JPH09116293A - Electromagnetic wave shielding material, its manufacture, and its application method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain sufficient shielding effect, make possible application which is easy and does not require a long time, and reduce application cost, by sticking an adhesive agent layer on a plastic film of a surface layer whose volume resistivity is smaller than or equal to a specified value, and covering the surface of the adhesive agent layer with release paper. SOLUTION: The back of a plastic film 1 is coated with a deposition layer 2 of conductive material. The conductive material or magnetic material having conductivity is metal or alloy whose volume resistivity is at most 10<-4> Ωcm. The back of the deposition layer 2 is coated with adhesive agent 3. Release paper 4 is stuck on the adhesive agent 3 surface, thereby forming electromagnetic wave shielding material A. In the case of application, the release paper 4 on the back of the plastic film 1 is peeled, and the film is stuck on the face of the back side or the surface side of a floor, a wall, a ceiling, a bridge, etc. The film is grounded. If necessary, wall paper is stuck on the surface of the film by using adhesive agent. When figure is printed on the surface of the film it is unnecessary to stick a wall paper on the film.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly protects electronic devices installed in a room or the like from adverse effects of electromagnetic waves, and also shields electromagnetic waves generated from electronic devices from leaking to the outside as noise. And a manufacturing method thereof and a construction method thereof.

[0002]

2. Description of the Related Art Conventionally, from the viewpoint of preventing the generation of electromagnetic waves that have an adverse effect on electric and electronic devices, "Ministerial Ordinance for Setting Technical Standards for Electrical Appliances" and electromagnetic interference based on Article 20 of the Electrical Appliance and Material Control Law have been adopted. Based on the voluntary regulation values set by the Telecommunications Council to prevent, the surface of the casing of electric and electronic equipment that may generate electromagnetic waves is coated with conductive paint, metal is vapor-deposited or plated, or The housing itself is made of a plastic mixed with a conductive material so as to have conductivity, so that electromagnetic waves are reflected or absorbed, attenuated, and prevented from leaking out of the housing. However, for example, a phenomenon that electromagnetic waves leak from the interface section of a personal computer and disturb the television screen is often seen.

By the way, there is a conductive plastic method which is low in processing cost and requires little labor after molding. The conductive plastic method is a method of molding a sheet or a deformed product from a material in which a conductive material is mixed with plastic by an extrusion molding method, or a case of a personal computer or the like by an injection molding machine. In order to increase the conductivity of the conductive plastic, it is necessary to reduce the particle spacing of the conductive material. That is, according to the description in P685 of the Industrial Plastics Encyclopedia (Industrial Research Committee), there is a linear relationship between the particle spacing and volume resistivity when plastic and carbon powder are mixed. If the particle spacing becomes smaller, the volume resistivity becomes smaller. Is getting smaller. In order to enhance the shielding effect, it is effective to enhance the conductivity and thicken the shielding layer, and it is said that 30 to 60 dB is required for the shielding effect to be recognized at an average level.

By the way, in order to increase the conductivity, it is necessary to increase the filling amount of the conductive material mixed in the plastic. However, if the filling amount is increased, the melt viscosity at the time of extrusion molding or injection molding becomes high, and the fluidity becomes high. There is a problem that the temperature drops sharply and molding becomes difficult.

On the other hand, as an easily moldable material, there is an electromagnetic wave shielding wall covering material and a method for forming the same, which are disclosed in JP-A-63-82000. This electromagnetic wave shielding wall covering material is a wall covering material that has a shielding property against electromagnetic waves and is beautiful in appearance, and is composed of a wallpaper layer and a metal thin film-containing core layer. More specifically, the metal thin film-containing core layer is formed by providing a fiber cloth layer on the surface of an amorphous metal or non-amorphous metal thin film and a flexible resin coating layer on the back surface, and including a metal thin film on the wall underlayer. An adhesive is applied to the core layer to adhere the core layer, and a wallpaper sheet is further adhered to the surface of the core layer to form an electromagnetic wave shielding wall covering material.

[0006]

As described above, in the case of forming a casing of an electronic device with a conductive plastic, if the filling amount of the conductive material in the plastic is increased to enhance the shielding effect, the extrusion molding is performed. Also, since the melt viscosity at the time of injection molding becomes high and molding becomes difficult, there is a limit to the improvement of conductivity, and a high shielding effect cannot be expected. In addition, an electromagnetic wave shielding wall covering material in which a core layer containing a metal thin film is formed and adhered to a wall base surface together with a wallpaper sheet, although a sufficient shielding effect is obtained, an amorphous metal thin film or the like is used. Therefore, not only is it costly, but an adhesive is applied to the wall base surface to attach the metal thin film-containing core layer, and the wallpaper sheet is attached to the surface with an adhesive. Therefore, there is a problem that it takes time and eventually the construction cost becomes high. Therefore, the present invention has been made to solve the above problems, not only a sufficient shielding effect can be obtained, the construction is easy and does not require a lot of time,
Moreover, it is an object of the present invention to provide an electromagnetic wave shielding material which can reduce the construction cost, a manufacturing method thereof, and a construction method thereof.

