JPS54100955A - Solder equipment - Google Patents

Solder equipment

Info

Publication number
JPS54100955A
JPS54100955A JP731878A JP731878A JPS54100955A JP S54100955 A JPS54100955 A JP S54100955A JP 731878 A JP731878 A JP 731878A JP 731878 A JP731878 A JP 731878A JP S54100955 A JPS54100955 A JP S54100955A
Authority
JP
Japan
Prior art keywords
solder
bath
flow
soldered
dipping bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP731878A
Other languages
Japanese (ja)
Other versions
JPS5626514B2 (en
Inventor
Chikao Yamane
Hidekazu Yamagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP731878A priority Critical patent/JPS54100955A/en
Publication of JPS54100955A publication Critical patent/JPS54100955A/en
Publication of JPS5626514B2 publication Critical patent/JPS5626514B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:In soldering of print wire board, a single solder bath is provided with a flow bath and a dipping bath, thereby providing uniformly soldered parts, avoiding incomplete solder caused by gas or air presence. CONSTITUTION:A solder flow generator 16 contains an inner tank 17 in which solder is melted and jetted from a nozzle 15 to flow through a partition 25 into a dipping bath 13. Solder on the surface of the dipping bath 13 flows into an oxide receiver 26 and passes through the bottom of soldering bath 11 to be circulated back the solder flow generator 16. The partition 25 serves to maintain the solder surface of the dipping bath by restricting solder flow. Printed wire boards mounted with electric parts are introduced onto a flow bath 12 to be jet soldered and then soldered again in the dipping bath 13. This two-process soldering eliminates incomplete solder caused by gas or air trapping and provides uniformly soldered electric parts.
JP731878A 1978-01-27 1978-01-27 Solder equipment Granted JPS54100955A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP731878A JPS54100955A (en) 1978-01-27 1978-01-27 Solder equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP731878A JPS54100955A (en) 1978-01-27 1978-01-27 Solder equipment

Publications (2)

Publication Number Publication Date
JPS54100955A true JPS54100955A (en) 1979-08-09
JPS5626514B2 JPS5626514B2 (en) 1981-06-18

Family

ID=11662629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP731878A Granted JPS54100955A (en) 1978-01-27 1978-01-27 Solder equipment

Country Status (1)

Country Link
JP (1) JPS54100955A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5770759U (en) * 1980-10-14 1982-04-28
JPS57211797A (en) * 1981-06-24 1982-12-25 Tamura Seisakusho Kk Automatic soldering device
EP2413677A4 (en) * 2009-03-24 2012-09-05 Senju Metal Industry Co LOCALIZED JET BRAZING DEVICE AND METHOD OF PARTIAL JET BRAZING
US11235406B2 (en) * 2019-01-24 2022-02-01 Hefei Jee Power Systems Co., Ltd. High-efficiency soldering apparatus for winding head of flat-wire motor and soldering process

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5770759U (en) * 1980-10-14 1982-04-28
JPS57211797A (en) * 1981-06-24 1982-12-25 Tamura Seisakusho Kk Automatic soldering device
EP2413677A4 (en) * 2009-03-24 2012-09-05 Senju Metal Industry Co LOCALIZED JET BRAZING DEVICE AND METHOD OF PARTIAL JET BRAZING
US8403199B2 (en) 2009-03-24 2013-03-26 Senju Metal Industry Co., Ltd. Localized jet soldering device and partial jet soldering method
US11235406B2 (en) * 2019-01-24 2022-02-01 Hefei Jee Power Systems Co., Ltd. High-efficiency soldering apparatus for winding head of flat-wire motor and soldering process

Also Published As

Publication number Publication date
JPS5626514B2 (en) 1981-06-18

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