ directions, the mounting table is driven to probe each object to be inspected in the storage tool into a probe of a probing card. By sequentially positioning with respect to the needle, the electrical inspection of the inspection object can be individually and continuously performed.

According to a fifth aspect of the present invention, in the invention according to the fourth aspect, there is provided a cassette for accommodating a plurality of the accommodating tools, and the accommodating tools are stored in cassette units. Since a plurality of storage tools are stored in a cassette and the storage tools are stored in the storage unit in cassette units, each time all inspection objects in the storage tool are inspected, the cassette is stored in the cassette. The electrical inspection of the object to be inspected can be speeded up by continuously exchanging with the next storage tool.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the embodiments shown in FIGS. Storage device for the inspection object of the present embodiment (hereinafter,
It is called a "storage tray". As shown in FIGS. 1 and 2, the reference numeral 10 denotes a unit for accommodating a plurality of inspected objects 20, which is formed in a rectangular plate shape by, for example, glass ceramic or the like. It is used when the electrical inspection of each inspected object 20 is carried out automatically and continuously by mounting it on a mounting table of an inspection section described later. The storage tray 10 includes, for example, 16 storage portions 11 that are partitioned and formed in a matrix so as to individually store the inspection target 20.
It is configured to have a suction hole 12 formed on the bottom surface of the storage portion 11 and used when suction-fixing the inspection object 20. Orientation flats (hereinafter referred to as “orientation flats”) 13 are formed at one corner of the four corners of the storage tray 10, and the orientation flat (hereinafter referred to as “orientation flat”) 13 is subjected to electrical inspection when the object 20 to be inspected stored in the storage tray 10 is electrically inspected. 1
3, the storage tray 10 can be positioned in a predetermined direction.

As shown in FIG. 3, each of the accommodating portions 11 is formed as a concave portion conforming to the outer shape of the rectangular object 20 to be inspected, and each bottom surface is a mirror surface so that it can be brought into close contact with the lower surface of the object 20 to be inspected. Is formed in. Further, as shown in FIG. 4, suction holes 12 are formed in each storage portion 11 at predetermined intervals in the horizontal and vertical directions, and air is sucked through the suction holes 12 and stored in the storage portion 11. DUT 2
It is configured such that 0 is vacuum-adsorbed on the bottom surface. Also,
Grooves that respectively pass through the suction holes 12 in the horizontal direction and the vertical direction are formed as air passages 14 on the back surface of the storage tray 10, and the suction holes 12 are formed at five crossed portions and end portions of the air passages 14. Has been done.

As the object 20 to be electrically inspected using the storage tray 10, for example, the MCM before the package in which the bare chip 21 is exposed, the individually cut IC chip (bare chip), or the A tape carrier package etc. can be mentioned. For example, the MCM before the package is composed of a plurality of bare chips 21 and a laminated substrate 22 on which these are mounted, as shown in FIGS.

Next, the probe device of this embodiment to which the storage tray 10 is applied will be described. The probe device 30 is configured as an inspection device capable of automatically and continuously performing an electrical inspection of an object to be inspected 20 such as an MCM before packaging using the storage tray 10. In this probe device, as shown in FIG. 5, the above-mentioned storage trays 10 are stored in a cassette 40 in a plurality of upper and lower stages, and the plurality of storage trays 10 are transported to the main body of the probe device in cassette units. The inspected objects 20 housed in 10 are individually and continuously electrically inspected. This probe device 3
The main body of 0 is a storage unit 31 for storing the storage tray 10 in units of cassettes, and a storage tray 10 from the storage unit 31.
For example, -30 to 150 so as to perform an electrical inspection of the transfer device 32 configured by vacuum tweezers and the like, which are vacuum-adsorbed and transferred one by one, and the inspection target 20 on the storage tray 10 transferred by the transfer device 32. The inspection unit 33 is configured to be capable of appropriately adjusting the temperature up to ° C. As shown in FIG. 5, the transfer device 32 can move in the X direction, the Y direction, and the Z direction and can rotate in the θ direction, and reciprocates between the storage unit 31 and the inspection unit 33 adjacent to each other, and between them. The storage tray 10 is configured to be transferred.