[0007]

Means for Solving the Problems and Embodiments of the Invention In order to achieve such an object, the electromagnetic wave shielding material of the present invention is such that at least one surface of a plastic film is a conductive material or a magnetic material having conductivity. It is formed by coating a material with a vapor-deposited or plated layer, applying an adhesive to at least one surface coated with the vapor-deposited or plated layer, and further attaching a release paper to the surface of the adhesive layer.

The conductive material or the magnetic material having conductivity is a metal or alloy having a volume resistivity of 10 ⁻⁴ Ωcm or less, and the conductive material is particularly Al, Cu, Fe, N.
i, Co, Si, Sn, Ti, Zn, Ag, Au, C
It is desirable to be composed of a metal or an alloy whose main component is one or more selected from r, Mn, and Pb. Also,
Conductive fibers having a volume resistivity of 10 ⁻⁴ Ωcm or less are mixed into the adhesive so that the volume resistivity is 10 ² Ωcm or less, and the conductive fibers preferably have an aspect ratio of 20 or more. Further, a conductive material having a volume resistivity of 10 ⁻⁴ Ωcm or less and an aspect ratio of 20 or less and a conductive agent may be mixed and dispersed in the adhesive. The electromagnetic wave shielding material molded in this way exhibits a sufficient electromagnetic wave shielding effect. Then, in construction, it is only necessary to strip off the release paper on the back of the plastic film and attach it to the back or front side of the floor, wall, ceiling, crosspiece, etc. by grounding it.
If necessary, attach the wallpaper to the surface with adhesive.
However, if the surface of the plastic film is printed, it is not necessary to attach a wallpaper and the construction can be completed as it is. Therefore, the construction can be facilitated, does not take much time, and the construction cost can be reduced.

Embodiments of an electromagnetic wave shielding material, a manufacturing method thereof and a construction method thereof of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment, and in FIG.
Is a part of a plastic film and has a sheet shape having an appropriate width. Then, the back surface of the plastic film 1 is covered with a vapor deposition layer 2 of a conductive material, and further the adhesive 3 is applied to the back surface of the vapor deposition layer 2. Also, the adhesive 3
The release paper 4 is attached to the surface to form the electromagnetic wave shielding material A. FIG. 2 shows the manufacturing method. In the figure, reference numeral 5 is a film delivery roll, and a plastic film 1 having a vapor deposition layer 2 of a conductive material formed on one side in advance is wound around the film delivery roll 5. 6 is an intermediate roll located above it, and 7 is a take-up roll. A die 8 for supplying the adhesive 3 is arranged so as to come into contact with the surface of the intermediate roll 6, and a pair of pinch rolls 9, 9 are arranged vertically between the intermediate roll 6 and the winding roll 7. 10 is located above the pinch rolls 9, 9 and is a release paper 4
Is a release paper supply roll wound with. Then, the plastic film 1 drawn out from the film delivery roll 5 faces the take-up roll 7 side along the intermediate roll 6.
On the way, the adhesive 3 is applied to the surface of the vapor deposition layer 2 from the die 8 at the position of the intermediate roll 6. Next, it passes between the pair of pinch rolls 9, 9 and at the same time, the release paper supply roll 1
The release paper 4 pulled out from 0 is attached to the surface of the adhesive 3 and is fed out integrally and wound around the winding roll 7. In this way, the electromagnetic wave shielding material A is formed.

3 and 4 show a second embodiment of the method for producing the electromagnetic wave shielding material A. As shown in FIG. In FIG. 3, the adhesive 3 is applied on the surface of the release paper 4 in advance, 11 is a release paper delivery roll around which the release paper 4 is wound, 12 is an intermediate roll located above the release roll, and 13 is a roll. Is a release paper take-up roll. A die 14 for supplying the adhesive 3 is arranged so as to contact the surface of the intermediate roll 12, and the release paper 4 coated with the adhesive 3 between the intermediate roll 12 and the release paper winding roll 13 is prevented from shaking. The roll 15 is placed. Therefore, the release paper delivery roll 11
The release paper 4 pulled out from the side faces the release paper take-up roll 13 side along the intermediate roll 12. On the way, the adhesive 3 is applied to one side of the release paper 4 from the die 14 at the position of the intermediate roll 12. Then, the release paper 4 is wound around the release paper take-up roll 13 via the pinch rolls 15 and 15.

FIG. 4 shows a method for producing the electromagnetic wave shielding material A using the release paper 4 coated with the adhesive 3, and a pair of film feed roll 5 and take-up roll 7 are provided between the film feed roll 5 and the take-up roll 7. A release paper supply roll 17 in which the pinch rolls 16 and 16 are vertically arranged and the release paper 4 is wound above the pinch rolls 16.
Is arranged. A plastic film 1 having a vapor-deposited layer 2 of a conductive material formed on one side in advance is wound around the film delivery roll 5, and the plastic film 1 pulled out from this is a pinch roll 16, 1.
The release paper 4 which passes through the space 6 and is simultaneously pulled out from the release paper supply roll 17 is adhered to the plastic film 1 so that the surface of the adhesive layer 3 and the surface of the vapor deposition layer 2 are brought together, and is fed out integrally. And is wound around the winding roll 7. In this way, the electromagnetic wave shielding material A is formed.

