JPS5529170A - Both-side exposing apparatus for semiconductor wafer - Google Patents

Both-side exposing apparatus for semiconductor wafer

Info

Publication number
JPS5529170A
JPS5529170A JP10306578A JP10306578A JPS5529170A JP S5529170 A JPS5529170 A JP S5529170A JP 10306578 A JP10306578 A JP 10306578A JP 10306578 A JP10306578 A JP 10306578A JP S5529170 A JPS5529170 A JP S5529170A
Authority
JP
Japan
Prior art keywords
masks
wafer
vertical
space
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10306578A
Other languages
Japanese (ja)
Inventor
Seiji Imanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10306578A priority Critical patent/JPS5529170A/en
Publication of JPS5529170A publication Critical patent/JPS5529170A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To reduce the amout of dust adhering on the photosensitive emulsion coated on the surface of a wafer by disposing the first and second masks comprising the exposing apparatus in vertical and with a space from each other and then inserting the semiconductor wafer between these two masks in vertical too.
CONSTITUTION: First and second masks 1 and 2 held on mask holders 3 and 4 respectively, are disposed in vertical and with a predetermined space from each other, and further first and second lamps 5 and 6 are placed at each outerside of the mask holders. Next, a slide block 10 loading an alignment plate to line up semiconductor wafers 13 along either side of the holders 3 and 4 is provided. Between the block 10 and the masks 1 and 2 mounted is a rail 14 for sliding each wafer 13. In this arrangement, each wafer 13 coated with photosensitive emulsion on both sides is pushed out on the rail 14 in turn and then moved into the space between the masks 1 and 2 by means of feeding claws 18 and 19 held on a fixed cam plate 24.
COPYRIGHT: (C)1980,JPO&Japio
JP10306578A 1978-08-23 1978-08-23 Both-side exposing apparatus for semiconductor wafer Pending JPS5529170A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10306578A JPS5529170A (en) 1978-08-23 1978-08-23 Both-side exposing apparatus for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10306578A JPS5529170A (en) 1978-08-23 1978-08-23 Both-side exposing apparatus for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5529170A true JPS5529170A (en) 1980-03-01

Family

ID=14344259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10306578A Pending JPS5529170A (en) 1978-08-23 1978-08-23 Both-side exposing apparatus for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5529170A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60214530A (en) * 1984-04-10 1985-10-26 Matsushita Electric Ind Co Ltd Double exposure method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60214530A (en) * 1984-04-10 1985-10-26 Matsushita Electric Ind Co Ltd Double exposure method

Similar Documents

Publication Publication Date Title
GB2099270B (en) Apparatus for baking resist on semiconductor wafers
DE3379297D1 (en) Substrate for semiconductor apparatus
JPS5264872A (en) Apparatus for holding semiconductor wafers
DE3071324D1 (en) Apparatus for prealignment of a wafer
DE3278840D1 (en) Apparatus for aligning a wafer
GB2039030B (en) Alignment device for semiconductor masks and wafers
FR2524201B1 (en) METHOD FOR MANUFACTURING A MULTILAYER TYPE SEMICONDUCTOR DEVICE
JPS52117564A (en) Device for treating computerrcontrolled semiconductor wafer
GB8311831D0 (en) Apparatus for heat treating semiconductor wafer
JPS55129333A (en) Scale-down projection aligner and mask used for this
DE3270064D1 (en) Electron beam pattern transfer device and method for aligning mask and semiconductor wafer
GB2133974B (en) Apparatus for conditioning wafers
JPS5447581A (en) Mask aligner
GB2007495B (en) Carrier for semiconductor wafers
JPS5210069A (en) Automatic apparatus for cleaning and drying wafer
JPS5529170A (en) Both-side exposing apparatus for semiconductor wafer
JPS5617019A (en) Method and apparatus for exposing semiconductor wafer
JPS5651732A (en) Exposure processing method
JPS57202037A (en) Pallet for shadow mask removing device
JPS5439576A (en) Inspection method for semiconductor device
JPS5390871A (en) Device for chucking semiconductor wafer
JPS554982A (en) Semiconductor device manufacturing method using automatic exposure capable of fitting pattern
JPS5391670A (en) Transfer method for semiconductor wafer
JPS52150975A (en) X-ray transfer apparatus
GB2124197B (en) Device for replenishing an incomplete stack