JPH10334203A - IC card and IC module - Google Patents

Abstract

[PROBLEMS] To form a capacitance of a resonance circuit without adding a chip capacitor or a capacitance element built in an IC chip. SOLUTION: In this IC card, a stray capacitance generated between an antenna coil 6 and a capacitance element 2 is used as a capacitance of a resonance circuit. Therefore, the antenna coil 6 and the capacitance adjusting element 2 are only connected in an AC manner by the stray capacitance, and are not connected in a DC manner with the contact. This stray capacitance is
The distance between the antenna coil 6 and the capacitance adjusting element 2,
It is determined by the dielectric constant of the material interposed therebetween and the shape of the capacitance adjusting element 2. Therefore, the stray capacitance can be adjusted by making the shape of the capacitance adjusting element 2 variable.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card and an IC module for reading and writing external data and supplying electric power in a non-contact manner by electromagnetic waves or the like.

[0002]

2. Description of the Related Art An I / O having a function of storing and processing data is provided.
C cards are known. Some IC cards of this type perform reading and writing of data from outside and supply of electric power in a non-contact manner by electromagnetic waves or the like, and are called non-contact IC cards. Non-contact IC cards store data,
IC with various electronic components for processing and communication control
It is configured by incorporating a portion called an inlet including a chip and an antenna coil functioning as an antenna for receiving an electromagnetic wave into a plastic substrate.

[0003]

However, non-contact ICs
When reading and writing of a card is performed using an electromagnetic wave, a frequency selection circuit corresponding to the frequency of the electromagnetic wave, that is, a resonance circuit is required in the card. This resonance circuit generally includes an inductance element and a capacitance element, and often uses an antenna coil as the inductance element and a chip capacitor as the capacitance element.

[0004] The shape of the antenna coil depends on the resonance frequency of the resonance circuit, and this resonance frequency is generally given by the following equation. f = 1 / {2 · π · {(LC)} where f is the resonance frequency, L is the inductance of the antenna coil, and C is the capacitance (for example, chip) connected to the antenna coil. Capacity of a capacitor). From the above equation, the resonance frequency f is inversely proportional to the square root of the product of the inductance L and the capacitance C. Therefore, for example, to lower the resonance frequency f, it is necessary to increase the inductance L of the antenna coil. In general,
The inductance of the coil depends on the number of turns and the external dimensions. For example, in the case of a circular coil, the larger the number of turns and the larger the outer diameter and inner diameter, the larger the inductance. However, from the viewpoint of the mechanical strength of the IC card, the smaller the antenna coil, the smaller the stress applied to the antenna coil.

On the other hand, if the capacitance C is increased, the inductance L can be reduced, so that the antenna coil can be made smaller. However, this capacitance C
Is usually composed of a chip capacitor and a capacitance element built in the IC chip. Therefore, in order to keep the thickness of the IC card within a certain standard (for example, ISO7816), the size of the chip capacitor or the IC chip is also required. There are restrictions.

Further, the following problems (1) to (4) can be cited as problems of using a chip capacitor. (1) Decrease in mechanical strength IC card manufacturing methods include a laminating method and an injection molding method. In any of the manufacturing methods, heat and pressure are applied when the inlet is inserted into the card base material. For this reason, it is desirable that the inlet be excellent in heat resistance and pressure resistance. However, since the chip capacitor is usually formed of a ceramic capacitor (multilayer ceramic), it is liable to break and may not withstand stress during processing.
Further, even after being made into a card, the strength becomes weak against bending. On the other hand, when the thickness of the chip is increased to increase the strength, the thickness of the card becomes a certain standard (for example, ISO781).
6 does not fit within the thickness of 0.76 mm). (2) Increase in cost The number of components is increased by the amount of the chip capacitor, and a process for mounting the components is also required, thereby increasing the manufacturing cost. (3) Deterioration in reliability Soldering is generally used as an electrical connection method for a chip capacitor, but a soldered portion may be deteriorated by heating during processing. Therefore, an increase in the number of components, such as addition of a chip capacitor, increases the failure rate and reduces reliability. (4) Difficulty in Adjusting Capacitance When correcting the resonance frequency of the resonance circuit that fluctuates due to manufacturing variations of parts, there is a method of adjusting the chip capacitor by sandblasting. However, this method is not preferable because it takes time to remove shavings, and stress may be applied to the chip capacitor, which may affect the quality. On the other hand, it is also possible to provide a plurality of chip capacitors in the inlet and adjust the capacitance by changing the connection of the chip capacitors. However, this method is not preferable because it causes a decrease in mechanical strength due to an increase in chip area, an increase in manufacturing cost due to an increase in the number of components, and a decrease in reliability. Further, any of the above-described methods can be performed in the state of the inlet, but cannot be performed after the card is formed.

