JPS5630791A - Multilayer printed board - Google Patents

Multilayer printed board

Info

Publication number: JPS5630791A
Authority: JP; Japan
Prior art keywords: printed board; multilayer printed; multilayer; board; printed
Prior art date: 1979-08-22
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP10595279A

Other languages

English (en)

Other versions

JPS5828759B2 (ja

Inventor

Keiji Kurosawa

Kiyoshi Takagi

Yuukichi Takeda

Katsuhiko Shirai

Kiyotaka Miyagawa

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Fujitsu Ltd

Original Assignee

Fujitsu Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1979-08-22

Filing date

1979-08-22

Publication date

1981-03-27

1979-08-22 Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd

1979-08-22 Priority to JP54105952A priority Critical patent/JPS5828759B2/ja

1981-03-27 Publication of JPS5630791A publication Critical patent/JPS5630791A/ja

1983-06-17 Publication of JPS5828759B2 publication Critical patent/JPS5828759B2/ja

Status Expired legal-status Critical Current

Links

Landscapes

Insulated Metal Substrates For Printed Circuits (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)

JP54105952A 1979-08-22 1979-08-22 多層プリント板 Expired JPS5828759B2 (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP54105952A JPS5828759B2 (ja)	1979-08-22	1979-08-22	多層プリント板

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP54105952A JPS5828759B2 (ja)	1979-08-22	1979-08-22	多層プリント板

Publications (2)

Publication Number	Publication Date
JPS5630791A true JPS5630791A (en)	1981-03-27
JPS5828759B2 JPS5828759B2 (ja)	1983-06-17

Family

ID=14421158

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP54105952A Expired JPS5828759B2 (ja)	1979-08-22	1979-08-22	多層プリント板

Country Status (1)

Country	Link
JP (1)	JPS5828759B2 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH02288396A (ja) *	1989-04-17	1990-11-28	Internatl Business Mach Corp <Ibm>	多層回路カード構造
JP2006269701A (ja) *	2005-03-24	2006-10-05	Canon Inc	配線シートとその製造方法、及び該シートを用いた配線基板
JP2010272836A (ja) *	2009-05-21	2010-12-02	Samsung Electro-Mechanics Co Ltd	放熱基板およびその製造方法
JP2013127122A (ja) *	2010-12-24	2013-06-27	Samsung Electro-Mechanics Co Ltd	電着塗装を用いる高放熱基板及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS51106052A (ja) *	1975-02-04	1976-09-20	Takatsugu Komatsu	Insatsuhaisenkibannoseizohoho
JPS5427358U (ja) *	1977-07-28	1979-02-22

1979
- 1979-08-22 JP JP54105952A patent/JPS5828759B2/ja not_active Expired

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS51106052A (ja) *	1975-02-04	1976-09-20	Takatsugu Komatsu	Insatsuhaisenkibannoseizohoho
JPS5427358U (ja) *	1977-07-28	1979-02-22

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH02288396A (ja) *	1989-04-17	1990-11-28	Internatl Business Mach Corp <Ibm>	多層回路カード構造
JP2006269701A (ja) *	2005-03-24	2006-10-05	Canon Inc	配線シートとその製造方法、及び該シートを用いた配線基板
JP2010272836A (ja) *	2009-05-21	2010-12-02	Samsung Electro-Mechanics Co Ltd	放熱基板およびその製造方法
JP2013127122A (ja) *	2010-12-24	2013-06-27	Samsung Electro-Mechanics Co Ltd	電着塗装を用いる高放熱基板及びその製造方法

Also Published As

Publication number	Publication date
JPS5828759B2 (ja)	1983-06-17

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