JPH08175508A - Taping electronic part link and its manufacture - Google Patents

Abstract

PURPOSE: To provide a taping electronic part link which is superior in productivity, and its manufacturing method by a method wherein a resin layer on the bottom of a cavity is quickly hardened, and an electronic part element which is inserted in the cavity is efficiently prevented from sticking to the resin layer on the bottom of the cavity. CONSTITUTION: A bottom tape 9, wherein a heat weldable resin layer 11 is arranged on a base member 7, and on the top of it, an ultraviolet hardening type resin layer 12 is arranged, is heated, and the heat weldable resin layer 11 is molten. By doing so, the bottom tape 9 is welded to one surface of the a base tape 6 on which a through hole 5 becoming a cavity 3, in which an electronic part element 1 is stored, is formed, to form an element-holding tape 2. Then, the ultraviolet hardening type resin layer 12 being exposed on the bottom of the cavity 3 of the element-holding tape 2 is hardened by the irradiation of ultraviolet rays, and the electronic part element 1 is stored in the cavity 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a series of electronic parts,
More specifically, the present invention relates to a taped electronic component series in which a plurality of electronic components are held by a tape-shaped member.

[0002]

2. Description of the Related Art One of a series of taping electronic parts formed by holding a plurality of electronic parts on a tape-shaped member is a series of taping electronic parts as shown in FIG.

This taping electronic component series is formed by accommodating an electronic component (single unit) 51 in a cavity (recess) 53 of an element holding tape 52 and covering an opening thereof with a cover tape 54.

By the way, as shown in FIG. 8, the element holding tape 52 constituting the above series of taping electronic components is a base tape 56 having a plurality of through holes 55 which are cavities 53 for accommodating the electronic components 51. By joining a bottom tape 59 having a heat-welding resin layer 58 disposed on a base member 57 to the lower surface, and heating and welding the resin layer 58 using a heating means 60 such as a heat-sealing iron. Has been formed.

Then, the electronic component 51 is housed in the cavity 53 of the element holding tape 52 thus formed, and the opening of the cavity 53 is sealed with the cover tape 54, so that the taping electronic component as shown in FIG. You get a run.

[0006]

However, in the above-described conventional method for manufacturing a series of taping electronic components, the resin layer 58 is melted and the base tape 56 is bonded by using the heating means 60 such as a heat-sealing iron. Since the bottom tape 59 is attached to the base tape 56 by means of the above, the resin layer 58 exposed at the bottom of the cavity 53 of the base tape 56 is kept in a molten state until the temperature thereof is cooled below a predetermined temperature. You will be drunk.

Therefore, if the electronic component 51 is inserted into the cavity 53 while the resin layer 58 is melted, the electronic component 51 will adhere to the resin layer 58, and the electronic component will be removed from the taped electronic component series. When taking out and mounting 51, there is a problem that the electronic component 51 cannot be taken out by a method such as vacuum suction.

Further, if the temperature of the resin layer 58 is lowered sufficiently and the resin layer 58 is completely solidified before the electronic component 51 is inserted into the cavity 53, the production efficiency is lowered and the cost is increased. There is a problem that it invites.

The present invention solves the above-mentioned problems and efficiently cures the resin layer at the bottom of the cavity so that electronic components inserted in the cavity adhere to the resin layer at the bottom of the cavity. An object of the present invention is to provide a series of taping electronic components that can be well prevented and have excellent productivity, and a method for manufacturing the same.

[0010]

In order to achieve the above object, in the method for manufacturing a taped electronic component series according to the first invention of the present application, a heat-welding resin layer is provided on a base member, and further on the base member. By heating the bottom tape having the ultraviolet-curable resin layer disposed thereon and melting the heat-welding resin layer, the bottom tape is formed into a base tape having a through hole serving as a cavity for housing electronic components. A step of forming an element holding tape by welding to one surface, a step of curing the ultraviolet curable resin layer exposed at the bottom of the cavity of the formed element holding tape by irradiating with ultraviolet rays, and a bottom part A step of accommodating the electronic component in the cavity where the ultraviolet curable resin layer exposed to the interior is cured, and a step of covering the opening of the cavity accommodating the electronic component with a cover tape. It is characterized in.