FIG. 5 shows a second embodiment of the electromagnetic wave shielding material B. The same three layers are formed on the adhesive film 3 side of the plastic film 1 in which the adhesive 3 is applied to the surface of the vapor deposition layer 2. The plastic film 1 to be formed is adhered, and the film is superposed on the upper and lower sides, and the release paper 4 is adhered to the lower three layers of the adhesive. In this way, the double or individual weight can be expected to further enhance the electromagnetic wave shielding effect.

In each of the above-mentioned embodiments, a conductive magnetic material can be used instead of the conductive material, and the conductive material and the conductive magnetic material are plated to form the plastic film 1. It is also possible to coat one or both sides. Also, on the surface of the plastic film, that is, the surface to which the adhesive 3 is not applied,
If pattern printing is applied, there is an advantage that wallpaper is unnecessary and construction is very easy. Furthermore, as will be described later in detail, the adhesive 3 includes conductive fibers, conductive materials,
It is also possible to mix a conductive agent. Further, the electromagnetic wave shielding effect can be further enhanced by adding a magnetic material having a low coercive force and a high magnetic permeability to a conductive material containing a conductive fiber.

The plastic film 1 used in the present invention
As the material of the polymer, a polymer having a melting point of 100 ° C. or higher or a polymer showing an apparent melt viscosity of 10 ⁶ poises of 100 ° C. or higher is suitable so that the conductive thin film is not deformed or deteriorated. , For example, halogenated polymers such as polyvinyl chloride, polyvinylidene chloride, polyvinyl fluoride, polyvinylidene fluoride, polyethylene, polypropylene,
Polyolefins such as polybutene, ethylene vinyl acetate copolymer, polystyrene, polymethylmethacrylate, cellulose acetate, polyester, polyamides, polyethers, polyethersulfone, polyphenylene sulfide, polyphenylene oxide, polysulfide, polyetherimide , Polyimide, etc. However, the present invention is not limited to the polymers exemplified here, and whether or not the film on which the conductive thin film is formed is secondarily processed, what characteristics are required at that time, and
It is necessary to select the type and molecular weight of the polymer, taking into consideration the environment in which it will be used after construction. or,
Film formation should be selected by taking into consideration the characteristics of the selected polymer, productivity, post-processability, etc., such as extrusion molding method, calendar roll molding method, casting method, breath method, shaving method, etc. Contact, conductivity, post-processing,
Processing aids and fillers that do not adversely affect the construction and use may be added as appropriate.

[0015] Typically, a shielding effect is observed in the average level is said to 30~60dB, 1MH _Z ~1
0GH _Z result of intensive studies in order to obtain the blocking effect of more than 40dB in a range of the film thickness at the 10 ^-4 [Omega] cm or less in volume resistivity materials have been found to be necessary or 100 angstroms. For this reason, in order to form a conductive thin film on the plastic film 1, in addition to the vacuum deposition method, there are physical and chemical methods such as a sputtering method, an ion plating method, an electroless plating method and an electrolytic plating method. There is a method of depositing a conductive material on a plastic film, and the conductive material is Zn, Cu, Ag, Au, P.
t, Al, Ga, In, Fe, Ni, Co, Ti, V,
Be, Cr, Mn, Zr, C, Si, Ge, Sn, P
b, Nb, Ta, Mo, W, Se, Te, Sb, Ir,
Elements such as Ca, more preferably Al, Ca, Fe, N
i, Co, Si, Sn, Ti, Zn, Ag, Au, C
Alloys using elements selected from r, Mn and Pb (brass,
Bronze, solder, stainless steel, silicon steel, etc.) or compounds (including intermetallic compounds, etc.) using these elements, etc., and have a volume resistivity of 10 ⁻⁴ Ωcm or less. Also, a magnetic material having conductivity CO _x Pt _y, Co
_{x Fe y, F ex N iy} , Mn x Al y, AINi x Co y, SmCO
_x, CeCo _x, and the like NdF _ex B _y, MnNi _x, highly such permeability silicon steel alloy, it may be used in combination to select one or acids or more from these. Further, the material is not limited to these exemplified materials, but at least a thin film having a volume resistivity of 10 ⁻⁴ Ωcm or less is required, and a film thickness of 100 Å or more is desirable.・ 200 to 10000 angstrom is desirable considering deterioration and film damage.
When the film thickness of the conductive material is more than 10,000 angstroms, it takes a long time to form the film, which causes a problem of decreasing productivity.

If the volume resistivity of the electromagnetic wave shielding material is 10 ^-4 Ωcm or more, the thickness of the shielding layer must be increased to maintain the shielding effect of 40 dB or more. 1
Taking an example of 0 ⁻² Ωcm, a film thickness of 100 μm or more is required, rigidity becomes large, and cracks or cracks are likely to occur during post-processing such as bending, which makes the work difficult. In order to reduce problems during processing, the film thickness of the conductive material having high rigidity is preferably 10,000 angstroms or less, and even if the film thickness is thin, the specific resistance is preferably 10 ⁻⁴ Ωcm to enhance the shielding effect. More preferably, it is 10 ⁻⁴ Ωcm or less.