On the other hand, there are the following problems (1) to (3) as problems of incorporating a capacitance element in an IC chip. (1) Increase in cost Since the chip area is increased by embedding the capacitance element in the IC chip, the number of chips that can be manufactured per wafer decreases, and the manufacturing cost per IC chip increases. Resulting in. (2) Decrease in mechanical strength Similarly, if the chip area becomes large, stress such as bending is more strongly received at the time of card processing or after card production, which is disadvantageous in strength. (3) Difficulty in Adjusting Capacitance When a capacitance element is built in an IC chip, it becomes difficult to adjust the capacitance after completion of an IC card.

After all, using a chip capacitor as the capacitance of the resonance circuit or incorporating a capacitance element in an IC chip has various problems and is not desirable.

The present invention has been made under such a background, and an IC capable of forming a capacitance of a resonance circuit without adding a chip capacitor or a capacitance element built in an IC chip. An object is to provide a card and an IC module. Another object of the present invention is to make it possible to easily adjust the resonance frequency of the resonance circuit after the completion of the inlet or the completion of the IC card.

[0010]

According to an aspect of the present invention, there is provided an IC card for performing data storage, processing, and communication control, and an IC card comprising: an IC card; And coupling means for generating a power supply voltage and transmitting / receiving a signal via an AC magnetic field of a predetermined frequency propagating in space, and provided with a predetermined distance from the coupling means or via an insulating material. And a conductor is arranged.

The invention described in claim 2 is the first invention.
In the IC card described in (1), the conductor can be changed in equivalent capacitance by cutting a part of the conductor.

Further, the invention described in claim 3 is the first invention.
3. The IC card according to item 2, wherein the conductor has a foil shape.

The invention described in claim 4 is the first invention.
Or the IC card according to item 2, wherein the conductor is in the form of a conductive wire.

The invention described in claim 5 is the first invention.
Wherein the heat storage layer is provided in contact with the conductor, and the conductor can be cut by heating the heat storage layer.

According to a sixth aspect of the present invention, there is provided an IC module comprising an IC chip for storing, processing, and controlling communication of data, and an AC magnetic field connected to the IC chip and having a predetermined frequency and propagating in space. And a coupling means for generating a power supply voltage and transmitting / receiving a signal through the coupling means, and a conductor is arranged at a predetermined interval from the coupling means or via an insulating material.

According to a seventh aspect of the present invention, there is provided an IC card, wherein the IC module according to the sixth aspect is fitted or included in a card base material.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. A: Configuration of the Embodiment FIG. 1 is a perspective view showing each layer separately for explaining the configuration of an IC card according to an embodiment of the present invention.
In this figure, the present IC card is configured as one card by superposing a plurality of layered structural members, and includes a front resin sheet 3, an inlet 1, a core resin sheet 5, a capacitance adjusting element 2, and a rear resin. It consists of sheet 4.

The surface resin sheet 3, the back resin sheet 4, and the core resin sheet 5 are mainly made of polyvinyl chloride, ABS (acrylonitrile butadiene styrene), PET (polyethylene terephthalate), P
Resins such as C (polycarbonate), PE (polyimide), and epoxy are used. Resins generally used for printed wiring boards and other materials that can be formed into sheets such as synthetic paper and paper are used. Is also good. In addition, glass fibers, glass beads, titanium oxide, calcium carbonate, or the like may be mixed into the resin for the purpose of adjusting the strength and color.

