JPS5644790A - Preparation of contact - Google Patents

Preparation of contact

Info

Publication number
JPS5644790A
JPS5644790A JP12118979A JP12118979A JPS5644790A JP S5644790 A JPS5644790 A JP S5644790A JP 12118979 A JP12118979 A JP 12118979A JP 12118979 A JP12118979 A JP 12118979A JP S5644790 A JPS5644790 A JP S5644790A
Authority
JP
Japan
Prior art keywords
plated layer
layer deposited
conditions
gold plated
preparation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12118979A
Other languages
Japanese (ja)
Other versions
JPS5752435B2 (en
Inventor
Tomio Taniguchi
Katsuhiko Nishida
Noboru Eguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP12118979A priority Critical patent/JPS5644790A/en
Publication of JPS5644790A publication Critical patent/JPS5644790A/en
Publication of JPS5752435B2 publication Critical patent/JPS5752435B2/ja
Granted legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)
  • Contacts (AREA)

Abstract

PURPOSE: To decrease the number of pin hole and to improve the corrosion resistance, by forming gold plated layer deposited from Au3+, on the whole plated layer deposited from Au+.
CONSTITUTION: Gold plated layer deposited from Au+, is formed by the normal method, for example, by using K[Au(CN)2] bath. Next, in order to form the gold plated layer deposited from Au3+, conditions of pH, temperature etc., are set by using said plating bath so as to deposit Au3+. For example, the conditions are set at 5W6pH, 30W40°C temperature, 0.5A/dm2 current density. Thickness of the Au+ plated layer is 0.5W5μ and that of the Au3+ plated layer is 0.1W1μ.
COPYRIGHT: (C)1981,JPO&Japio
JP12118979A 1979-09-19 1979-09-19 Preparation of contact Granted JPS5644790A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12118979A JPS5644790A (en) 1979-09-19 1979-09-19 Preparation of contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12118979A JPS5644790A (en) 1979-09-19 1979-09-19 Preparation of contact

Publications (2)

Publication Number Publication Date
JPS5644790A true JPS5644790A (en) 1981-04-24
JPS5752435B2 JPS5752435B2 (en) 1982-11-08

Family

ID=14805052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12118979A Granted JPS5644790A (en) 1979-09-19 1979-09-19 Preparation of contact

Country Status (1)

Country Link
JP (1) JPS5644790A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4358350A (en) * 1980-06-10 1982-11-09 Degussa Ag Strongly acid gold alloy bath
JPS59123589U (en) * 1983-02-03 1984-08-20 新東ダストコレクタ株式会社 dust collector
CN102677110A (en) * 2012-04-19 2012-09-19 永保纳米科技(深圳)有限公司 Au-Pd alloy electroplating solution as well as preparation method and electroplating process thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4358350A (en) * 1980-06-10 1982-11-09 Degussa Ag Strongly acid gold alloy bath
JPS59123589U (en) * 1983-02-03 1984-08-20 新東ダストコレクタ株式会社 dust collector
CN102677110A (en) * 2012-04-19 2012-09-19 永保纳米科技(深圳)有限公司 Au-Pd alloy electroplating solution as well as preparation method and electroplating process thereof

Also Published As

Publication number Publication date
JPS5752435B2 (en) 1982-11-08

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