As the adhesive, for example, acrylic resin type, EVA (ethylene-vinyl acetate) type, ethylene propylene diene terpolymer (EPDM) type, vinyl chloride-vinyl acetate copolymer type, polyurethane type, vinyl ether type, natural rubber, poly There are rubber-based materials such as isobutylene, SBR, butyl rubber, nitrile rubber, chlorobrene rubber, and chlorinated rubber, silicone-based materials, and polyvinyl butyral, which can be selected and combined according to the use environment and required characteristics. However, acrylic adhesives are suitable for veneer, wood, metal, etc. and have durability, but are unsuitable because they deteriorate with respect to construction surfaces of highly alkaline materials such as concrete. Rubber-based or synthetic resin-based adhesives are suitable for highly alkaline materials. However, rubber-based adhesives have strong alkalinity, but since they have unsaturated parts, one that is adhered by oxidation or deterioration by ultraviolet rays is 1
Discoloration or peeling occurs after ~ 2 years. An ethylene-propylene adhesive EPDM or a chemically-saturated thermoplastic elastomer adhesive is suitable as a material that has strong alkalinity and can be used for a long period of time. In addition, tackifiers, plasticizers, viscosity modifiers, quality stabilizers, cross-linking agents, fillers and the like can be added to these adhesives and used as required. In addition, the adhesive is combined with a conductive fiber and, if necessary, a particulate conductive material containing a scale-shaped conductive material to reduce the ground resistance and adjust the viscosity when the adhesive is applied.

In order to smoothly discharge the electric charges generated when the electromagnetic wave incident on the thin film portion made of the conductive material is reflected or absorbed, it is effective to blend the conductive material with these adhesives. As the conductive material for blending, in order to improve the discharge effect with a small amount, the conductive fiber is used alone or in combination with the scale-like or fine particle-like conductive material, the volume resistivity of 10 ² Ωcm or less, preferably ¹ Ωcm or less. Volume resistivity is preferable, and viscosity adjustment at the time of application of the adhesive system is performed by adjusting the humidity at the time of application and the amount of addition of fine particle conductive material or fine particle material having low coercive force and high magnetic permeability. There is a method to adjust with.

By the way, in order to enhance the conductivity of the system when the adhesive and the conductive material are mixed, it is preferable that the intervals of the particles of the conductive material are small and the particles are in contact with each other. If it is in the form of particles, the comparison area per unit volume is minimized, so that the fluidity is improved and uniform mixing is facilitated, but the contact frequency is minimized. On the other hand, fibrous or scale-like particles have a large specific surface area, poor fluidity, and difficult to uniformly disperse, but the contact frequency is likely to increase, so conductive fibers are used as the main conductive material during handling. In order to secure the fluidity of the above, it is desirable to combine with a scale-like or fine particle-like conductive material.

When the aspect ratio (ratio of the length to width of the object, the value obtained by dividing the length of the fiber by the average diameter) of the conductive fiber is less than 20, the frequency of entanglement or contact of the fibers becomes small, and therefore the adhesive agent The conductivity of the layer is difficult to increase. Therefore, a conductive material having an aspect ratio of 20 or more, and more preferably 100 or more is preferable, and the diameter of the fiber (diameter 4
If it is small, the conductivity tends to increase with a small amount. Conductive fibers include copper fibers, brass fibers, aluminum fibers, stainless fibers, silver fibers, gold wires, nickel fibers, metal fibers such as iron fibers, carbon fibers, carbon fibers obtained by vapor deposition of metal on the surface, and metal on the surface. The coated insulator fibers and the like are raised, and these can be used alone or in combination of two or more. And when mixing these with the adhesive, if the surface is treated beforehand with stearic acid, a silane coupling agent, a titanate coupling agent, etc., it will be dispersed more evenly with a smaller kneading load than when not treated. It will fit well into the adhesive.

If the content of the fibrous material is less than 3% by volume, the proportion of the particulate material must be made extremely high in order to ensure high conductivity, and the viscosity of the adhesive becomes too high, making handling difficult. Become. Similarly, the fibrous type is 20V
When it is ol% or more, the ratio of scale-like or fine particles can be reduced, but the viscosity becomes high and handling becomes difficult. Not only that, but the adhesive strength decreases, so the amount of these conductive materials added to the adhesive is 3 to 20 for fibrous substances.
Vol%, 0 to 20 Vo for scale or fine particles
1% is desirable. If soft ferrite (magnetite) having high magnetic permeability or fibrous, fine particles or scales of silicon steel with high magnetic permeability is used instead of scale-like or fine particles of conductive material, electromagnetic wave absorption will be enhanced, so from the viewpoint of shielding efficiency. More preferable.

A method of mixing an adhesive with a fine powder of a fibrous conductive material and / or a fine particle conductive material or a magnetic material having a high magnetic permeability and a low coercive force, for example, a fine powder of silicon steel such as soft ferrite or permalloy. There are a solution method and a direct mixing method without using a solvent. In the solution method, the adhesive may be diluted with a solvent to form a low-viscosity (about 10 poise or less is appropriate) solution and mixed with the solution. When mixing fibrous or fine particles of conductive material or magnetic material with silane coupling agent, titanate coupling agent, aluminum coupling agent or surface treatment agent such as stearic acid, mixing will be smooth. Not only can it be performed, but it also becomes more compatible with the adhesive and the adhesive strength is increased.