The layer structure shown in FIG. 1 is assembled by a general plastic card manufacturing method such as a laminating method, but may be formed by an injection molding method.
An adhesive may be applied between the respective layers.

Front resin sheet 3 and back resin sheet 4
There are plastic cards with magnetic tape and I
Materials for plastic cards commonly used for C cards can be used. Further, a protective layer for protecting the printing surface may be provided further outside the front surface resin sheet 3 and the backside tree sheet 4. As this protective layer, a member on a sheet may be attached or coated with a resin or the like. Further, an image receiving layer such as polyester may be provided on the front or back surface of the card for printing.

Next, FIG. 2 is a plan view of the inlet 1 shown in FIG. 1, and FIG. 3 is a sectional view of the module 7 in the inlet 1 shown in FIG. In these figures,
The inlet 1 is configured by connecting an antenna coil 6 and a module 7 via a connection pad 8, and the module 7 has an IC chip 9 mounted on a printed board 11.

As the antenna coil 6, a copper wire wound in a loop shape or a copper foil etched to form a copper foil pattern is used. Antenna coil 6
It is appropriate to use inexpensive copper as the material of
Not limited to this, gold, silver,
Other materials besides metals such as aluminum can be used. For example, carbon may be used, or a conductive paste or the like printed and patterned may be used. However,
If the DC resistance value of the antenna coil 6 is large, the characteristics as a transmission / reception antenna deteriorate, so that it is necessary to select a material in consideration of electrical characteristics.

The antenna coil 6 is formed by a general coil winding method such as a spiral shape. In the case of a spiral shape, it can be patterned by etching or printing. Further, by using a rectangular wire, a spiral shape can be easily formed even with a winding wire, and the aspect ratio of the conductor cross section can be improved as compared with the case of etching or printing.

The module 7 is configured by mounting the IC chip 9 on the printed board 11 as described above. As the mounting method, various well-known IC chip mounting methods such as a COB (Chip On Board), a flip chip, and a TAB (Tape Automated Bonding) method can be applied.

As a material of the printed board 11, a glass epoxy board is usually used, but a film such as polyimide or a metal used for a lead frame of an IC may be used. The IC chip 9 is protected by a sealing resin 10 made of an epoxy resin or the like. As the sealing method, for example, various methods known as resin sealing of IC, such as a potting method and a transfer molding method, are used. The module 7 may be provided with another capacitor. In this case, for example, a chip capacitor made of a multilayer ceramic is used. For connection between the antenna coil 6 and the module 7 and connection between the capacitor and the module 7, a well-known method for connecting electronic components, such as soldering or connection using a conductive adhesive, is used.

FIG. 4 is a plan view showing the appearance of the capacitance adjusting element 2 shown in FIG. FIG. 5 is a perspective view showing a positional relationship between the capacitance adjusting element 2 and the antenna coil 6. In the present embodiment, the shape and material of the capacitance adjusting element 2 are the same as those of the antenna coil 6. The shape of the capacitance adjusting element 2 shown in FIG. 4 is rectangular, but is not necessarily limited to this. Various shapes such as a circle, an ellipse, and a square can be adopted according to the shape of the antenna coil 6. It is.

Here, when the capacitance is viewed from the module 7 side, the stray capacitance of the antenna coil 6 itself and the distance formed between the capacitance adjusting element 2 and the antenna coil 6 when the capacitor is not separately mounted, This is the sum of the stray capacitance generated in the space d.

