JPS572555A - Cooling device for semiconductor element - Google Patents

Cooling device for semiconductor element

Info

Publication number
JPS572555A
JPS572555A JP7586280A JP7586280A JPS572555A JP S572555 A JPS572555 A JP S572555A JP 7586280 A JP7586280 A JP 7586280A JP 7586280 A JP7586280 A JP 7586280A JP S572555 A JPS572555 A JP S572555A
Authority
JP
Japan
Prior art keywords
semiconductor element
insulating spacer
element unit
refrigerant liquid
contacted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7586280A
Other languages
Japanese (ja)
Inventor
Kenji Kijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7586280A priority Critical patent/JPS572555A/en
Publication of JPS572555A publication Critical patent/JPS572555A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To reduce the size and the weight of a sealed container in an immersion type cooling device for a semiconductor device by holding under pressure a semiconductor element unit via an insulating spacer between a pair of confronting side plates in the contained filling refrigerant liquid. CONSTITUTION:A sealed container 1 in which refrigerant liquid CL is filled is connected via an outlet tube 2 and an inlet tube 3 to a refrigerant condenser 4. A semiconductor element unit 12 with which cooling fins 13 are integrally mounted is dipped in the refrigerant liquid, is contacted at one end via the first insulating spacer 14 to a side plate 1A, and is contacted at the other end via the second insulating spacer 15, a leaf spring 10, a pressure contact seat 11, and ball 23 to be threaded into the side plat 1B of the end of a setscrew 22, and the semiconductor element unit is held under pressure at both side plates by the tension of the leaf spring. Thus, a frame for holding the unit can be eliminated, thereby reducing the size and the weight of the container.
JP7586280A 1980-06-05 1980-06-05 Cooling device for semiconductor element Pending JPS572555A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7586280A JPS572555A (en) 1980-06-05 1980-06-05 Cooling device for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7586280A JPS572555A (en) 1980-06-05 1980-06-05 Cooling device for semiconductor element

Publications (1)

Publication Number Publication Date
JPS572555A true JPS572555A (en) 1982-01-07

Family

ID=13588474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7586280A Pending JPS572555A (en) 1980-06-05 1980-06-05 Cooling device for semiconductor element

Country Status (1)

Country Link
JP (1) JPS572555A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988398U (en) * 1982-12-07 1984-06-15 大協株式会社 work barge
JPS60183447U (en) * 1984-05-16 1985-12-05 富士電機株式会社 Boiling cooling device
CN107978574A (en) * 2017-11-17 2018-05-01 英业达科技有限公司 Immersion cooling system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988398U (en) * 1982-12-07 1984-06-15 大協株式会社 work barge
JPS60183447U (en) * 1984-05-16 1985-12-05 富士電機株式会社 Boiling cooling device
CN107978574A (en) * 2017-11-17 2018-05-01 英业达科技有限公司 Immersion cooling system
CN107978574B (en) * 2017-11-17 2020-03-24 英业达科技有限公司 Immersion cooling system

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