The features of the solution method are that mixing is easy and coating is easy, but it requires the selection of a solvent that does not attack the plastic film and the consideration of the working environment in consideration of the vapor of the solvent. There are problems such as the need for solvent drying. The direct mixing method is a method of directly mixing the adhesive and the conductive material or magnetic material with a kneader heated so as to reduce the melt viscosity of the adhesive, supplying the mixture to a coating machine, and adhering to a biaxial extrusion molding machine. There is a method in which an agent and a conductive material or a magnetic material are directly supplied, mixed, kneaded, transported in an extruder and extruded in a sheet form from a die to be applied on a plastic film. The coating method includes a knife coater method, a roll coater method, an extrusion T-die coater method, etc., and may be appropriately selected. However, since an adhesive system that does not use a solvent generally has a high viscosity, the extrusion T-die coater method is suitable. In many cases.

The release paper for the adhesive is a general release paper,
For example, silicone-based or fluorine-based resin, varnish, paper surface-treated with oil, paper treated with paraffin, polyolefin-based film or fluororesin-based film, etc. may be used, but it is necessary to select in consideration of the characteristics of the adhesive. is there.

Therefore, a method of applying the electromagnetic wave shielding material A according to the first embodiment will be described with reference to FIG. In addition,
A conductive material 18 mainly containing conductive fibers is mixed in the three layers of the adhesive. First, in construction, the electromagnetic wave shielding material A is cut into a suitable length or size, and the release paper 4 on the back surface of the plastic film 1 is peeled off to make the surface W of the wall, ceiling, floor, crosspiece, etc. to be constructed. Paste it on. At this time, a lead wire 19 for grounding is installed on the surface W to be attached / constructed in advance, and when the lead wire 19 is attached to the surface, the vapor deposition layer 2 of the plastic film 1 conducts an electric field generated when an electromagnetic wave is received. It can be dissipated through 3 layers of adhesive.
In addition, if it is desired to give fashion to the surface of the plastic film 1, if the pattern is printed on the surface opposite to the adhesive 3 layer, the wallpaper 20 need not be attached. This will save you the time and effort of attaching the wallpaper 20. Further, as shown in FIG. 7, the wallpaper 20 may be attached to the surface of the plastic film 1 with an adhesive without any problem.

FIG. 8 shows a state in which a plastic film A'having vapor-deposited layers 2 formed on both front and back surfaces is attached to a surface W to be constructed such as a wall, a ceiling, a floor or a crosspiece by the same procedure as described above. After applying the ground, the wallpaper 20 is attached with an adhesive. Further, FIG. 9 shows a state in which the electromagnetic wave shielding material B according to the second embodiment is attached to a surface W to be constructed such as a wall, a ceiling, a floor or a machine. Has a shielding effect.

Hereinafter, the present invention will be specifically described by showing Examples and Comparative Examples, but the present invention is not limited to the Examples described below. (1) Evaluation method Measuring method of electromagnetic wave shielding effect Using a spectroanalyzer R3361A with built-in tracking generator manufactured by Advantest Co., Ltd. and a shield material evaluator TR17301A, the electromagnetic wave shielding effect is measured using a test piece of 15 cm × 5 cm. Measurement of volume resistivity of adhesive system The prepared adhesive was applied on a PET film with a table-top coater so that a test piece of about 20 cm square could be taken and the solid content was 100 μm. Then, it was dried and used for measurement. The volume resistivity is obtained by measuring the surface resistance by the 4-point method and adding the thickness to the value.

[Table 1]

[Table 2]

[0028]

Example 1 A 30% solution of an adhesive (# 610) dissolved in toluene was applied to a vapor deposition surface of a PET film obtained by cutting aluminum into a size of A4 and having a thickness of 500 angstrom to a thickness of about 100 μm. The solution was applied, left to stand in a ventilated room to dry, and then vacuum dried to remove toluene. A polyethylene film having a thickness of 0.3 mm was laminated on the adhesive surface of the film so as to be in close contact with it. A 15 cm × 5 cm test piece was prepared from this film, and the electromagnetic wave shielding effect was measured. The result is a frequency 10MH _Z 43
dB.

[0029]

Example 2 90 g (90 Vol) of adhesive (# 610) was applied to the vapor deposition surface of a PET film obtained by cutting aluminum into a size A4 and having a thickness of 100 angstrom.
%), Toluene 210 g, and stainless steel fiber (toughmic fiber) having an aspect ratio of 300 39 g (5 Vol.
%), Flaky copper powder (Cu-S (C3)) 44.7 g (5)
(Vol%) was mixed and stirred so as to have a solid content of 100 μm, and a test piece was prepared in the same manner as in Example 1, and the electromagnetic wave shielding effect was measured. The result is frequency 1
It was 57 dB at 0 MH _Z.

[0030]

Example 3 95 g (95 Vol) of adhesive (# 610) was applied to the vapor-deposited surface of a PET film obtained by cutting aluminum into a size of 500 angstroms cut into A4 size.
%), Toluene 210 g, and stainless steel fiber (toughmic fiber) having an aspect ratio of 300 39 g (5 Vol.
%) Compounding and stirring was applied so as to have a solid content of 100 μm, and a test piece was prepared in the same manner as in Example 1. Measurement of electromagnetic wave shielding effect in the frequency 10 MHz _Z 55
dB.