Further, in the method for manufacturing a taped electronic component string according to the second aspect of the present invention, the bottom tape having a resin layer having heat-welding property and ultraviolet curing property on the base member is heated to form the resin layer. A step of forming an element holding tape by melting and melting the bottom tape on one surface of a base tape having a through hole serving as a cavity for accommodating an electronic component; and the formed element holding tape. The step of curing the resin layer exposed at the bottom of the cavity of the tape by irradiating with ultraviolet rays, the step of storing the electronic component in the cavity where the resin layer exposed at the bottom is cured, and the step of And a step of covering the opening with a cover tape.

In the taping electronic component series of the third invention of the present application, a bottom tape in which a heat-welding resin layer is provided on a base member and an ultraviolet-curing resin layer is further provided thereon is used as an electronic component. Formed by heat-sealing to one surface of the base tape that has a through hole that will become a cavity for storing parts, and then irradiating ultraviolet rays to cure the UV-curable resin layer exposed at the bottom of the cavity The device holding tape, the electronic component housed in the cavity of the device holding tape, and the cover tape that covers the opening of the cavity of the device holding tape in which the electronic component is housed.

Further, in the taping electronic component series according to the fourth aspect of the present invention, the bottom tape having the resin layer having the heat-welding property and the ultraviolet curing property disposed on the base member serves as a cavity for accommodating the electronic component. An element holding tape formed by heat-sealing one surface of a base tape having a through hole, and then exposing the resin layer exposed at the bottom of the cavity to ultraviolet rays to cure the resin layer, and the element holding tape. The electronic component housed in the cavity and the cover tape covering the opening of the cavity of the element holding tape in which the electronic component is housed.

[0014]

The bottom tape in which the heat-welding resin layer is provided on the base member, and the ultraviolet-curing resin layer is further provided thereon is heated to melt the heat-welding resin layer, thereby producing the bottom tape. Of the base tape, which has a through hole to form a cavity, is heat-welded, and then the UV-curable resin layer exposed at the bottom of the cavity is irradiated with UV rays, so that the UV-curable resin layer is quickly Hardens. Therefore, it is possible to efficiently prevent the electronic component from adhering to the resin layer at the bottom of the cavity when it is inserted into the cavity, and improve the productivity.

Further, by heating a bottom tape having a resin layer having a heat-welding property and an ultraviolet-curing property on the base member to melt the resin layer, the bottom tape is
The resin layer is rapidly cured by irradiating the resin layer in the heat-melted state exposed at the bottom of the cavity with ultraviolet rays after the resin layer is heat-welded to one surface of the base tape in which the through hole to be the cavity is formed. Therefore, it is possible to efficiently prevent the electronic component from adhering to the resin layer at the bottom of the cavity when it is inserted into the cavity, and improve the productivity.

[0016]

EXAMPLES The features of the present invention will be described below in more detail with reference to the examples.

[Embodiment 1] FIG. 1 is a view showing a series of taping electronic components according to an embodiment of the present invention, and FIG. 2 is a view showing a manufacturing method thereof.

In the taping electronic component series of this embodiment, as shown in FIG. 1, the electronic component (single body) 1 is housed in the cavity 3 of the element holding tape 2 and the cavity 3
It is formed by sealing the opening of 2 with the cover tape 4.

The detailed structure of this series of taping electronic components and the manufacturing method thereof will be described below.

First, as shown in FIG. 2, a base member 7 made of Japanese paper or a resin film is placed on the lower surface of a base tape 6 having a plurality of through holes 5 to form cavities 3 for accommodating electronic components 1. The bottom tape 9 having the heat-welding resin layer 11 disposed thereon and the UV-curable resin layer 12 disposed thereon is joined, and the bottom tape 9 is heated by the heating means 10 such as a heat-sealing iron. Then, the heat-fusible resin layer 11 is melted and adhered to the lower surface of the base tape 6 to obtain the element holding tape 2. Then, the ultraviolet curable resin layer 12 exposed at the bottom of the cavity 3 of the element holding tape 2 is cured by irradiating with ultraviolet rays. Next, the electronic component 1 is housed in the cavity 3 of the element holding tape 2, and the opening of the cavity 3 is covered (sealed) with the cover tape 4, thereby obtaining a series of taping electronic components as shown in FIG. The cover tape 4 is attached to the element holding tape 2 by adhesion or heat welding.

