JPS5752158A - Composite semiconductor device - Google Patents

Composite semiconductor device

Info

Publication number
JPS5752158A
JPS5752158A JP55127595A JP12759580A JPS5752158A JP S5752158 A JPS5752158 A JP S5752158A JP 55127595 A JP55127595 A JP 55127595A JP 12759580 A JP12759580 A JP 12759580A JP S5752158 A JPS5752158 A JP S5752158A
Authority
JP
Japan
Prior art keywords
pellet
corner
damage
lead
steps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55127595A
Other languages
Japanese (ja)
Inventor
Tadao Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Rectifier Corp Japan Ltd
Original Assignee
International Rectifier Corp Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp Japan Ltd filed Critical International Rectifier Corp Japan Ltd
Priority to JP55127595A priority Critical patent/JPS5752158A/en
Publication of JPS5752158A publication Critical patent/JPS5752158A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the damage of the corner of a pellet at the time of assembling and to reduce the number of steps by connecting a plurality of semiconductor pellets with coating member except both-side metal electrode, disposing it on a lead frame and soldering it. CONSTITUTION:After a plurality of semiconductor pellets 14 are disposed on a substrate, secondary coating material 15, e.g., silicone rubber, epoxy resin, polyimide resin, etc. is filled, thermally cured, thereby forming a coating carrier 16 (17 represents a recess groove for facilitating the cutting) exposed on the metallic electrode on both side surfaces of the pellet, a carrier 16 is interposed between the lead frames, the lead and the metallic electrode are soldered, and the prescribed circuit configuration is formed. In this manner, the step of providing the polarity of the pellet can be eliminated, thereby reducing the number of steps and preventing the damage of the corner or the like of the semiconductor pellet.
JP55127595A 1980-09-12 1980-09-12 Composite semiconductor device Pending JPS5752158A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55127595A JPS5752158A (en) 1980-09-12 1980-09-12 Composite semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55127595A JPS5752158A (en) 1980-09-12 1980-09-12 Composite semiconductor device

Publications (1)

Publication Number Publication Date
JPS5752158A true JPS5752158A (en) 1982-03-27

Family

ID=14963962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55127595A Pending JPS5752158A (en) 1980-09-12 1980-09-12 Composite semiconductor device

Country Status (1)

Country Link
JP (1) JPS5752158A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60183449U (en) * 1984-05-15 1985-12-05 新電元工業株式会社 Bridge type semiconductor device
JPS63273574A (en) * 1987-05-02 1988-11-10 Nagoya Dengenshiya:Kk Resistance welding control device
JPS63278680A (en) * 1987-05-07 1988-11-16 Nagoya Dengenshiya:Kk Resistance welding controller

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60183449U (en) * 1984-05-15 1985-12-05 新電元工業株式会社 Bridge type semiconductor device
JPS63273574A (en) * 1987-05-02 1988-11-10 Nagoya Dengenshiya:Kk Resistance welding control device
JPS63278680A (en) * 1987-05-07 1988-11-16 Nagoya Dengenshiya:Kk Resistance welding controller

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