[0031]

Example 4 90 g (90 Vol) of adhesive (# 610) was applied to the vapor-deposited surface of a PET film obtained by cutting aluminum to a thickness of 500 Å cut into A4 size.
%), Toluene 210 g, and stainless steel fiber (toughmic fiber) having an aspect ratio of 300 39 g (5 Vol.
%), Flaky copper powder (Cu-S (C3)) 44.7 g (5)
(Vol%) was mixed and stirred so as to have a solid content of 100 μm, and a test piece was prepared in the same manner as in Example 1, and the electromagnetic wave shielding effect was measured. The result is frequency 1
Was 60dB at 0MH _Z.

[0032]

Example 5 90 g (90 Vo) of an adhesive agent (# 610) was applied to the vapor deposition surface of a PET film in which aluminum was vapor-deposited to a thickness of 10,000 angstroms cut into A4 size.
1%), 210 g of toluene, 39 g (5 Vo) of stainless fiber (toughmic fiber) having an aspect ratio of 300.
1%), flaky copper powder (Cu-S (C3)) 44.7 g
(5Vol%) was mixed and stirred, and the solid content was 100μ
The test piece was prepared in the same manner as in Example 1, and the electromagnetic wave shielding effect was measured. The result was 65dB at a frequency of 10MH _Z.

[0033]

Example 6 Adhesive (# 610) 95 g (95 Vol) was applied to the vapor deposition surface of a PET film obtained by cutting aluminum into a thickness of 500 angstroms cut into A4 size.
%), 210 g of toluene, 39 g (5 Vol%) of iron fiber (ASCC) having an aspect ratio of 78 were mixed and applied to a solid content of 100 μm, and a test piece was prepared in the same manner as in Example 1. It prepared and measured the electromagnetic wave shielding effect. The result was 53dB at a frequency of 10MH _Z.

[0034]

Example 7 80 g (80 Vol) of adhesive (# 610) was applied to the vapor-deposited surface of a PET film obtained by cutting aluminum into a thickness of 500 Å cut into A4 size.
%), Toluene 210 g, and stainless steel fiber (toughmic fiber) having an aspect ratio of 300 39 g (5 Vol.
%), Flaky copper powder (Cu-S (C3)) 44.7 g (5)
Vol%), soft ferrite (BSN-355B) 5
1.8 g (10 Vol%) prepared and stirred was applied so as to have a solid content of 100 μm, a test piece was prepared in the same manner as in Example 1, and the electromagnetic wave shielding effect was measured.
The result was 68dB at a frequency of 10MH _Z.

[0035]

[Embodiment 8] 90 g (90 Vol) of adhesive (# 610) was applied to the vapor-deposited surface of a PET film obtained by vapor-depositing aluminum to a thickness of 500 Å cut into A4 size.
%), 210 g of toluene, 78 g (10 Vo) of stainless fiber (toughmic fiber) having an aspect ratio of 300.
1%) was mixed and stirred and applied so as to have a solid content of 100 μm, and a test piece was prepared in the same manner as in Example 1. Measurement of electromagnetic wave shielding effect was 65dB at a frequency 10 MHz _Z.

[0036]

[Embodiment 9] 90 g (90 Vol) of adhesive (# 610) was applied to the vapor-deposited surface of a PET film obtained by cutting aluminum into a thickness of 500 Å cut into A4 size.
%), Toluene 210 g, and stainless steel fiber (toughmic fiber) having an aspect ratio of 300 39 g (5 Vol.
%) And particulate copper powder (Cu-At-W-250) 44.
7 g (5% by volume) was mixed and stirred to obtain a solid content of 10
It was applied so as to have a thickness of 0 μm, and a test piece was prepared in the same manner as in Example 1. Measurement of electromagnetic wave shielding effect was 62dB at a frequency 10 MHz _Z.

[0037]

Example 10 Adhesive (# 610) 95 g (95 Vol) was deposited on the vapor deposition surface of a PET film obtained by cutting aluminum into a thickness of 500 angstrom and cut into A4 size.
%), Toluene 210 g, and stainless steel fiber (toughmic fiber) having an aspect ratio of 300 39 g (5 Vol.
%) Was mixed and stirred so as to have a solid content of 100 μm, and a test piece was prepared in the same manner as in Example 1. Further, a lead wire was attached between the adhesive surfaces and an electromagnetic wave shielding effect was obtained while grounding. Was measured. The result is a frequency 10MH _Z 6
It was 0 dB.

[0038]

[Embodiment 11] 30 g of an adhesive (# 610) was added with toluene 7 on the vapor deposition surface of a PET film which was cut to A4 size and aluminum was vapor deposited to a thickness of 500 angstrom.
A solution dissolved in 0 g was applied and dried while being left indoors. After drying, a non-deposited surface of a PET film having aluminum evaporated to a thickness of 500 angstrom was adhered to the adhesive surface to prepare a two-layer laminated film.
On the aluminum deposition surface of the film laminated in two layers,
Adhesive (# 610) 95 g (95 Vol%), toluene 210 g, stainless fiber (toughmic fiber) with aspect ratio 300 of 39 g (5 Vol%) were mixed and stirred, and applied so that the solid content became 100 μm. A test piece was prepared in the same manner as in Example 1 (the cross-sectional structure is shown in FIG. 5). The measured value of electromagnetic wave shielding effect is frequency 10
It was 65 dB at MH _Z.