B: Operation and Effect of the Embodiment Next, the operation and effect of the embodiment having the above configuration will be described. FIG. 6 is a circuit diagram showing an equivalent circuit of the resonance circuit in the IC card shown in FIG. In FIG. 6, reference numeral 12 denotes an inductance of the antenna coil 6, and reference numeral 13 denotes I
It corresponds to the circuit portion of the C chip 9. FIG. 7 is a circuit diagram showing an equivalent circuit of the antenna coil 6, and shows the inductance 12 shown in FIG. 6 in more detail. In FIG. 7, reference numerals 14, 15, and 16 denote an equivalent capacitance C, an equivalent inductance L, and an equivalent resistance R of the antenna coil 6, respectively.

That is, in the IC card of the present embodiment, the stray capacitance (ie, equivalent capacitance C shown in FIG. 7) generated between the antenna coil 6 and the capacitance element 2 (distance d).
Is used as the capacitance of the resonance circuit. Therefore, the antenna coil 6 and the capacitance adjusting element 2 are only connected in an AC manner by the stray capacitance, and are not connected in a DC manner with the contact.

Here, the stray capacitance is determined by the distance d between the antenna coil 6 and the capacitance adjusting element 2, the dielectric constant of a material interposed therebetween, and the shape of the capacitance adjusting element 2. Therefore, the stray capacitance can be adjusted / changed by making the shape of the capacitance adjusting element 2 variable.

For example, the stray capacitance is adjusted as follows. First, the capacitance adjusting element 2 is manufactured from a thin film. The material of the capacitance adjusting element 2 may be a conductor as in the case of the antenna coil 6, and is made of, for example, a metal thin film. Next, a heat storage layer is provided in close contact with the capacitance adjusting element 2 to form a card. Thereafter, the card is locally heated by, for example, irradiating a laser from the outside to cause the heat storage layer to generate heat, and the capacitance adjusting element 2 is processed into an arbitrary shape such as melting and cutting. By changing the shape of the capacitance adjusting element 2 as described above, the stray capacitance can be adjusted to a desired value.

Here, the metal thin film layer forming the capacitance adjusting element 2 is, for example, tin, bismuth, indium, lead,
It is composed of one or two or more materials of a simple substance or a metal compound of a low melting point metal such as cadmium, tellurium, aluminum, and silver, or a mixture thereof.
The heat storage layer is made of, for example, an infrared absorbing heat generating material and a binder, and its thickness is preferably 0.5 to 5 μm. As the material of the infrared absorbing heat generating material, a polymethylene cyanine dye or an azo dye, a naphthoquinone or anthraquinone dye, or the like is preferable.As the binder material, polyester resin, ethyl cellulose, methyl cellulose, cellulose acetate, hydroxyethyl cellulose, hydroxy Cellulosic resins such as propylcellulose, polyvinyl alcohol, polyvinyl acetate, polyvinyl butyral,
Vinyl resins such as polyvinyl acetal and polyacrylamide, polyolefins such as polyethylene and polypropylene, polyacrylate resins, epoxy resins, and phenol resins are desirable.

As described above, in the IC card of the present embodiment, the capacitance of the resonance circuit built in the IC card can be variably adjusted after the completion of the IC card. Variations in resonance frequency due to variations in component characteristics can be easily adjusted,
The resonance frequency can be set to a desired value with high accuracy.

In the IC card of the present embodiment, the stray capacitance of the antenna coil 6 itself, the capacitance adjusting element 2 and the antenna coil 6 are used as the capacitance of the resonance circuit.
Since the floating capacitance generated between the IC chip and the IC chip is utilized, it is not necessary to provide a separate chip capacitor or to incorporate a capacitance element in the IC chip. As a result, the mechanical strength of the IC card can be increased, and the manufacturing cost can be reduced.

Further, in the IC card according to the present embodiment, the capacitance adjusting element 2 can be disposed so as to be opposed to the antenna coil 6 so that the capacitance adjusting element 2 is separately provided on the IC card surface as in the case of forming a capacitor using conductive foil. This is advantageous when embossing the card surface without occupying the area.

Furthermore, in the IC card according to the present embodiment, the capacitance adjusting element 2 and the antenna coil 6 form a capacitance without being connected in a DC manner.
The number of solder welds in the card can be reduced, and the reliability is improved.

