JPS5710954A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5710954A
JPS5710954A JP8631580A JP8631580A JPS5710954A JP S5710954 A JPS5710954 A JP S5710954A JP 8631580 A JP8631580 A JP 8631580A JP 8631580 A JP8631580 A JP 8631580A JP S5710954 A JPS5710954 A JP S5710954A
Authority
JP
Japan
Prior art keywords
leads
semiconductor device
tensile strength
electrode
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8631580A
Other languages
Japanese (ja)
Inventor
Keiji Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8631580A priority Critical patent/JPS5710954A/en
Publication of JPS5710954A publication Critical patent/JPS5710954A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the tensile strength of the leads of a resin sealed type semiconductor device, by forming projections on the leads in the direction peripendicular to the lead frame. CONSTITUTION:Electrode leads 7, 8 and 9 are partially bent in resin 10, in the direction perpendicular to the lead frame surface, to form projecting bent parts 11, 12 and 13. By the formation of said projections, the tensile strength of each electrode lead can be made sufficiently large if the area of the plane part of the electrode lead becomes small.
JP8631580A 1980-06-25 1980-06-25 Semiconductor device Pending JPS5710954A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8631580A JPS5710954A (en) 1980-06-25 1980-06-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8631580A JPS5710954A (en) 1980-06-25 1980-06-25 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5710954A true JPS5710954A (en) 1982-01-20

Family

ID=13883392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8631580A Pending JPS5710954A (en) 1980-06-25 1980-06-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5710954A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59191744U (en) * 1983-06-07 1984-12-19 日本電気ホームエレクトロニクス株式会社 semiconductor equipment
EP0788157A3 (en) * 1996-02-01 2004-02-25 NEC Compound Semiconductor Devices, Ltd. Resin molded package with excellent high frequency characteristics

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59191744U (en) * 1983-06-07 1984-12-19 日本電気ホームエレクトロニクス株式会社 semiconductor equipment
EP0788157A3 (en) * 1996-02-01 2004-02-25 NEC Compound Semiconductor Devices, Ltd. Resin molded package with excellent high frequency characteristics

Similar Documents

Publication Publication Date Title
JPS52116074A (en) Electronic part
JPS5710954A (en) Semiconductor device
JPS5363983A (en) Semiconductor device
JPS5558557A (en) Resin mold type electronic component and lead frame used therefor
JPS564255A (en) Semiconductor device sealed up with resin
JPS6480055A (en) Resin sealed semiconductor device
JPS5326667A (en) Clamp chip of wire bonder
JPS5619646A (en) Resin sealing type semiconductor device
JPS5751928B2 (en)
JPS5391577A (en) Manufacture of semiconductor device of resinsealing type
JPS54124680A (en) Semiconductor device
JPS6449259A (en) Semiconductor device
JPS5762549A (en) Lead frame for resin-sealed semiconductor integrated circuit
JPS5772337A (en) Semiconductor device
JPS51137375A (en) Semi conductor device
JPS52106678A (en) Resin sealed type semiconductor device
JPS6489353A (en) Package ic structure
JPS5683959A (en) Semiconductor device
JPS51134075A (en) Method to manufacture the semiconductor unit
JPS5624961A (en) Lead frame for semiconductor device
JPS5333057A (en) Bump type semiconductor device
JPS5297183A (en) Production of air tight terminal
JPS616557B2 (en)
JPS57114247A (en) Master-slice type semiconductor device
JPS54973A (en) Semiconductor element