JPH10163304A - Thin plate support - Google Patents

Abstract

(57) Abstract: To prevent adjacent semiconductor wafers A from contacting each other. SOLUTION: The semiconductor wafer carrier 1 supports a large number of semiconductor wafers A at the same time. Two end walls 2, 3 provided facing each other, and a horizontal support which is provided opposite to each other while connecting the end walls 2, 3 and supports a large number of semiconductor wafers A on the inner side surface at a constant interval from each other. Side walls 5 with ribs 4 for
6 and a bidirectional support rib 7 provided on the inner side of the side walls 5, 6 with the side walls 5, 6 connected to each other to support a large number of semiconductor wafers A at a constant interval from each other. And side support portions 8 and 9. The horizontal support ribs 4
The wafer supporting surface 4A is formed substantially horizontally so as to accurately support the semiconductor wafer A horizontally.
Was composed of an inlet 7A and a back 7B, the inlet 7A was formed horizontally, and the back 7B was formed in a V-groove shape.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin-plate support for simultaneously supporting a plurality of thin plates such as semiconductor wafers and carrying out storage, transportation, cleaning, etc., and more particularly to a thin-plate support for large semiconductor wafers. It relates to a suitable thin plate support.

[0002]

2. Description of the Related Art A semiconductor wafer carrier using a semiconductor wafer as a thin plate, for example, is known as a thin plate support for simultaneously storing and transporting a plurality of thin plates. The semiconductor wafer carrier is mainly provided with two end walls provided facing each other, a side wall provided facing each other in a state where each end wall is connected, and a back wall provided in a state where each end wall is connected. And a rear support portion provided.

[0003] Support ribs are provided on each side wall and on the inner side surface of the back side support portion to support a large number of thin plates at a constant distance from each other. The supporting rib has a similar cross-sectional shape between the side wall and the back side supporting portion. That is, for a large-sized semiconductor wafer, it is important to accurately support the semiconductor wafer in a horizontal state. Therefore, all the supporting ribs are inclined exactly by 1 ° so that the upper surface thereof is substantially horizontal. It is formed with corners. The base ends are formed at regular intervals between the supporting ribs so that the semiconductor wafer and the ribs do not contact each other when the semiconductor wafer is taken in and out. For example, in the case of a semiconductor wafer having a diameter of 30 cm,
When a semiconductor wafer is stored in a wafer carrier,
The distance between the upper surface of the semiconductor wafer and the lower surface of the supporting rib is set to about 6 mm.

[0004]

However, as described above, if the base ends of the support ribs provided on each side wall and the back side support portion are formed at a fixed interval, the wafer carrier may be vertically moved. When placed in the semiconductor wafer stored,
May vary from side to side. That is, the lower end of each semiconductor wafer is supported separately without being positioned at the base end of the back support. In this state, since the semiconductor wafers are supported by the supporting ribs at different angles, there is a problem that the upper part is largely shifted left and right, and in the worst case, they come into contact with each other.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and supports a thin plate such as a semiconductor wafer accurately horizontally in a horizontal state, and supports the thin plates in a vertical state at constant intervals without contacting each other. It is an object of the present invention to provide a support for a thin plate that can be used.

[0006]

According to a first aspect of the present invention, there is provided a thin plate supporter for supporting a plurality of thin plates at the same time, comprising two end walls provided opposite to each other, and each end wall being provided. A side wall provided with support ribs provided opposite to each other in a connected state and supporting the plurality of thin plates at a constant interval from each other on the inner side, and provided on the inner side of the side wall with each end wall connected. A back support portion provided with support ribs for supporting the plurality of thin plates at a constant interval from each other on the inner surface thereof,
The supporting ribs of the side walls are formed so that the upper side surface in a horizontal state is substantially horizontal so as to accurately support the thin plate horizontally, and the supporting ribs of the back side support portion define an inlet portion and a back portion. Have
When the inlet portion is formed substantially horizontally on the upper side surface in a horizontal state so as to accurately support the thin plate horizontally together with the supporting ribs on the side wall, and the back portion vertically supports the thin plate. The thin plate is formed in a V-groove shape so as to position and support the lower end of the thin plate and to suppress the thin plate from being greatly inclined.

[0007] With the above arrangement, when the thin plate support is horizontally arranged and placed in a horizontal state, the thin plate is provided on the upper surface of the support rib on the side wall and the upper surface of the inlet portion of the support rib on the rear support portion. Is placed. Thus, the thin plate is accurately supported horizontally.

[0008] When the thin plate support is vertically arranged to be in a vertical state, the thin plate is supported by the back portion of the support rib of the back support portion. As a result, the lower end of the thin plate is
It enters the groove and its position is fixed. As a result, the thin plate is supported by the supporting rib on the side wall in the vicinity of the center in the up-down direction while the lower portion is supported so as not to shift. Accordingly, the thin plates are not greatly inclined, and the upper ends of the adjacent thin plates can be prevented from contacting each other.