C: Modification In the IC card shown in FIG. 1, the capacitance adjusting element 2 having almost the same shape as the antenna coil 6 is attached to the antenna coil 6.
However, the present invention is not limited to this. For example, as shown in FIG. 8, the capacitance adjusting element 2 may be provided adjacent to the outside of the antenna coil 6. Further, as shown in FIG. 9, the capacitance adjusting element 2 may be provided adjacent to the inside of the antenna coil 6. Further, as shown in FIG. 10, the capacitance adjusting element 2 may be provided adjacent to both the inside and outside of the antenna coil 6.

As shown in FIG. 11, the capacitance adjusting element 2 may be provided so that the winding of the capacitance adjusting element 2 is located in the gap between the windings of the antenna coil 6. Further, as shown in FIG. 12, the capacitance adjusting element 2 may be arranged next to the antenna coil 6.

Further, the capacitance adjusting element 2 shown in FIG.
Has a single-layer structure, but the present invention is not limited to this, and the capacitance adjusting element 2 may be formed with a multi-layer structure. Then, the number of turns of the capacitance adjusting element 2 may be set so as to be a capacitance corresponding to a desired resonance frequency.

The module 7 including the IC chip 9
A portion including the antenna coil 6 and the capacitance adjusting element 2 is configured as an IC module 20 that is not integrated with a card, and the IC module 20 is fitted to a card base 21 as shown in FIG. , FIG.
As shown in FIG.

[0041]

FIG. 15 is a plan view showing a specific embodiment of the antenna coil 6 and the capacitance adjusting element 2. FIG. The antenna coil 6 shown in FIG. 3A is 35 μm thick on a white polyvinyl chloride sheet 17 having a thickness of 100 μm (micron).
It is a sheet member to which a thick copper foil is attached. The antenna coil 6 is formed by patterning by an etching method. In this example, the line width is 200 μm, the interval between the lines is 200 μm, and the number of turns is 4.

The capacitance adjusting element 2 shown in FIG. 2B is a white polyvinyl chloride sheet 18 having a thickness of 100 μm.
It is a sheet-like member on which a copper foil having a thickness of 35 μm is stuck. This capacitance adjusting element 2 is formed by patterning by an etching method. In this example, similarly to the antenna coil 6, the line width is 200 μm and the space between the lines is 200 μm.
m and the number of turns is 4.

The antenna coil 6 shown in FIG.
Instead of providing a capacitance in the IC chip 9,
A ceramic capacitor 21 of pF (picofarad) is connected by soldering. FIG. 16 shows an equivalent circuit in this case. In the figure, reference numeral 22 denotes an inductance of the capacitance adjustment element 2, and reference numeral 23 denotes a stray capacitance between the antenna coil 6 and the capacitance adjustment element 2. Also,
12 is an inductance of the antenna coil 6. Further, if the circuit shown in FIG. 16 is divided into a resistance component R, an inductance component L, and a capacitance component C, an equivalent circuit shown in FIG. 17 is obtained. In the figure, 25 is a capacitance component C of the circuit shown in FIG. 16, 24 is an inductance component L of the circuit shown in FIG. 16, and 25 is a resistance component R of the circuit shown in FIG.

FIG. 18 is a graph showing the characteristics of the circuit in the case shown in FIG. 15C. FIG. 18A shows the impedance versus frequency characteristics, and FIG. 18B shows the phase versus frequency characteristics. Is shown. In FIG. 18A, the horizontal axis represents frequency, and the vertical axis represents the absolute value of impedance. The curve a shows the characteristics when only a 12 pF capacitor is provided in the antenna coil 6, and the curve b shows the characteristics when a 12 pF capacitor is provided in the antenna coil 6 and the capacitance adjusting element 2 is disposed to face the antenna coil 6. The characteristics are shown. From this graph, it can be seen that by arranging the capacitance adjusting element 2 in opposition to the antenna coil 6, the impedance versus frequency characteristic of the antenna coil 6 fluctuates and the resonance frequency shifts. On the other hand, FIG.
In the graph, the horizontal axis represents the frequency, and the vertical axis represents the phase displacement value. The phase displacement value is based on the phase at the resonance frequency. As in FIG. 18A, the curve a
Shows the characteristics in the case where only a 12 pF capacitor is provided in the antenna coil 6, and the curve b shows the characteristics in the case where a 12 pF capacitor is provided in the antenna coil 6 and the capacitance adjustment element 2 is opposed to the antenna coil 6. Is shown. From this graph, it can be seen that the resonance frequency is shifted by opposing the capacitance adjusting element 2 to the antenna coil 6.

