JPS5578537A - Gang bonding pressure welding tool - Google Patents

Gang bonding pressure welding tool

Info

Publication number
JPS5578537A
JPS5578537A JP15252678A JP15252678A JPS5578537A JP S5578537 A JPS5578537 A JP S5578537A JP 15252678 A JP15252678 A JP 15252678A JP 15252678 A JP15252678 A JP 15252678A JP S5578537 A JPS5578537 A JP S5578537A
Authority
JP
Japan
Prior art keywords
pressure
pressurizing unit
gas
unevenness
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15252678A
Other languages
Japanese (ja)
Other versions
JPS6142859B2 (en
Inventor
Toshihiko Tsuge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP15252678A priority Critical patent/JPS5578537A/en
Publication of JPS5578537A publication Critical patent/JPS5578537A/en
Publication of JPS6142859B2 publication Critical patent/JPS6142859B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To apply uniform pressure to each lead in accordance with an unevenness of the position, terminals are to be pressurized thereat by transmitting pressure to an pressurizing unit composed of elastic body through gas or fluid having pressure which is contained in a support.
CONSTITUTION: An elastic pressurizing unit 2 is mounted inside the bottom of a cavity 3 of a rigid body 1. The cavity 3 contains a heated gas or liquid 4, and pressure is transmitted to the pressurizing unit 2 therethrough. According to this constitution, the pressure is allowed to work through gas or liquid 4, therefore leads can be pressurized uniformly, and a necessary heat can be supplied uniformly through gas or liquid 4 at the same time. Further, an unevenness of leads 6 according to that of pattern 7 and an unevenness of a substrate 8 are absorbed by an elastic film of the pressurizing unit 2 to a pressurization of the leads 6.
COPYRIGHT: (C)1980,JPO&Japio
JP15252678A 1978-12-08 1978-12-08 Gang bonding pressure welding tool Granted JPS5578537A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15252678A JPS5578537A (en) 1978-12-08 1978-12-08 Gang bonding pressure welding tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15252678A JPS5578537A (en) 1978-12-08 1978-12-08 Gang bonding pressure welding tool

Publications (2)

Publication Number Publication Date
JPS5578537A true JPS5578537A (en) 1980-06-13
JPS6142859B2 JPS6142859B2 (en) 1986-09-24

Family

ID=15542354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15252678A Granted JPS5578537A (en) 1978-12-08 1978-12-08 Gang bonding pressure welding tool

Country Status (1)

Country Link
JP (1) JPS5578537A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831546A (en) * 1981-08-18 1983-02-24 Nec Corp Manufacture of semiconductor device
JPH05211208A (en) * 1992-01-23 1993-08-20 Nec Corp Bonding device
JP2001230528A (en) * 2000-02-15 2001-08-24 Sony Corp Mounting device and mounting method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01233795A (en) * 1988-03-15 1989-09-19 Mitsubishi Electric Corp Hybrid integrated circuit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831546A (en) * 1981-08-18 1983-02-24 Nec Corp Manufacture of semiconductor device
JPH05211208A (en) * 1992-01-23 1993-08-20 Nec Corp Bonding device
JP2001230528A (en) * 2000-02-15 2001-08-24 Sony Corp Mounting device and mounting method

Also Published As

Publication number Publication date
JPS6142859B2 (en) 1986-09-24

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