JPS568821A - Formation of photoresist layer - Google Patents
Formation of photoresist layerInfo
- Publication number
- JPS568821A JPS568821A JP8457479A JP8457479A JPS568821A JP S568821 A JPS568821 A JP S568821A JP 8457479 A JP8457479 A JP 8457479A JP 8457479 A JP8457479 A JP 8457479A JP S568821 A JPS568821 A JP S568821A
- Authority
- JP
- Japan
- Prior art keywords
- photoresist layer
- stepwise
- thickness
- entire surface
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To equalize the thickness of a photoresist on the entire surface by exposing, developing a stepwise pattern with mask or the like and removing the photoresist layer at the portion under the stepwise pattern and forming a photoresist layer on the entire surface. CONSTITUTION:A stepwise semiconductor substrate 1 is formed with a positive type photoresist layer 6 by a spinning method or a spraying method. The layer 6 is exposed through the mask or its reversal mask 7 formed upon formation of the stepwise pattern, is developed to remove the photoresist layer 8 at the portion under the stepwise portion but to retain only the photoresist layer 9. Further, a photoresist layer 10 is formed to eliminate the step of the films between the photoresist layer 11 at the portion above the stepwise portion and the photoresist layer 12 at the portion under the stepwise portion to prevent the reduction in the thickness of a photoresist layer 13 at the shoulder portion so as to equalize the thickness of the film on the entire surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8457479A JPS568821A (en) | 1979-07-02 | 1979-07-02 | Formation of photoresist layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8457479A JPS568821A (en) | 1979-07-02 | 1979-07-02 | Formation of photoresist layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS568821A true JPS568821A (en) | 1981-01-29 |
Family
ID=13834436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8457479A Pending JPS568821A (en) | 1979-07-02 | 1979-07-02 | Formation of photoresist layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS568821A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4971896A (en) * | 1987-12-08 | 1990-11-20 | Hitachi, Ltd. | Method for forming thin film pattern and method for fabricating thin film magnetic head using the same |
-
1979
- 1979-07-02 JP JP8457479A patent/JPS568821A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4971896A (en) * | 1987-12-08 | 1990-11-20 | Hitachi, Ltd. | Method for forming thin film pattern and method for fabricating thin film magnetic head using the same |
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