FIG. 19 is an explanatory diagram showing specific numerical values of the characteristics shown in FIG.
And a case where only a 12 pF capacitor is provided (case of curve a) and a case where a 12 pF capacitor is provided for the antenna coil 6 and the capacitance adjusting element 2 is further added (curve b).
), The capacitance value (pF) and the resonance frequency (Hz) are shown. From this figure, it can be seen that the capacitance increases when the capacitance adjusting element 2 is added to the antenna coil 6 and the resonance frequency decreases.

FIG. 20 shows that the antenna coil 6 has
When only a 2 pF capacitor is provided (curve a)
And a 12 pF capacitor is provided in the antenna coil 6,
Further, in the case where the capacitance adjusting elements 2 are arranged opposite to each other in two layers, the capacitance value (pF) and the resonance frequency (H
z). As compared with the case of FIG. 19, it can be seen that the capacitance increases and the resonance frequency decreases by adding the layer of the capacitance adjusting element 2.

The capacitance adjusting element 2 shown in FIG. 15D is a white polyvinyl chloride sheet 1 having a thickness of 100 μm.
9 is a sheet-like member in which a copper foil having a thickness of 35 μm is stuck on the surface of the sheet 9.
This capacitance adjusting element 2 is different from the capacitance adjusting element 2 shown in FIG. 15B in that a cut k is formed in a copper foil forming a pattern. Although the number of cuts k shown in the figure is two, by changing the number of cuts k, it is possible to change the capacitance value of the resonance circuit and adjust the resonance frequency.

FIG. 21 is an explanatory diagram showing the capacitance (pF) and the resonance frequency (Hz) when the number of cuts k is changed in the capacitance adjusting element 2 shown in FIG. In the drawing, cutting n (n is 1 to 4) turns means that a cut k is made in n turns of the copper foil of the antenna coil 2. From this figure, it can be seen that as the number of cuts k in the copper foil of the antenna coil 2 increases, the capacitance of the resonance circuit decreases and the resonance frequency increases.

As described above, the layer of the capacitance adjusting element 2 is
By providing it in the C card, the capacitance of the resonance circuit in the IC card can be increased. Further, the capacitance adjusting element 2 is processed (for example, cut by local heating or the like).
By doing so, the capacitance of the resonance circuit in the IC card can be made variable, and the resonance frequency can be adjusted.

In the actually manufactured IC card, the antenna coil 6 was provided in the form of a vinyl chloride sheet, and the module 7 was mounted. Then, the capacitance adjusting element 2 was overlaid on the vinyl chloride sheet. further,
The front and back surfaces were laminated by a hot cold lamination method using a printed vinyl chloride sheet to form a card. In the IC card thus manufactured, since a chip capacitor is not built in the IC card, the manufacturing cost can be reduced, the mechanical strength can be increased, and the capacitance component value can be easily adjusted. it can.

[0051]

As described above, according to the present invention, it is possible to form the capacitance of the resonance circuit without adding a chip capacitor or a capacitance element built in an IC chip. An IC chip having excellent strength, cost performance, and reliability can be provided. According to the fifth aspect of the invention, in addition to the above effects, the capacitance of the resonance circuit can be changed by cutting the conductor by external heating after the completion of the inlet or the completion of the IC card. , Its resonance frequency can be easily adjusted.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of an IC card according to an embodiment of the present invention by exploding each layer of the card.