[0039]

Example 12 90 parts by weight of adhesive (# 610) (95%)
Vol%), 39 parts by weight (5 Vol%) of stainless fiber (toughmic fiber) having an aspect ratio of 300
Kneaded with a 0 liter kneader and put it on a silicone treated release paper as shown in FIG.
It was extruded and laminated into a sheet having a thickness of 00 μm to obtain an adhesive sheet. The adhesive layer of the adhesive sheet prepared in FIG. 3 is adhered to the deposition surface of a PET film having a width of 90 cm, which is prepared by separately depositing aluminum to a thickness of 500 Å, that is, laminated as shown in FIG. While winding up. The cross-sectional structure of this laminated film is as shown in FIG. This laminated film was cut to a length of 180 cm and attached to a wall surface for construction. It took 3 minutes for two people to peel off the release paper from the cut pieces and stick it to the wall. Also,
A test piece having a shape as shown in Example 1 was cut from this original fabric, and the electromagnetic wave shielding effect was measured. As a result, a frequency of 10 MHz was obtained.
It was 57 dB in _Z.

[0040]

EXAMPLE 13 Adhesive (# 610) 95 g (95 Vo) was deposited on the vapor deposition surface of a PET film obtained by vapor-depositing nickel (Ni) to a thickness of 500 Å cut into A4 size.
1%), 210 g of toluene, 39 g (5 Vo) of stainless fiber (toughmic fiber) having an aspect ratio of 300.
1%) A mixture was prepared by stirring and applied so as to have a solid content of 100 μm, and a test piece was prepared in the same manner as in Example 1. Measurement of electromagnetic wave shielding effect in the frequency 10 MHz _Z 4
7 dB.

[0041]

[Embodiment 14] 90 g (90 Vol) of adhesive (# 610) was applied to the vapor deposition surface of a PET film obtained by cutting aluminum into a size of 500 Å and having a thickness of 500 Å.
%), 210 g of toluene, and 89.3 g (10 Vol) of fine copper powder (Cu-At-W250) having an aspect ratio of about 1.
%) Compounding and stirring was applied so as to have a solid content of 100 μm, and a test piece was prepared in the same manner as in Example 1. Measurement of electromagnetic wave shielding effect in the frequency 10 MHz _Z 45
dB.

[0042]

Comparative Example 1 900 mm wide and 1800 mm long PE obtained by vapor-depositing aluminum to a thickness of 500 Å.
When the T film was attached to the wall for construction, an adhesive applicator was brought to the site, rubber, acrylic emulsion (AT-14NT) adhesive was applied, and it was attached to the wall.
It took 10 minutes for two people. Further, the shielding effect of electromagnetic wave of the film at a frequency 10 MHz _Z 43
dB.

[0043]

[Comparative Example 2] A Ni-based conductive paint (Dotite FN-1) was applied to one surface of a PET film cut into A4 size.
01) was applied to a solid content of 10 μm and dried. After preparing a test piece from this film in the same manner as in Example 1, the electromagnetic wave shielding effect was measured. Measurements results were 30dB at a frequency 10 MHz _Z.

[0044]

[Comparative Example 3] A Cu-Ag-based conductive coating (Dotite F) was applied to one surface of a PET film cut into A4 size.
E-107) was applied to have a solid content of 10 μm and dried. A test piece was prepared from this film in the same manner as in Example 1, and the electromagnetic wave shielding effect was measured. The result was 42dB at a frequency of 10MH _Z.

[0045]

Industrial Applicability As described above, the electromagnetic wave shielding material according to the present invention is easy to manufacture, and is sufficient when applied to the inner wall, the ceiling, the front surface or the back surface of the floor of the room in which electronic equipment is installed. It is possible to obtain a good shielding effect, and the construction is easy, which saves a lot of time. If a pattern is printed on the surface of the plastic film, a beautiful room can be obtained without further wallpapering. Since the construction is easy as described above, not only the construction efficiency is improved, but also the construction cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view of an electromagnetic wave shielding material according to a first embodiment.

FIG. 2 is a schematic view showing the same manufacturing method.

FIG. 3 is a schematic view showing a manufacturing process of release paper according to the second embodiment of the manufacturing method.

FIG. 4 is a schematic view showing a manufacturing method according to the second embodiment.

FIG. 5 is a partial cross-sectional view of the electromagnetic wave shielding material according to the second embodiment.

FIG. 6 is a cross-sectional view showing a method of applying the electromagnetic wave shielding material according to the first embodiment.

FIG. 7 is a cross-sectional view showing a method of applying the electromagnetic wave shielding material according to the first embodiment.

FIG. 8 is a cross-sectional view showing a method of applying an electromagnetic wave shielding material having vapor-deposited thin film layers formed on both surfaces.