Further, the transfer device 3 is installed in the inspection section 33.
2 transfer the storage tray 10 from the cassette 40 to the X
Table 34 that moves in the Y, Z, and Z directions and rotates in the θ direction, and the storage tray 1 on the table 34.
A detection device (not shown) for detecting the input / output electrodes and the inspection pads inside each of the 0 to-be-inspected objects 20 is arranged. A plurality of suction portions (not shown) communicating with the vacuum exhaust device are formed on the mounting table 34, and these suction portions correspond to a portion corresponding to the air passage 14 of the storage tray 10 and other portions. All the inspected objects 20 stored in the storage tray 10 placed on the mounting table 34 are suction-fixed to the bottom surface of each storage section 11 and the storage tray 10 itself is placed on the upper surface of the mounting table 34. It is configured to be fixed by suction to.

The probe device 30 is provided with a control device (not shown) that receives a detection signal from the detection device and drives and controls the mounting table 34. The control device drives the mounting table 34 during inspection. It is configured to control and position the device under test 20 with respect to the probe needle 36 (see FIG. 3) of the probing card 35. This control device places the device under test 20 on the registration table for registering the layout patterns of the input / output electrodes and the internal test pads, the layout pattern registered in this registration unit, and the mounting table 34 described above. And a comparison unit that obtains the amount of positional deviation by comparing each input / output electrode and each arrangement of the internal inspection pad based on the detection signal of each inspection object 20 stored in the storage tray 10. And a determination unit that determines whether the positioning is good or bad based on the result of the comparison, and the placement table 34 is driven based on the determination result of the determination unit to accurately position each inspected object 20 with respect to the probe needle 36. Is configured to. In addition, the registration section includes a storage tray 1
The storage address of the object 20 to be inspected at 0 and the inspection order thereof can be registered in advance.

As shown in FIG. 6, the cassette 40 used for transporting the storage tray 10 has a pair of left and right side plates formed with grooves 41A for horizontally supporting the storage tray 10 at both side edges thereof. 41, 41 and both side plates 4
The connecting member 42 is made up of a plate, a rod, and the like, which connects 1 and 41 at the upper and lower ends. Then, at the time of inspection, the storage tray 10 in which the inspection target 20 is stored is automatically carried in and out of the storage unit 31 of the probe device 30 in cassette units.

Next, an operation will be described, for example, in the case where an MCM before a package, that is, a semi-finished product in which a plurality of bare chips 21 are mounted on a laminated substrate 22 is used as an object 20 to be inspected. First, as shown in FIG. 1, the object 20 to be inspected is sequentially stored in each storage portion 11 of the storage tray 10, and then the storage tray 10 is sequentially stored in the cassette 40. After that, it is carried into the storage unit 31 of the probe device 30 by the carrier device. Then, the transport device 32 is driven to take out the storage tray 10 from the cassette 40, and the inspection unit 33
Transfer to the mounting table 34 of

When the storage tray 10 is transferred onto the mounting table 34, a vacuum exhaust device (not shown) is driven to suck and fix the storage tray 10 on the mounting table 34 via the suction section, and at the same time, the storage tray 10 is moved. The object 20 to be inspected in each storage portion 11 is suction-fixed to the bottom surface of each storage portion 11 via the air passage 14 and the suction hole 12. At this time, since the bottom surface of each storage unit 11 is mirror-finished, the inspection object 20 is in close contact with the bottom surface. In this state, the detection device moves the storage tray 10
All the objects 20 to be inspected stored in are sequentially detected in a predetermined address order, and the detection signals are sequentially transmitted to the control device. In the control device, the arrangement patterns of all the inspection objects 20 that have already been registered are sequentially read from the registration unit in the above-described detection order, and these arrangement patterns and the detected inspection object 2 are detected.
The comparison unit successively compares the arrangement pattern of 0 with each other, and the comparison results are sequentially sent to the determination unit, and the determination unit determines the displacement amount of each inspected object 20. In this way, after determining the amount of positional deviation for each of all the inspected objects 20 stored in the storage tray 10 on the mounting table 34, the mounting table 34 is moved in the X direction and the Y direction based on the determination result. After rotating in the θ direction to correct the position shift amount of the DUT 20 according to the inspection sequence and accurately positioning the DUT 20 with respect to the probe needle 36, the mounting table 34 is moved in the Z direction to move the probe. Each of the input / output electrodes and the inspection pad is brought into contact with the needle 36 to perform an electrical inspection. Then, the probe device 30 drives the mounting table 34 in accordance with the inspection order registered in the registration unit of the control device to continuously inspect the inspected objects 20 at all the addresses stored in the storage tray 10, and Finish the inspection. Further, in this inspection, the electrical inspection of the MCM can be performed in the semi-finished product state via the input / output electrodes, and the bare chip 21 can also be electrically inspected by the inspection pad therein.

