JPS5529146A - Auto die bonder - Google Patents

Auto die bonder

Info

Publication number
JPS5529146A
JPS5529146A JP10233578A JP10233578A JPS5529146A JP S5529146 A JPS5529146 A JP S5529146A JP 10233578 A JP10233578 A JP 10233578A JP 10233578 A JP10233578 A JP 10233578A JP S5529146 A JPS5529146 A JP S5529146A
Authority
JP
Japan
Prior art keywords
lead frame
joint
cut
die
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10233578A
Other languages
Japanese (ja)
Other versions
JPS5933974B2 (en
Inventor
Kyohei Tamaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10233578A priority Critical patent/JPS5933974B2/en
Publication of JPS5529146A publication Critical patent/JPS5529146A/en
Publication of JPS5933974B2 publication Critical patent/JPS5933974B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To conduct dies bonding (or joining) operation automatically by utilizing a lead frame, which is formed adjoining a continuously long hoop material, and providing a breaking-conveying-ejecting machanism.
CONSTITUTION: A continuously long lead frame of die bonding agent is cut to the preset series numbers N by a cutting mechanism 10. As joints of the lead frame can cause obstruction to package with resin, etc., the cutting position is electrically controlled, and at the same time, careful arrangement is made so that a metal strip (or adhesive) and a die are not attached onto the lead frame of the scheduled position to be cut included in the joints. For instance, when an independent lead frame length of Q,n1 W n3 is integrated, it is controlled to become (n1+n2+n3)÷=Q, and when Q is not an integer, a length of a section including a joint is set to PN but if Q is an integer, a joint comes to a cutting position, and therefore, it is avoided by using P(N+1). By taking such a procedure, a joint is detected 12 for selection of position for cutting 10, a long lead provided with a metal strip 42 and a die 43 is cut and conveyed 11, a cut lead frame containing a joint is ejected.
COPYRIGHT: (C)1980,JPO&Japio
JP10233578A 1978-08-24 1978-08-24 auto die bonder Expired JPS5933974B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10233578A JPS5933974B2 (en) 1978-08-24 1978-08-24 auto die bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10233578A JPS5933974B2 (en) 1978-08-24 1978-08-24 auto die bonder

Publications (2)

Publication Number Publication Date
JPS5529146A true JPS5529146A (en) 1980-03-01
JPS5933974B2 JPS5933974B2 (en) 1984-08-20

Family

ID=14324635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10233578A Expired JPS5933974B2 (en) 1978-08-24 1978-08-24 auto die bonder

Country Status (1)

Country Link
JP (1) JPS5933974B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3737314A1 (en) * 1986-11-10 1988-05-19 Nippon Yakin Kogyo Co Ltd EXTERNAL PROTECTIVE COVER MADE OF AUSTENITIC, STAINLESS STEEL FOR A HEATING DEVICE WITH A COVERED HEATING ELEMENT
JPH01199437A (en) * 1988-02-04 1989-08-10 Sanyo Electric Co Ltd Semiconductor manufacturing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3737314A1 (en) * 1986-11-10 1988-05-19 Nippon Yakin Kogyo Co Ltd EXTERNAL PROTECTIVE COVER MADE OF AUSTENITIC, STAINLESS STEEL FOR A HEATING DEVICE WITH A COVERED HEATING ELEMENT
JPH01199437A (en) * 1988-02-04 1989-08-10 Sanyo Electric Co Ltd Semiconductor manufacturing device

Also Published As

Publication number Publication date
JPS5933974B2 (en) 1984-08-20

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