A second aspect of the present invention is characterized in that the back support portion is formed in a rod shape or a plate shape, and one or more back support portions are provided on the back side of the side wall.

[0010] According to the above configuration, the back support portion can reliably support the thin plate from the back side to the thin plate support.

[0011]

Embodiments of the present invention will be described below with reference to the accompanying drawings. The thin plate support of the present invention supports a plurality of thin plates such as a semiconductor wafer, a storage disk, and a liquid crystal plate in parallel. Hereinafter, a case where a semiconductor wafer is used as a thin plate and a semiconductor wafer carrier is used as a thin plate support will be described as an example.

The semiconductor wafer carrier 1 of the present embodiment comprises:
Particularly, the carrier is suitable for storing a large semiconductor wafer of about 30 cm. As shown in FIGS. 1 to 5, two end walls 2 and 3 are provided opposite each other, and a horizontal support rib 4 is provided on the inner side surface and provided opposite to each other while connecting the end walls 2 and 3. The side walls 5, 6 and the end walls 2, 3 are connected to each other and provided on the inner side (the right side in FIG. 2) of the inner side (the right side in FIG. 2). It has a back support portion 8, 9 provided with a rib 7.

The end walls 2, 3 are formed in a substantially disk shape. As shown in FIGS. 2, 4, and 6, a positioning fitting portion 11 for positioning the semiconductor wafer carrier 1 is formed on the outer surface of the one end wall 3. The positioning fitting portion 11 is composed of three fitting pieces. Each fitting piece is configured to have a V-shaped groove 11A, and each groove 11A is arranged in three directions at intervals of approximately 120 °.
The projection 12 is a stopper for preventing the semiconductor wafer carrier 1 from being largely displaced when the semiconductor wafer carrier 1 is positioned.

The side walls 5 and 6 are provided with the projecting portions 2 of the end walls 2 and 3 respectively.
A, 3A are integrally connected to each other to connect the end walls 2, 3 to each other. The side walls 5, 6 are formed to be curved along the overhangs 2A, 3A. To be more precise, the back side (the left side in FIG. 2) is formed so as to be greatly curved along the outer peripheral edge of the semiconductor wafer A housed in the semiconductor wafer carrier 1. The entrance side of the side walls 5 and 6 (the right side in FIG. 2)
The end is formed to be open to facilitate the taking in and out of the semiconductor wafer A.

The horizontal support ribs 4 support a large number of semiconductor wafers A at a constant distance from each other, and are formed along the inner surfaces of the side walls 5 and 6. That is, the whole is curved and formed to be open toward the entrance side.
The horizontal support ribs 4 have different cross-sectional shapes on the inlet side and the inner side. On the entrance side, as shown in FIG. 7, when the semiconductor wafer A is supported in a horizontal state, the wafer supporting surface 4A, which is the upper surface in contact with the semiconductor wafer A, is almost in a horizontal state. Are formed. The lower side surface 4B is formed to be slightly inclined (inclined so as to open between the wafer supporting surface 4A) so as not to be an obstacle when the semiconductor wafer A is taken in and out of the semiconductor wafer carrier 1. . Further, the wafer support surface 4
A and the bottom 4C of the lower side surface 4B are formed at a large angle (for example, an angle of about 60 ° to 80 ° with respect to the horizontal) from the lower side surface 4B side toward the wafer support surface 4A side and inward. ing. This is to prevent the semiconductor wafer A inserted into the semiconductor wafer carrier 1 from riding on the inclined surface even if the semiconductor wafer A is shifted left and right inside, so that the horizontal state of the semiconductor wafer A is not damaged.

The rear side of the horizontal support rib 4 is formed as shown in FIG. That is, the wafer support surface 13A is
Like the wafer support surface 4A, it is formed substantially horizontally. The lower side surface 13B is formed at an angle smaller than the lower side surface 4B (a smaller angle with respect to the horizontal). Further, the bottom portion 13C of the wafer support surface 13A and the lower side surface 13B
Are formed in a V-groove shape unlike the inlet side. This means that when the semiconductor wafer carrier 1 is vertically arranged and the semiconductor wafer A is vertically supported, the lower end of the semiconductor wafer A is positioned in conjunction with a V-groove at the back 7B of the bidirectional support rib 7 described later. It is to support.

