JPS54568A - Semiconductor element - Google Patents

Semiconductor element

Info

Publication number
JPS54568A
JPS54568A JP6472077A JP6472077A JPS54568A JP S54568 A JPS54568 A JP S54568A JP 6472077 A JP6472077 A JP 6472077A JP 6472077 A JP6472077 A JP 6472077A JP S54568 A JPS54568 A JP S54568A
Authority
JP
Japan
Prior art keywords
semiconductor element
evolved
posts
damaging
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6472077A
Other languages
English (en)
Other versions
JPS603776B2 (ja
Inventor
Keiichi Kuniya
Hideo Arakawa
Kunihiro Maeda
Keiichi Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP52064720A priority Critical patent/JPS603776B2/ja
Priority to GB25541/78A priority patent/GB1602478A/en
Priority to US05/911,078 priority patent/US4196442A/en
Priority to NL7805992A priority patent/NL7805992A/xx
Priority to DE2824250A priority patent/DE2824250C2/de
Publication of JPS54568A publication Critical patent/JPS54568A/ja
Publication of JPS603776B2 publication Critical patent/JPS603776B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
    • H10W70/28—Carbon-containing materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
JP52064720A 1977-06-03 1977-06-03 半導体素子 Expired JPS603776B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP52064720A JPS603776B2 (ja) 1977-06-03 1977-06-03 半導体素子
GB25541/78A GB1602478A (en) 1977-06-03 1978-05-31 Semiconductor device
US05/911,078 US4196442A (en) 1977-06-03 1978-05-31 Semiconductor device
NL7805992A NL7805992A (nl) 1977-06-03 1978-06-01 Halfgeleiderinrichting.
DE2824250A DE2824250C2 (de) 1977-06-03 1978-06-02 Trägerelektrode eines Halbleiterbauelements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52064720A JPS603776B2 (ja) 1977-06-03 1977-06-03 半導体素子

Publications (2)

Publication Number Publication Date
JPS54568A true JPS54568A (en) 1979-01-05
JPS603776B2 JPS603776B2 (ja) 1985-01-30

Family

ID=13266261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52064720A Expired JPS603776B2 (ja) 1977-06-03 1977-06-03 半導体素子

Country Status (5)

Country Link
US (1) US4196442A (ja)
JP (1) JPS603776B2 (ja)
DE (1) DE2824250C2 (ja)
GB (1) GB1602478A (ja)
NL (1) NL7805992A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128554A (en) * 1979-03-29 1980-10-04 Hitachi Ltd Fiber combined material and producing the same

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5550646A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Integrated circuit device
JPS5816616B2 (ja) * 1978-12-01 1983-04-01 株式会社日立製作所 半導体装置
JPS55160437A (en) * 1979-05-31 1980-12-13 Hitachi Ltd Semiconductor device
DE2937049A1 (de) * 1979-09-13 1981-04-02 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungs-halbleiterbauelement
JPS56142645A (en) * 1980-04-07 1981-11-07 Hitachi Ltd Semiconductor device
JPS5759453U (ja) * 1980-09-24 1982-04-08
JPS5787139A (en) * 1980-11-19 1982-05-31 Hitachi Ltd Semiconductor device
JPS5921032A (ja) * 1982-07-26 1984-02-02 Sumitomo Electric Ind Ltd 半導体装置用基板
US4737217A (en) * 1985-09-30 1988-04-12 General Electric Company Method of fabricating a substrate for a semiconductor chip package
EP0224141A3 (en) * 1985-11-21 1989-06-14 General Electric Company Improved semiconductor power devices
CA1316303C (en) * 1988-12-23 1993-04-20 Thijs Eerkes Composite structure
US5151777A (en) * 1989-03-03 1992-09-29 Delco Electronics Corporation Interface device for thermally coupling an integrated circuit to a heat sink
DE59407080D1 (de) * 1993-08-09 1998-11-19 Siemens Ag Leistungs-Halbleiterbauelement mit Druckkontakt
US5834374A (en) * 1994-09-30 1998-11-10 International Business Machines Corporation Method for controlling tensile and compressive stresses and mechanical problems in thin films on substrates
DE19605302A1 (de) * 1996-02-14 1997-08-21 Fraunhofer Ges Forschung Kühlkörper mit einer Montagefläche für ein elektronisches Bauteil
US5686676A (en) * 1996-05-07 1997-11-11 Brush Wellman Inc. Process for making improved copper/tungsten composites
US6016007A (en) * 1998-10-16 2000-01-18 Northrop Grumman Corp. Power electronics cooling apparatus
US6703707B1 (en) * 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
EP1403923A1 (en) * 2002-09-27 2004-03-31 Abb Research Ltd. Press pack power semiconductor module
DE102006043163B4 (de) 2006-09-14 2016-03-31 Infineon Technologies Ag Halbleiterschaltungsanordnungen
EP2447988B1 (en) 2010-11-02 2015-05-06 GE Energy Power Conversion Technology Limited Power electronic device with edge passivation
JP2014183256A (ja) * 2013-03-21 2014-09-29 Denso Corp 接合体およびこれを用いた半導体装置、ならびにそれらの製造方法
CN106783787B (zh) * 2017-01-24 2025-04-04 深圳市槟城电子股份有限公司 用于芯片封装的电极以及使用该电极的芯片封装结构

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5116302B2 (ja) * 1973-10-22 1976-05-22
US3889286A (en) * 1973-12-26 1975-06-10 Gen Electric Transparent multiple contact for semiconductor light conversion elements

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128554A (en) * 1979-03-29 1980-10-04 Hitachi Ltd Fiber combined material and producing the same

Also Published As

Publication number Publication date
DE2824250A1 (de) 1978-12-07
NL7805992A (nl) 1978-12-05
JPS603776B2 (ja) 1985-01-30
DE2824250C2 (de) 1982-11-04
US4196442A (en) 1980-04-01
GB1602478A (en) 1981-11-11

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