FIG. 9 is a cross-sectional view showing a method of applying an electromagnetic wave shielding material according to the second embodiment.

[Explanation of symbols]

 1 Plastic film 2 Evaporated thin film layer or plated thin film layer 3 Adhesive 4 Release paper A, A ', B Electromagnetic wave shielding material

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroshi Hattori 100 No. 1 Nishida, Naka, Higashida, Komaki City, Aichi Japan Plastic Industry Co., Ltd.

Claims (12)

[Claims] 1. The volume resistivity of at least one surface layer of the plastic film is 10 ⁻⁴ Ωcm or less,
An electromagnetic wave shielding material comprising an adhesive layer that adheres to at least one of the surface layers and a release paper that covers the surface of the adhesive layer. 2. A vapor deposition film of magnetic material having at least one surface conductive showing a volume resistivity of the conductive material or and volume resistivity shows a 10 ^-4 [Omega] cm or less 10 ^-4 [Omega] cm or less plastic film The electromagnetic wave shielding material according to claim 1, which comprises a layer or a plated thin film layer. 3. The conductive material and the magnetic material having conductivity are Al, Cu, Fe, Ni, Co, Si, Sn, Ti,
The electromagnetic wave shielding material according to claim 2, which is made of a metal or an alloy whose main component is one or more selected from Zn, Ag, Au, Cr, Mn, and Pb. 4. The conductive material mainly comprising conductive fibers having an aspect ratio of 20 or more is mixed and dispersed in the adhesive so that the volume resistivity is 10 ² Ωcm or less.
3. The electromagnetic wave shielding material described in 3. 5. The adhesive has 3 to 20% by volume of conductive fibers having an aspect ratio of 20 or more and a volume resistivity of 10 ⁻⁴ Ωcm or less so that the volume resistivity is 10 ² Ωcm or less, and scaly and / or fine particles. Volume specific resistance is 10 ^-4 Ω
0 to 20 Vo for a conductive material having a size of cm or less and / or a soft magnetic material having a high magnetic permeability, such as fibrous, scaly or fine particles.
The electromagnetic wave shielding material according to claim 1, wherein the mixture is dispersed by 1%. 6. The pattern printing according to claim 1, wherein the surface of the plastic film not coated with the adhesive is patterned.
The electromagnetic wave shielding material described in 3, 4, and 5. 7. A plastic least one surface to volume resistivity conductive material or and volume resistivity shows a 10 ^-4 [Omega] cm or less of the film is deposited a magnetic material having conductivity which indicates a 10 ^-4 [Omega] cm or less, or And a method for producing an electromagnetic wave shielding material, characterized in that a thin film layer is formed by plating, an adhesive is applied to the surface of the thin film layer, and release paper is laminated on the surface of the adhesive layer. . 8. Plastic least one surface to volume resistivity conductive material or and volume resistivity shows a 10 ^-4 [Omega] cm or less of the film is deposited a magnetic material having conductivity which indicates a 10 ^-4 [Omega] cm or less, or And to form a thin film layer by plating, prepare a separate release paper coated with an adhesive,
A method for producing an electromagnetic wave shielding material, characterized in that the release paper is laminated so that its adhesive layer adheres to the surface of the thin film layer. 9. The conductive material mainly composed of conductive fibers having an aspect ratio of 20 or more is mixed and dispersed in the adhesive so that the volume resistivity is 10 ² Ωcm or less.
9. The method for producing the electromagnetic wave shielding material according to 9. 10. The adhesive has a volume resistivity of 10 ² Ωcm.
3 to 15% by volume of the conductive fiber having an aspect ratio of 20 or more and a volume resistivity of 10 ⁻⁴ Ωcm or less as shown below.
And scale-like and / or fine-particle volume resistivity of 10 ⁻⁴
0 to 20 conductive material of Ωcm or less and / or fibrous, scaly, or fine particle-shaped soft magnetic material having high magnetic permeability
10. The method for producing an electromagnetic wave shielding material according to claim 7, 8 or 9, which is obtained by mixing and dispersing Vol%. 11. A plastic film in which at least one surface layer has a volume resistivity of 10 ⁻⁴ Ωcm or less on the front surface or the back surface of a wall, floor, or ceiling to shield electromagnetic waves, and 10 ⁻⁴ Ωcm or less. The electromagnetic wave shielding material composed of an adhesive layer that adheres to at least one of the surface layers exhibiting a volume specific resistance and a release paper that covers the surface of the adhesive layer so that the adhesive layer adheres to the electromagnetic wave shielding material. A method for applying an electromagnetic wave shielding material, which comprises peeling a release paper and adhering the release paper to the adhesive. 12. An electrically conductive lead wire or conductor for grounding is installed on the front surface or the back surface of a wall, floor, or ceiling where electromagnetic waves are to be shielded, and at least one surface layer has 10 ⁻ 10 on its installed surface. ⁴ and plastic film having the following volume resistivity [Omega] cm, covered with 10 ^-4 [Omega] cm adhesive layer adhering to the at least one surface layer having the following volume resistivity, further the surface of the adhesive layer peeling A method for applying an electromagnetic wave shielding material, which comprises peeling off a release paper so that the conductive adhesive adheres to the electromagnetic wave shielding material composed of paper and adhering it.