JPS5758288A - Magnetic bubble memory element - Google Patents
Magnetic bubble memory elementInfo
- Publication number
- JPS5758288A JPS5758288A JP13286680A JP13286680A JPS5758288A JP S5758288 A JPS5758288 A JP S5758288A JP 13286680 A JP13286680 A JP 13286680A JP 13286680 A JP13286680 A JP 13286680A JP S5758288 A JPS5758288 A JP S5758288A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- conductor
- bubble
- spacer
- bonding pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
- H01F41/34—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film in patterns, e.g. by lithography
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
Abstract
PURPOSE:To sharply reduce frequencies of occurrences of disconnection defect in conductor patterns for controlling bubble in memory element manufacturing processes, by forming a separated conductor layer by leaving it on the upper part of the conductor pattern for controlling bubble besides the bonding pad. CONSTITUTION:A spacer 3, a conductor pattern for controlling bubble 4, another spacer 5, a bubble transferring path pattern 6, a protective film 7, and a conductor made bonding pad 8 are successively piled up in layer on the substrate of a magnetic bubble medium 1. When the conductor layer for bonding pad is formed, at least a separated conductor layer 10 is formed by leaving it, besides the pad 8, on the pattern 4 with the spacer 5 and the protective film 7 in between. As the result of this, even when a pin hole 9 exists, it will not happen that the etching liquid enters into the pin hole 9 and corrodes and disconnects the pattern 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13286680A JPS6051190B2 (en) | 1980-09-26 | 1980-09-26 | magnetic bubble memory element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13286680A JPS6051190B2 (en) | 1980-09-26 | 1980-09-26 | magnetic bubble memory element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5758288A true JPS5758288A (en) | 1982-04-07 |
| JPS6051190B2 JPS6051190B2 (en) | 1985-11-12 |
Family
ID=15091370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13286680A Expired JPS6051190B2 (en) | 1980-09-26 | 1980-09-26 | magnetic bubble memory element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6051190B2 (en) |
-
1980
- 1980-09-26 JP JP13286680A patent/JPS6051190B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6051190B2 (en) | 1985-11-12 |
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