JPS5460562A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5460562A
JPS5460562A JP12692877A JP12692877A JPS5460562A JP S5460562 A JPS5460562 A JP S5460562A JP 12692877 A JP12692877 A JP 12692877A JP 12692877 A JP12692877 A JP 12692877A JP S5460562 A JPS5460562 A JP S5460562A
Authority
JP
Japan
Prior art keywords
hole
sucking
groove
adhesive
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12692877A
Other languages
Japanese (ja)
Inventor
Masanobu Obara
Shuichi Osaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12692877A priority Critical patent/JPS5460562A/en
Publication of JPS5460562A publication Critical patent/JPS5460562A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To ensure satisfactory adhesion for the semiconductor device by providing the sucking hole piercing through the both surfacs of the chip mounting face at the center puls the groove or slit radially on the surface and centering on the sucking hole.
CONSTITUTION: Sucking hole 5 is provided at the center of the chip mounting surface of case/circuit plate 3 along with groove 8 provided on the surface and centering on hole 6. When chip 1 is adhered to plate 3 via adhesive 2, the sucking pipe is sticked to the surface of hole 6 to give sucking. Thus, extra adhesive 10 can be sucked into hole 6 directly or through groove 8, ensuring the uniform adhesion over a wide area without noticing the amount of the adhesive
COPYRIGHT: (C)1979,JPO&Japio
JP12692877A 1977-10-21 1977-10-21 Manufacture of semiconductor device Pending JPS5460562A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12692877A JPS5460562A (en) 1977-10-21 1977-10-21 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12692877A JPS5460562A (en) 1977-10-21 1977-10-21 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5460562A true JPS5460562A (en) 1979-05-16

Family

ID=14947358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12692877A Pending JPS5460562A (en) 1977-10-21 1977-10-21 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5460562A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6279637A (en) * 1985-10-03 1987-04-13 Mitsubishi Electric Corp Semiconductor integrated circuit device
JP2019186431A (en) * 2018-04-12 2019-10-24 新電元工業株式会社 Semiconductor device and manufacturing method of the semiconductor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5012287U (en) * 1973-05-29 1975-02-07
JPS5015481A (en) * 1973-06-08 1975-02-18
JPS5044043U (en) * 1973-08-16 1975-05-02
JPS51142978A (en) * 1975-06-04 1976-12-08 Seiko Instr & Electronics Ltd Mounting method of circuit elements

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5012287U (en) * 1973-05-29 1975-02-07
JPS5015481A (en) * 1973-06-08 1975-02-18
JPS5044043U (en) * 1973-08-16 1975-05-02
JPS51142978A (en) * 1975-06-04 1976-12-08 Seiko Instr & Electronics Ltd Mounting method of circuit elements

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6279637A (en) * 1985-10-03 1987-04-13 Mitsubishi Electric Corp Semiconductor integrated circuit device
JP2019186431A (en) * 2018-04-12 2019-10-24 新電元工業株式会社 Semiconductor device and manufacturing method of the semiconductor device

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