The back support portions 8, 9 connect the end walls 2, 3 to support them, and function as legs of the semiconductor wafer carrier 1 with the semiconductor wafer carrier 1 arranged vertically. That is, the outer side surfaces of the back side support portions 8 and 9
It is formed flat so as to be stably mounted on the mounting table. Further, a bidirectional support rib 7 is formed on the inner side surface of each of the back support portions 8 and 9. The bidirectional support ribs 7 support a large number of semiconductor wafers A at a constant interval from each other, and are composed of an entrance 7A and a depth 7B. The wafer supporting surface 14A of the entrance 7A is
6 and the wafer support surface 4A of the horizontal support rib 4
In order to accurately support the semiconductor wafer A horizontally, the semiconductor wafer A is formed in a substantially horizontal state, exactly at an inclination of 1 °. The lower side surface 14B is also formed in a substantially horizontal state similarly to the wafer support surface 14A. In addition, each surface 14A, 14B
Are set in opposite directions to each other so that their surfaces open.

The back portion 7B of the bidirectional support rib 7 is formed in a V-groove shape. With this shape, when the semiconductor wafer carrier 1 is vertically arranged to support the semiconductor wafer A in a vertical state, the lower end portion of the semiconductor wafer A fits into the deepest portion of the V-groove and is positioned and supported. It has become. Thus, the semiconductor wafer A is supported at its lower end by the back portion 7B, and is supported by the horizontal support ribs 4 near the center in the vertical direction, so that the semiconductor wafer A does not tilt greatly.

The semiconductor wafer carrier 1 configured as described above has a semiconductor wafer A inserted therein and is used for storage, transport, cleaning and the like. When inserting the semiconductor wafer A into the semiconductor wafer carrier 1, first, the semiconductor wafer carrier 1 is accurately positioned and mounted on a mounting table (not shown). Specifically, it is mounted so that the positioning fitting part 11 of the end wall 3 is fitted to the positioning fitting part provided on the mounting table side. Thus, the position and direction of the semiconductor wafer carrier 1 are accurately adjusted, and the semiconductor wafer carrier 1 is mounted on the mounting table.

Next, a transfer robot (not shown) inserts the semiconductor wafer A placed on the arm into the semiconductor wafer carrier 1. At this time, since the wafer support surface 4A and the lower side surface 4B of the horizontal support rib 4 are open outward and their distance is wide, they can be easily taken in and out. Furthermore, the wafer support surface 4 of the horizontal support rib 4
A and the two-way support rib 7 are securely mounted on the wafer support surface 14A, and do not climb on the inclined surface and tilt.
The semiconductor wafer A is accurately kept in a horizontal state.

On the other hand, the semiconductor wafer carrier 1 may be placed or transported in a vertical direction. At this time, the semiconductor wafer A is supported vertically. That is, when the semiconductor wafer carrier 1 is disposed vertically, the semiconductor wafer A directly contacts the bidirectional support ribs 7 of the back support portions 8 and 9. As a result, the peripheral portion of the semiconductor wafer A fits into the V-groove portion of the back portion 7B, and is positioned and supported.
Further, the intermediate position of the semiconductor wafer A is supported by the horizontal support ribs 4. In this state, the semiconductor wafer carrier 1
Are transported or processed. At this time, the semiconductor wafer A may be slightly tilted or shaken, but the semiconductor wafer A is placed in a state where the lower end thereof is securely positioned and supported by the bidirectional support ribs 7, and the horizontal support ribs 4. The intermediate part is supported by the semiconductor wafer A
Will no longer sway left and right.

As a result, the adjacent semiconductor wafers A do not come into contact with each other at the upper ends thereof, and the surface of the semiconductor wafer A can be reliably prevented from being damaged.

[Modification] In the above embodiment, one bidirectional support rib 7 is provided on the back side, but two or more ribs may be provided. With this, the same effect as in the above embodiment can be obtained.

Further, in the above-described embodiment, the back support portions 8,
Although 9 is formed in a rod shape, it may be formed in a plate shape.

[0025]

As described in detail above, according to the thin-plate support of the present invention, the following effects can be obtained.

The upper side surface of the support rib on the side wall in a horizontal state is formed substantially horizontally, the entrance of the support rib on the back side support portion is formed horizontally, and the back portion is formed in a V-groove shape. Therefore, the thin plates can be reliably supported in a vertical state, and the adjacent thin plates can be reliably prevented from contacting at the upper end.

[Brief description of the drawings]

FIG. 1 is a side view showing a semiconductor wafer carrier according to the present invention.

FIG. 2 is a front sectional view showing a semiconductor wafer carrier according to the present invention.

FIG. 3 is a front view showing a semiconductor wafer carrier according to the present invention.

FIG. 4 is a rear view showing a semiconductor wafer carrier according to the present invention.

FIG. 5 is a plan view showing a semiconductor wafer carrier according to the present invention.

FIG. 6 is a sectional view showing a positioning fitting portion of the semiconductor wafer carrier according to the present invention.

FIG. 7 is a sectional view showing an inlet side of a horizontal support rib of the semiconductor wafer carrier according to the present invention.