After that, the transfer device 32 is driven to move the mounting table 3
The storage tray 10 of No. 4 is stored in the cassette 40 in the reverse order to the above-mentioned case, the next storage tray 10 is taken out, and the same electrical inspection is performed on the remaining inspected objects 20.
All the storage trays 10 in the cassette 40 are inspected 20
When the electrical inspection is completed, the cassette 40 is unloaded and conveyed to the next process, and the next cassette 40 that has already been on standby is similarly inspected, and the new cassette 40 is automatically placed in the storage unit 31. Bring it in and make it ready for the next inspection.

As described above, according to the present embodiment, when the probe device 30 electrically inspects the inspected object 20, the 16 inspected objects 20 are individually placed in the respective storage portions 11 of the storage tray 10. Then, the storage tray 10 is temporarily stored in the storage unit 31 of the probe device 30 in cassette units, and the storage tray 10 is mounted on the mounting table 34 of the inspection unit 33 from the cassette 40 via the transport device 32. After that, the object 20 to be inspected can be suction-fixed to the bottom surface of the storage portion 11 through the suction hole 12 of the storage tray 10, so that the object 20 to be inspected is stable in the storage tray 10 without being displaced. Therefore, 16 inspected objects 20 can be continuously and automatically supplied to the probe device 30, and the inspected objects 20 can be accurately positioned by the mounting table 34. It is possible to perform electrical inspection of the inspection body 20 quickly and smoothly.

Further, according to this embodiment, the bare chip 2
1 can be electrically tested as an MCM in the state of a semi-finished product, and bare chip 21 can be electrically tested. If the inspection fails, the bare chip 21 can be detected by the inspection of each bare chip 21, and only the bare chip 21 having the poor mounting can be replaced, thereby making the MCM a good product. You can As a result, MC
The yield of M can be remarkably improved.

FIG. 7 is a perspective view showing another embodiment of the probe device of the present invention. This probe device has the same configuration as that shown in FIG. 5 except that the arrangement state of the cassette 40 is different from that of the probe device shown in FIG. In this embodiment, a plurality of cassettes 40 are arranged in a line in the storage unit 31, and the transport device 32 can be reciprocally moved by a ball screw or the like in the arrangement direction of the cassettes 40. By arranging the cassettes 40 in one direction in this way, it is possible to simplify the removal of the storage device 10 by the transport device 32, and thus to speed up the removal operation of the storage device 10.

In the above embodiment, the case where the electrical inspection of the semi-finished product of the MCM is performed has been described.
Electrical inspection can be performed on the C chip itself (bare chip) or the tape carrier package. The present invention can also be applied to a device under test in which bare chips and IC packages are mixed.

Further, the present invention can be applied to an electrical inspection of a wiring board on which the bare chip of the present invention is mounted. As a result, even if the wiring board is multilayered in the future, an open-short test of each wiring layer will be performed. Can be done.

[0032]

As described above, according to the invention described in claim 1 of the present invention, a plurality of objects to be inspected are simultaneously supplied to the mounting table of the inspection part when performing an electrical inspection of the object to be inspected. A storage device for a device under test, the storage part being compartmentalized so as to individually store the device under test, and a suction hole formed on the bottom surface of the storage part and used for sucking the device under test. Since it has the above, it stores a plurality of inspected objects as semi-finished products such as MCMs on which bare chips are mounted, and stores each inspected object for continuous and smooth electrical inspection. A tool can be provided.

