JPS5651835A - Automatic ultrasonic bonder - Google Patents

Automatic ultrasonic bonder

Info

Publication number
JPS5651835A
JPS5651835A JP12919279A JP12919279A JPS5651835A JP S5651835 A JPS5651835 A JP S5651835A JP 12919279 A JP12919279 A JP 12919279A JP 12919279 A JP12919279 A JP 12919279A JP S5651835 A JPS5651835 A JP S5651835A
Authority
JP
Japan
Prior art keywords
wire
tool
bonding
snapping
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12919279A
Other languages
Japanese (ja)
Inventor
Hiroshi Osabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12919279A priority Critical patent/JPS5651835A/en
Publication of JPS5651835A publication Critical patent/JPS5651835A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To automatically detect the snapping of a wire and prevent an IC element from being destroyed by empty bonding by optically detecting the existence of the wire being ultrasonically bonded. CONSTITUTION:A bonding tool 2 moves downwards to ultrasonically bond one end of a wire 1 to the bonding pad of an IC element 6, before moving upwards. Then the case 5 side or the tool 2 side performs a straight-line bonding on only one axis. In this apparatus, a lens 7 having an optical axis 10 is arranged in front of the tool 2. Then, from a lamp 8, light is applied to the wire 1 being drawn out in front of the tool 2 and oscillated by the ultrasonic wave in order to allow the lens 7 to project the magnified image of the wire 1 to an optoelectro transducer. This permits the existance of the wire 1 being bonded to be obtained as an electrical signal, and therefore the snapping of the wire can be automatically detected.
JP12919279A 1979-10-05 1979-10-05 Automatic ultrasonic bonder Pending JPS5651835A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12919279A JPS5651835A (en) 1979-10-05 1979-10-05 Automatic ultrasonic bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12919279A JPS5651835A (en) 1979-10-05 1979-10-05 Automatic ultrasonic bonder

Publications (1)

Publication Number Publication Date
JPS5651835A true JPS5651835A (en) 1981-05-09

Family

ID=15003412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12919279A Pending JPS5651835A (en) 1979-10-05 1979-10-05 Automatic ultrasonic bonder

Country Status (1)

Country Link
JP (1) JPS5651835A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5350106A (en) * 1993-05-07 1994-09-27 Micron Semiconductor, Inc. Semiconductor wire bonding method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5350106A (en) * 1993-05-07 1994-09-27 Micron Semiconductor, Inc. Semiconductor wire bonding method
USRE37396E1 (en) * 1993-05-07 2001-10-02 Micron Technology, Inc. Semiconductor wire bonding method

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