JPS51135367A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS51135367A JPS51135367A JP5947075A JP5947075A JPS51135367A JP S51135367 A JPS51135367 A JP S51135367A JP 5947075 A JP5947075 A JP 5947075A JP 5947075 A JP5947075 A JP 5947075A JP S51135367 A JPS51135367 A JP S51135367A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- high frequency
- frequency transistor
- emitter inductance
- decreased
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50059470A JPS5840339B2 (ja) | 1975-05-19 | 1975-05-19 | 高周波トランジスタ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50059470A JPS5840339B2 (ja) | 1975-05-19 | 1975-05-19 | 高周波トランジスタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51135367A true JPS51135367A (en) | 1976-11-24 |
| JPS5840339B2 JPS5840339B2 (ja) | 1983-09-05 |
Family
ID=13114217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50059470A Expired JPS5840339B2 (ja) | 1975-05-19 | 1975-05-19 | 高周波トランジスタ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5840339B2 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6195844A (ja) * | 1984-10-13 | 1986-05-14 | Mazda Motor Corp | 門型マシニングセンタ |
| JPH0247140U (ja) * | 1988-09-26 | 1990-03-30 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4979467A (ja) * | 1972-11-03 | 1974-07-31 |
-
1975
- 1975-05-19 JP JP50059470A patent/JPS5840339B2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4979467A (ja) * | 1972-11-03 | 1974-07-31 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5840339B2 (ja) | 1983-09-05 |
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