Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Mitsubishi Electric CorpfiledCriticalMitsubishi Electric Corp
Priority to JP5195776ApriorityCriticalpatent/JPS52135263A/en
Publication of JPS52135263ApublicationCriticalpatent/JPS52135263A/en
PURPOSE: To improve dicing yield by forming mesa grooves having more than 3 small grooves on one main surface of a wafer, covering the mesa grooves with an insulation film so that the film is thin on the parts other than the small groove parts, cutting on the small groove other than the both ends.
COPYRIGHT: (C)1977,JPO&Japio
JP5195776A1976-05-061976-05-06Production of semiconductor device
PendingJPS52135263A
(en)