FIG. 2 is a plan view of an inlet included in the IC card shown in FIG.

FIG. 3 is a sectional view of a module forming a part of the inlet shown in FIG. 2;

FIG. 4 is a plan view showing the capacitance adjusting element shown in FIG. 1;

FIG. 5 is a perspective view showing a positional relationship between an antenna coil and a capacitance adjusting element.

FIG. 6 is a circuit diagram showing an equivalent circuit of a resonance circuit in the IC card shown in FIG.

7 is a circuit diagram showing an equivalent circuit of an antenna coil in the circuit shown in FIG.

FIG. 8 is a plan view showing a modification in which a capacitance adjusting element is provided adjacent to the outside of the antenna coil.

FIG. 9 is a plan view showing a modification in which a capacitance adjusting element is provided adjacent to the inside of an antenna coil.

FIG. 10 is a plan view showing a modification in which a capacitance adjusting element is provided adjacent to the inside and outside of an antenna coil.

FIG. 11 is a plan view showing a modification in which a capacitance adjusting element is provided such that a winding of the capacitance adjusting element is located in a gap between windings of an antenna coil.

FIG. 12 is a plan view showing a modification in which a capacitance adjusting element is arranged next to an antenna coil.

FIG. 13 is a perspective view showing a modification in which an IC module is fitted to a card base material.

FIG. 14 is a sectional view showing a modification in which an IC module is embedded in a card base material.

FIG. 15 is a plan view showing a specific mode of the antenna coil and the capacitance adjusting element, wherein (a) and (c) show the antenna coil, and (b) and (d) show the capacitance adjusting element. ing.

FIG. 16 is a circuit diagram showing an equivalent circuit of the antenna coil shown in FIG.

FIG. 17 is a detailed view of FIG. 16;

FIG. 18 is a graph showing the characteristics of the resonance circuit in the case shown in FIG. 15C, wherein FIG. 18A shows impedance versus frequency characteristics and FIG. 18B shows phase versus frequency characteristics.

FIG. 19 shows the characteristic shown in FIG.
It is explanatory drawing shown as F) and the specific numerical value of resonance frequency (Hz).

FIG. 20 is an explanatory diagram showing characteristics when two layers of the capacitance adjusting element 2 are provided as specific numerical values of the capacitance and the resonance frequency.

21 is an explanatory diagram showing characteristics when the number of cuts k is changed in the capacitance adjusting element shown in FIG. 15D as specific values of capacitance and resonance frequency.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Inlet 2 Capacitance adjustment element (conductor) 3 Front resin sheet 4 Back resin sheet 5 Core resin sheet (insulating material) 6 Antenna coil (coupling means) 7 Module 8 Connection pad 9 IC chip 10 Sealing resin 11 Printed circuit board

Claims (7)

[Claims] 1. An IC chip for performing data storage, processing, and communication control, and coupling means connected to the IC chip for generating a power supply voltage and transmitting / receiving a signal via an AC magnetic field of a predetermined frequency propagating in space. An IC card, comprising: a conductor disposed at a predetermined distance from the coupling means or via an insulating material. 2. The IC card according to claim 1, wherein an equivalent capacitance can be changed by cutting a part of the conductor. 3. The IC card according to claim 1, wherein the conductor has a foil shape. 4. The IC card according to claim 1, wherein the conductor is in the form of a conductive wire. 5. The IC card according to claim 1, wherein a heat storage layer is provided in contact with the conductor, and the conductor can be cut by heating the heat storage layer. 6. An IC chip for performing data storage, processing and communication control, and coupling means connected to the IC chip for generating a power supply voltage and transmitting / receiving a signal through an AC magnetic field of a predetermined frequency propagating in space. An IC module comprising: a conductor disposed at a predetermined distance from the coupling means or via an insulating material. 7. An IC, wherein the IC module according to claim 6 is fitted or included in a card base material.
card.