Incidentally, FIG. 3 shows the relationship between the ultraviolet irradiation time and the surface hardness of the resin layer at the bottom of the cavity, and FIG. 4 shows the embodiment of the present invention (using an ultraviolet curable resin, this is subjected to ultraviolet irradiation). And the comparative example (conventional example in which no UV curable resin is used) are shown.

As shown in FIG. 3, in the case of the comparative example (conventional example), it takes 24 hours for the surface of the resin layer to completely cure, whereas in the case of the example, the surface hardness immediately increases. Therefore, it can be seen that the curing is rapidly progressed by the ultraviolet irradiation.

Further, from FIG. 4, in the case of the comparative example (conventional example), the attachment rate of electronic components increases with the passage of time, whereas in the case of the taping electronic component series of the embodiment, It can be seen that, even after 100 hours have passed immediately after the insertion of the electronic component (that is, immediately after the production of the taped electronic component string), the adhesion of the electronic component was not observed at all.

According to the taping electronic component series and the manufacturing method thereof of the above-mentioned embodiment, after the element holding tape 2 is formed,
UV curable resin layer 12 exposed at the bottom of the cavity 3
Since it can be rapidly cured by irradiating ultraviolet rays, the electronic component 1 inserted in the cavity 3 is efficiently prevented from adhering to the resin layer at the bottom of the cavity 3 to improve productivity. It will be possible.

[Embodiment 2] FIG. 5 is a view showing a taping electronic component string according to another embodiment of the present invention.
FIG. 6 is a diagram showing the manufacturing method.

In the taping electronic component series of this embodiment, as shown in FIG. 5, the electronic component 1 is housed in the cavity 3 of the element holding tape 2a, and the opening of the cavity 3 is sealed by the cover tape 4. And has a structure similar to that of the taping electronic component series of the first embodiment, but the element holding tape 2a is used in the taping electronic component series of the first embodiment as described below. The element holding tape 2 is different from the above.

That is, in the taped electronic component series according to this embodiment, as the element holding tape, as shown in FIG. 6, a base tape having a plurality of through holes 5 to be cavities 3 for accommodating the electronic components 1 is formed. A bottom tape 9a formed by disposing a resin layer 8 having a heat-welding property and an ultraviolet-curing property on a base member 7 made of Japanese paper or the like is bonded to the lower surface of 6 and is heated by a heating means 10 such as a heat-sealing iron to form a bottom. Element holding formed by heating the tape 9a to melt the resin layer 8 and welding it to the lower surface of the base tape 6 and then irradiating the resin layer 8 exposed at the bottom of the cavity 3 with ultraviolet rays to cure the resin layer 8. The tape 2a is used.

Since the other construction and manufacturing method are the same as in the case of the first embodiment, the description thereof will be omitted.

Also in the taping electronic component series of this embodiment, the cavity 3 is formed after the element holding tape 2a is formed.
Since the resin layer 8 exposed at the bottom of the cavity can be rapidly cured by irradiating with ultraviolet rays, it is possible to efficiently attach the electronic component 1 inserted into the cavity 3 to the resin layer 8 at the bottom of the cavity 3. It can prevent well and improve productivity.

The invention of the present application is not limited to the above-mentioned embodiments, but includes a base member, a heat-welding resin layer, an ultraviolet-curing resin layer, a resin layer having heat-sealing and ultraviolet-curing properties, a base tape, etc. With respect to the type and composition of the constituent materials, the type of electronic parts, the shape and size of the cavity, various applications and modifications can be made within the scope of the invention.