FIG. 8 is a cross-sectional view showing a back side of a horizontal support rib of the semiconductor wafer carrier according to the present invention.

FIG. 9 is a sectional view showing a bidirectional support rib of the semiconductor wafer carrier according to the present invention.

[Explanation of symbols]

1: semiconductor wafer carrier, 2: 3: end wall, 4: horizontal support rib, 5,6: side wall, 7: bidirectional support rib, 8,
9: back side support part, 11: positioning fitting part.

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[Procedure amendment]

[Submission date] March 7, 1997

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction contents]

The semiconductor wafer carrier 1 of the present embodiment comprises:
Particularly, the carrier is suitable for storing a large semiconductor wafer of about 30 cm. This semiconductor wafer carrier 1
As shown in FIG. 1 to FIG. 5 and FIG. 10 , two end walls 2, 3 are provided facing each other, and horizontal support ribs are provided on the inner side surface which are provided facing each other while connecting the end walls 2, 3. 4 and the side walls 5, 6 with the end walls 2, 3 connected.
Are provided on the inner side (the right side in FIG. 2) of the rear side (left side in FIG. 2).

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction contents]

The end walls 2 and 3 are formed in a substantially disk shape. On the outer surface of one end wall 3 , FIG.
As shown in FIG. 10 , a positioning fitting portion 11 for positioning the semiconductor wafer carrier 1 is formed. The positioning fitting portion 11 is composed of three fitting pieces. Each fitting piece is configured to have a V-shaped groove 11A, and each groove 11A is arranged in three directions at intervals of approximately 120 °. The projection 12 is a stopper for preventing the semiconductor wafer carrier 1 from being largely displaced when the semiconductor wafer carrier 1 is positioned.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Change

[Correction contents]

The back support parts 8, 9 are shown in FIGS. 3 and 4.
As described above, while connecting the end walls 2 and 3 to support them and the semiconductor wafer carrier 1 is arranged vertically,
It functions as a leg of the semiconductor wafer carrier 1. That is,
The outer surfaces of the back support portions 8 and 9 are formed flat so as to be stably mounted on the mounting table. Further, a bidirectional support rib 7 is formed on the inner side surface of each of the back side support portions 8 and 9. The bidirectional support ribs 7 support a large number of semiconductor wafers A at a constant interval from each other .
As shown, it is composed of an entrance 7A and a back 7B. The wafer supporting surface 14A of the entrance 7A is combined with the wafer supporting surface 4A of the horizontal supporting ribs 4 of the side walls 5, 6 so that the semiconductor wafer A can be supported horizontally and accurately. ° is formed. The lower side surface 14B is also formed in a substantially horizontal state similarly to the wafer support surface 14A. The inclination directions of the surfaces 14A and 14B are set to be opposite to each other so that the surfaces open.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] FIG.

[Correction method] Added

[Correction contents]

FIG. 10 is a perspective view showing a semiconductor wafer carrier according to the present invention.

[Procedure amendment 5]

[Document name to be amended] Drawing

[Correction target item name] Fig. 1

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FIG.

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[Procedure amendment 8]

[Document name to be amended] Drawing

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[Procedure amendment 9]

[Document name to be amended] Drawing

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[Procedure amendment 10]

[Document name to be amended] Drawing

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[Procedure amendment 11]

[Document name to be amended] Drawing

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[Procedure amendment 12]

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[Procedure amendment 13]

[Document name to be amended] Drawing

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[Procedure amendment 14]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Added

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FIG. 10

Claims (2)

[Claims] 1. A thin plate supporter for supporting a plurality of thin plates simultaneously, comprising: two end walls provided opposite each other; and said plurality of thin plates provided on an inner surface provided opposite each other while connecting the end walls. A side wall provided with a supporting rib for supporting at a constant interval from each other; and a plurality of thin plates supported on an inner side surface provided at a deep side of the side wall with each end wall connected to each other, supporting the plurality of thin plates at a constant interval from each other A back-side supporting portion provided with a supporting rib to be formed, wherein the supporting rib on the side wall is formed so that an upper side surface in a horizontal state is substantially horizontal so as to support the thin plate accurately and horizontally. The support ribs of the side support portion have an inlet portion and a back portion, and the inlet portion, together with the support ribs of the side wall, supports the upper surface in a horizontal state so as to accurately support the thin plate horizontally. Each sheet is formed almost horizontally, and when the back supports the sheet vertically. So as to suppress the thin plate supporting and positioning the lower end portion is inclined largely, thin supporting device, characterized in that it is formed in a V groove shape. 2. The support for a thin plate according to claim 1, wherein the back support is formed in a rod shape or a plate shape, and one or more back support portions are provided on the back side of the side wall. Support for thin plates.