JPS5516054A - Heat-resistant coating composition - Google Patents
Heat-resistant coating compositionInfo
- Publication number
- JPS5516054A JPS5516054A JP8939178A JP8939178A JPS5516054A JP S5516054 A JPS5516054 A JP S5516054A JP 8939178 A JP8939178 A JP 8939178A JP 8939178 A JP8939178 A JP 8939178A JP S5516054 A JPS5516054 A JP S5516054A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- solvent
- heat
- amount
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008199 coating composition Substances 0.000 title abstract 2
- 239000002904 solvent Substances 0.000 abstract 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 abstract 3
- 239000003822 epoxy resin Substances 0.000 abstract 3
- 229920000647 polyepoxide Polymers 0.000 abstract 3
- 125000003118 aryl group Chemical group 0.000 abstract 2
- 239000002798 polar solvent Substances 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 abstract 1
- 239000004962 Polyamide-imide Substances 0.000 abstract 1
- 239000004760 aramid Substances 0.000 abstract 1
- 229920003235 aromatic polyamide Polymers 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229920005575 poly(amic acid) Polymers 0.000 abstract 1
- 229920002312 polyamide-imide Polymers 0.000 abstract 1
Landscapes
- Paints Or Removers (AREA)
Abstract
PURPOSE: A coating composition having improved heat resistance and adhesiveness, comprising a heat-resistant polymer soluble in organic polar solvents, an epoxy resin, and a solvent.
CONSTITUTION: A composition comprising (A) 100 parts by wt. of a heat-resistant polymer selected from an aromatic polyamide, an aromatic polyamide-imide, and an aromatic polyamic acid, soluble in organic polar solvents, (B) 2W100 parts by wt., preferably 5W60 parts by wt., of an epoxy resin having two or more epoxy groups in the molecule, and (C) 100W10,000 parts by wt. of a solvent. If the amount of the epoxy resin is less than 2 parts by wt., its effect cannot be produced. If the amount is more than 100 parts by wt., the heat resistance is degraded. If the amount of the solvent is less than 100 parts by wt., the uniformity of the film is lowened. If the amount is more than 10,000 parts by wt., pinholes tend to form in the film. Dimethylformamide, N-methylpyrrolidone, etc. may be cited as the solvent.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8939178A JPS5516054A (en) | 1978-07-24 | 1978-07-24 | Heat-resistant coating composition |
| US06/010,290 US4377652A (en) | 1978-02-17 | 1979-02-08 | Polyamide-imide compositions and articles for electrical use prepared therefrom |
| GB7904632A GB2016487B (en) | 1978-02-17 | 1979-02-09 | Articles for electrical use and compositions useful therefor |
| DE2905857A DE2905857C2 (en) | 1978-02-17 | 1979-02-15 | Polyamide-imide compositions with granular materials and use of such compositions for electrical components, circuit boards and insulating substrates |
| NLAANVRAGE7901256,A NL181739C (en) | 1978-02-17 | 1979-02-16 | COMPOSITION BASED ON AN AROMATIC POLYAMIDE IMIDE. |
| CA321,623A CA1123981A (en) | 1978-02-17 | 1979-02-16 | Soluble aromatic polyamide-imide compositions for electrical use |
| CA000384856A CA1143084A (en) | 1978-02-17 | 1981-08-28 | Soluble aromatic polyamide-imide compositions for electrical use |
| GB08210337A GB2104084B (en) | 1978-04-28 | 1982-04-07 | Polyamide-imide compositions for imparting electrical properties and articles produced using the compositions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8939178A JPS5516054A (en) | 1978-07-24 | 1978-07-24 | Heat-resistant coating composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5516054A true JPS5516054A (en) | 1980-02-04 |
Family
ID=13969350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8939178A Pending JPS5516054A (en) | 1978-02-17 | 1978-07-24 | Heat-resistant coating composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5516054A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6049635A (en) * | 1983-08-29 | 1985-03-18 | Sumitomo Bakelite Co Ltd | Mounting method of chip |
| JPH05339522A (en) * | 1992-06-05 | 1993-12-21 | Hitachi Cable Ltd | Rapidly curable insulating varnish and insulated wire |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4927097A (en) * | 1972-07-06 | 1974-03-11 | ||
| JPS5173034A (en) * | 1974-07-30 | 1976-06-24 | Toray Industries | TAINETSUSEISETSUCHAKUZAISOSEIBUTSU |
| JPS5382899A (en) * | 1976-12-28 | 1978-07-21 | Mitsubishi Electric Corp | Heat resistant resin composition |
-
1978
- 1978-07-24 JP JP8939178A patent/JPS5516054A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4927097A (en) * | 1972-07-06 | 1974-03-11 | ||
| JPS5173034A (en) * | 1974-07-30 | 1976-06-24 | Toray Industries | TAINETSUSEISETSUCHAKUZAISOSEIBUTSU |
| JPS5382899A (en) * | 1976-12-28 | 1978-07-21 | Mitsubishi Electric Corp | Heat resistant resin composition |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6049635A (en) * | 1983-08-29 | 1985-03-18 | Sumitomo Bakelite Co Ltd | Mounting method of chip |
| JPH05339522A (en) * | 1992-06-05 | 1993-12-21 | Hitachi Cable Ltd | Rapidly curable insulating varnish and insulated wire |
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