According to a second aspect of the present invention, in the first aspect of the invention, a plurality of the suction holes are provided in the storage section and a plurality of suction holes are provided on the back surface of the storage section. Since the groove that passes through is provided as an air passage, it is possible to provide a storage device for an object to be inspected, which can suck and stabilize the object to be inspected at a plurality of locations on the bottom surface of the accommodation portion through the air passage and the plurality of suction holes in each accommodation portion. You can

According to the invention of claim 3 of the present invention, in the invention of claim 1 or 2, the object to be inspected is a board and a plurality of boards mounted on the board. Since it is configured as a semi-finished product before packaging, including a bare chip, it is possible to provide a storage device for a device under test that can continuously and automatically supply a plurality of semi-finished products before packaging such as MCM simultaneously. .

According to the fourth aspect of the present invention, a storage tool for individually storing a plurality of objects to be inspected, and the storage tool is transported from the storage section to the mounting table of the inspection section. And a transfer device for mounting the mounting table, and driving the mounting table in the X, Y, Z, and θ directions to sequentially position each object to be inspected in the storage tool with respect to the probe needle of the probing card. A probe device for individually and continuously performing an electrical inspection of an inspection body, wherein the storage tool is formed on a bottom surface of the storage section and a storage section that is formed so as to individually store the inspection object. Since it has a suction hole that is used for sucking the object to be inspected, a continuous and smooth electrical inspection can be performed on the object to be inspected such as an element unit or a semi-finished product such as an MCM before a package on which a bare chip is mounted. Can be done
It is possible to provide a probe device that can improve the yield of products.

According to a fifth aspect of the present invention, in the invention according to the fourth aspect, there is provided a cassette for accommodating a plurality of the storage tools, and the storage tools are stored in cassette units. In order to store the parts in a storage unit, a plurality of storage tools are stored in a cassette, the storage tools are stored in the storage unit in cassette units, and every time all the inspection objects in the storage tool are inspected, the next It is possible to provide a probe device capable of speeding up electrical inspection of an object to be inspected by continuously exchanging with the storage tool.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a storage device for a device under test according to the present invention.

FIG. 2 is a plan view showing a storage tool for the inspection object shown in FIG.

FIG. 3 is a III-I showing a storage device for the inspection object shown in FIG.
It is sectional drawing which follows II.

FIG. 4 is a plan view showing a part of the back surface of the storage tool for the device under test shown in FIG.

FIG. 5 is a perspective view showing an embodiment of the probe device of the present invention.

FIG. 6 is a perspective view showing a cassette in a state in which a storage tool for the inspection object shown in FIG. 1 is stored.

FIG. 7 is a perspective view showing another embodiment of the probe device of the present invention.

[Explanation of symbols]

 10 Storage Tray 11 Storage Section 12 Suction Hole 14 Air Passage 20 Inspected Object 21 Bare Chip 22 Laminated Substrate (Substrate) 30 Probe Device 31 Storage Section 33 Inspection Section 34 Mounting Table 35 Probing Card 36 Probe Needle 40 Cassette

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Internal reference number for FI Technical indication H01L 21/66 D 7630-4M B 7630-4M 21/68 U

Claims (5)

[Claims] 1. A storage device for an object to be inspected, which simultaneously supplies a plurality of objects to be inspected to a mounting table of an inspection part when performing an electrical inspection of the object to be inspected. A storage device for an object to be inspected, comprising: a storage part partitioned and formed as described above; and a suction hole formed in a bottom surface of the storage part and used when sucking the test object. 2. The object to be inspected according to claim 1, wherein a plurality of the suction holes are provided in the storage section, and a groove passing through the plurality of suction holes is provided as an air passage on the back surface of the storage section. Storage tool. 3. The inspected device comprises a substrate and a plurality of bare chips mounted on the substrate, and is configured as a semi-finished product before packaging. Storage device for the object to be inspected. 4. A storage device for individually storing a plurality of objects to be inspected, and a transport device for transporting and mounting the storage device from a storage section to a mounting table of the inspection section. , Y, Z
A probe device for sequentially performing electrical inspection of each inspected object by sequentially driving each inspected object in the storage device with respect to the probe needle of the probing card by driving in the direction θ and the θ direction. The storage tool has a storage section that is partitioned and formed to individually store the test object, and a suction hole that is formed on the bottom surface of the storage section and is used when sucking the test object. A probe device characterized by: 5. The probe device according to claim 4, further comprising a cassette that stores a plurality of the storage tools, and the storage tools are stored in the storage unit in cassette units.