[0031]

As described above, the method for manufacturing a taped electronic component series according to the present invention uses a resin having ultraviolet curability as the resin layer exposed at the bottom of the cavity of the bottom tape joined to the base tape. Since the resin layer is quickly cured by irradiating it with ultraviolet rays, it is possible to efficiently prevent electronic components inserted in the cavity from adhering to the resin layer at the bottom of the cavity and improve productivity. Will be possible.

Further, in the taping electronic component series of the present invention, since the electronic component is inserted and held in the cavity where the resin layer forming the bottom portion is sufficiently hardened, the electronic component adheres to the bottom portion of the cavity and is mounted at the time of mounting. The reliability can be improved by reliably preventing the problem that it cannot be taken out.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a series of taping electronic components according to an embodiment of the present invention.

FIG. 2 is a diagram showing a method for manufacturing a series of taping electronic components according to an embodiment of the present invention.

FIG. 3 is a diagram showing the relationship between the ultraviolet irradiation time and the surface hardness of the resin layer at the bottom of the cavity.

FIG. 4 is a line showing the adhesion occurrence rate of electronic components in an example of the present invention (using an ultraviolet curable resin and subjected to ultraviolet irradiation) and a comparative example (conventional example not using the ultraviolet curable resin). It is a figure.

FIG. 5 is a cross-sectional view showing a series of taping electronic components according to another embodiment of the present invention.

FIG. 6 is a diagram showing a method of manufacturing a series of taping electronic components according to another embodiment of the present invention.

FIG. 7 is a cross-sectional view showing a conventional series of taping electronic components.

FIG. 8 is a diagram showing a conventional method for manufacturing a series of taping electronic components.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2, 2a Element holding tape 3 Cavity 4 Cover tape 5 Through hole 6 Base tape 7 Base member 8 Resin layer 9, 9a Bottom tape 10 Heating means 11 Heat-welding resin layer 12 UV curable resin layer

Claims (4)

[Claims] 1. A bottom tape having a heat-welding resin layer provided on a base member and an ultraviolet-curing resin layer provided thereon is heated to melt the heat-welding resin layer. A step of forming the element holding tape by welding the bottom tape to one surface of a base tape in which a through hole serving as a cavity for housing an electronic component is formed, and a step of forming the element holding tape cavity. The step of curing the UV curable resin layer exposed on the bottom by irradiating it with ultraviolet rays, the step of housing the electronic component in the cavity where the UV curable resin layer exposed on the bottom is cured, and the step of storing the electronic component Covering the opening of the cavity with a cover tape. 2. A bottom tape having a resin layer having a heat-welding property and an ultraviolet-curing property disposed on a base member is heated to melt the resin layer, thereby forming the bottom tape.
A step of forming an element holding tape by welding to one surface of a base tape having a through hole which becomes a cavity for storing electronic parts, and a resin layer exposed at the bottom of the cavity of the formed element holding tape Is cured by irradiating it with ultraviolet light, a step of housing electronic parts in a cavity where the resin layer exposed at the bottom is hardened, and a step of covering the opening of the cavity in which the electronic parts are housed with a cover tape. A method of manufacturing a series of taping electronic components, comprising: 3. A bottom tape having a heat-welding resin layer provided on a base member and an ultraviolet-curing resin layer further provided on the base member, and a through hole serving as a cavity for housing an electronic component is formed. After heat-sealing to one surface of the base tape, the UV-curable resin layer exposed at the bottom of the cavity, an element holding tape formed by irradiating with ultraviolet rays to cure, and the element holding tape A series of taping electronic parts, comprising: an electronic part housed in a cavity; and a cover tape covering an opening of the cavity in which the electronic part of the element holding tape is housed. 4. A bottom tape having a resin layer having a heat-welding property and an ultraviolet-curing property provided on a base member, and one surface of a base tape having a through hole serving as a cavity for housing electronic components. After heat-sealing, the resin layer exposed at the bottom of the cavity, an element holding tape formed by curing by irradiating with ultraviolet rays, an electronic component housed in the cavity of the element holding tape, the element And a cover tape that covers an opening of a cavity in which the electronic component of the holding tape is stored.