JPS5377211A - Sealing structure between ceramics and low expansion metal member - Google Patents

Sealing structure between ceramics and low expansion metal member

Info

Publication number
JPS5377211A
JPS5377211A JP15314676A JP15314676A JPS5377211A JP S5377211 A JPS5377211 A JP S5377211A JP 15314676 A JP15314676 A JP 15314676A JP 15314676 A JP15314676 A JP 15314676A JP S5377211 A JPS5377211 A JP S5377211A
Authority
JP
Japan
Prior art keywords
ceramics
metal member
sealing structure
low expansion
expansion metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15314676A
Other languages
English (en)
Other versions
JPS5843355B2 (ja
Inventor
Akio Takami
Kazuo Kondou
Kazuhisa Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP51153146A priority Critical patent/JPS5843355B2/ja
Priority to US05/862,326 priority patent/US4135038A/en
Publication of JPS5377211A publication Critical patent/JPS5377211A/ja
Publication of JPS5843355B2 publication Critical patent/JPS5843355B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Glass Compositions (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
JP51153146A 1976-12-20 1976-12-20 セラミツクと低膨張性金属部材の封止構造体 Expired JPS5843355B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP51153146A JPS5843355B2 (ja) 1976-12-20 1976-12-20 セラミツクと低膨張性金属部材の封止構造体
US05/862,326 US4135038A (en) 1976-12-20 1977-12-20 Seal structure of ceramics and low expansion metallic material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51153146A JPS5843355B2 (ja) 1976-12-20 1976-12-20 セラミツクと低膨張性金属部材の封止構造体

Publications (2)

Publication Number Publication Date
JPS5377211A true JPS5377211A (en) 1978-07-08
JPS5843355B2 JPS5843355B2 (ja) 1983-09-26

Family

ID=15556011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51153146A Expired JPS5843355B2 (ja) 1976-12-20 1976-12-20 セラミツクと低膨張性金属部材の封止構造体

Country Status (2)

Country Link
US (1) US4135038A (ja)
JP (1) JPS5843355B2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4532179A (en) * 1982-04-10 1985-07-30 Ngk Spark Plug Co., Ltd. Metal-ceramic bonded material

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2519471B1 (fr) * 1981-12-31 1985-06-07 Europ Composants Electron Procede de fabrication d'une embase pour circuit integre et embase ainsi realisee
US4449011A (en) * 1982-01-08 1984-05-15 Critikon, Inc. Method and apparatus for encapsulation of chemically sensitive field effect device
US4436785A (en) 1982-03-08 1984-03-13 Johnson Matthey Inc. Silver-filled glass
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
FR2556503B1 (fr) * 1983-12-08 1986-12-12 Eurofarad Substrat d'interconnexion en alumine pour composant electronique
JPS616347U (ja) * 1984-06-14 1986-01-16 シャープ株式会社 ハンド型掃除機
US4805009A (en) * 1985-03-11 1989-02-14 Olin Corporation Hermetically sealed semiconductor package
DE3587085T2 (de) * 1984-09-19 1993-09-16 Olin Corp Hermetisch verschlossenes halbleitergehaeuse.
US5071712A (en) * 1985-03-22 1991-12-10 Diacon, Inc. Leaded chip carrier
US4651415A (en) * 1985-03-22 1987-03-24 Diacon, Inc. Leaded chip carrier
US4704626A (en) * 1985-07-08 1987-11-03 Olin Corporation Graded sealing systems for semiconductor package
US4729010A (en) * 1985-08-05 1988-03-01 Hitachi, Ltd. Integrated circuit package with low-thermal expansion lead pieces
JPH0634452B2 (ja) * 1985-08-05 1994-05-02 株式会社日立製作所 セラミツクス回路基板
US4816338A (en) * 1986-06-10 1989-03-28 Denki Kagaku Kogyo Kabushiki Kaisha Glassy carbon-coated article
JP2579315B2 (ja) * 1987-06-17 1997-02-05 新光電気工業株式会社 セラミツクパツケ−ジ
US4976765A (en) * 1989-05-15 1990-12-11 Corning Incorporated Method of making glass-ceramic laser gyroscope frame
US5014418A (en) * 1989-07-13 1991-05-14 Gte Products Corporation Method of forming a two piece chip carrier
US5234048A (en) * 1991-01-14 1993-08-10 Ngk Insulators, Ltd. Sealing members for gas preheaters, and sealing structures using such sealing members for gas preheaters
US5773879A (en) * 1992-02-13 1998-06-30 Mitsubishi Denki Kabushiki Kaisha Cu/Mo/Cu clad mounting for high frequency devices
US6426591B1 (en) * 1998-09-28 2002-07-30 Kyocera Corporation Package for housing photosemiconductor element
US6127005A (en) * 1999-01-08 2000-10-03 Rutgers University Method of thermally glazing an article
US7148577B2 (en) * 2003-12-31 2006-12-12 Intel Corporation Materials for electronic devices
CN117383821A (zh) * 2023-04-06 2024-01-12 胡仲春 一种玻璃基光纤光栅传感器用无机封装制剂及其制备方法
CN117682767A (zh) * 2023-11-20 2024-03-12 中国建筑材料科学研究总院有限公司 封接浆料及其制备方法，复合陶瓷基板及其制备方法
CN119191714A (zh) * 2024-10-29 2024-12-27 西安稀有金属材料研究院有限公司 封接玻璃及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2458748A (en) * 1945-05-01 1949-01-11 Stupakoff Ceramic & Mfg Compan Hermetic seal for electric terminals and the like
NL250600A (ja) * 1960-04-14
US3250631A (en) * 1962-12-26 1966-05-10 Owens Illinois Company Glass sealing compositions and method for modifying same
US3258350A (en) * 1965-02-12 1966-06-28 Corning Glass Works Fusion seals and their production
US3404027A (en) * 1965-06-01 1968-10-01 Hercules Inc Satin finish vitrifiable enamels
US3503763A (en) * 1966-12-06 1970-03-31 Anchor Hocking Glass Corp Creptallizable lead borosilicate compositions for use as low thermal expansion,devitrifying solder glasses or coatings
US3676204A (en) * 1967-03-22 1972-07-11 Scm Corp Composition and process for glazing ceramic ware
US3561984A (en) * 1967-03-22 1971-02-09 Scm Corp Composition for glazing ceramic ware
US3846222A (en) * 1970-06-05 1974-11-05 Owens Illinois Inc Multilayer dielectric
US3804666A (en) * 1971-12-13 1974-04-16 Scm Corp Glazed ceramic ware
US3922471A (en) * 1972-06-19 1975-11-25 Owens Illinois Inc Surface having sealing glass composition thereon
US4002799A (en) * 1973-11-23 1977-01-11 Technology Glass Corporation Glass sealed products

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4532179A (en) * 1982-04-10 1985-07-30 Ngk Spark Plug Co., Ltd. Metal-ceramic bonded material

Also Published As

Publication number Publication date
US4135038A (en) 1979-01-16
JPS5843355B2 (ja) 1983-09-26

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